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설명 |
패키지 |
재고 |
수량 |
Tolerance | Power (Watts) | Composition | Features | Temperature Coefficient | Operating Temperature | Package / Case | Supplier Device Package | Size / Dimension | Height - Seated (Max) | Number of Terminations | Failure Rate |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bourns Inc. |
RES SMD 0.2 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고3,400 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 0.15 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고3,330 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 0.1 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고7,524 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 0.05 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고4,248 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 0.036 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고7,074 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 0.03 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고4,536 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 0.027 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고6,552 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 0.024 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고3,132 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 0.02 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고8,064 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 0.015 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고8,244 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 0.01 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고2,142 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 0.002 OHM 1% 4W 4026
|
패키지: 4026 |
재고8,550 |
|
±1% | 4W | Metal Element | Current Sense, Moisture Resistant | 50ppm/°C | -55°C ~ 170°C | 4026 | 4026 | 0.397" L x 0.260" W (10.06mm x 6.60mm) | 0.128" (3.24mm) | 4 | - |
||
Bourns Inc. |
RES SMD 0.001 OHM 1% 4W 4026
|
패키지: 4026 |
재고2,664 |
|
±1% | 4W | Metal Element | Current Sense, Moisture Resistant | 50ppm/°C | -55°C ~ 170°C | 4026 | 4026 | 0.397" L x 0.260" W (10.06mm x 6.60mm) | 0.119" (3.01mm) | 4 | - |
||
Bourns Inc. |
RES SMD 0.0005 OHM 1% 5W 4026
|
패키지: 4026 |
재고3,508 |
|
±1% | 5W | Metal Element | Current Sense, Moisture Resistant | 50ppm/°C | -55°C ~ 170°C | 4026 | 4026 | 0.397" L x 0.260" W (10.06mm x 6.60mm) | 0.119" (3.01mm) | 4 | - |
||
Bourns Inc. |
RES SMD 0.15 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고7,092 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Non-Inductive, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 0.2 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고5,868 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Non-Inductive, Pulse Withstanding | ±150ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 8K OHM 5% 2W 4525
|
패키지: 4525 J-Lead |
재고7,956 |
|
±5% | 2W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±20ppm/°C | -55°C ~ 275°C | 4525 J-Lead | - | 0.449" L x 0.252" W (11.40mm x 6.40mm) | 0.197" (5.00mm) | 2 | - |
||
Bourns Inc. |
RES SMD 75 OHM 5% 2W 4525
|
패키지: 4525 J-Lead |
재고6,570 |
|
±5% | 2W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±20ppm/°C | -55°C ~ 275°C | 4525 J-Lead | - | 0.449" L x 0.252" W (11.40mm x 6.40mm) | 0.197" (5.00mm) | 2 | - |
||
Bourns Inc. |
RES SMD 5 OHM 5% 2W 4525
|
패키지: 4525 J-Lead |
재고3,366 |
|
±5% | 2W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±50ppm/°C | -55°C ~ 275°C | 4525 J-Lead | - | 0.449" L x 0.252" W (11.40mm x 6.40mm) | 0.197" (5.00mm) | 2 | - |
||
Bourns Inc. |
RES SMD 5.6K OHM 5% 2W 4525
|
패키지: 4525 J-Lead |
재고2,880 |
|
±5% | 2W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±20ppm/°C | -55°C ~ 275°C | 4525 J-Lead | - | 0.449" L x 0.252" W (11.40mm x 6.40mm) | 0.197" (5.00mm) | 2 | - |
||
Bourns Inc. |
RES SMD 3K OHM 5% 2W 4525
|
패키지: 4525 J-Lead |
재고7,164 |
|
±5% | 2W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±20ppm/°C | -55°C ~ 275°C | 4525 J-Lead | - | 0.449" L x 0.252" W (11.40mm x 6.40mm) | 0.197" (5.00mm) | 2 | - |
||
Bourns Inc. |
RES SMD 1K OHM 5% 2W 4525
|
패키지: 4525 J-Lead |
재고5,274 |
|
±5% | 2W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±20ppm/°C | -55°C ~ 275°C | 4525 J-Lead | - | 0.449" L x 0.252" W (11.40mm x 6.40mm) | 0.197" (5.00mm) | 2 | - |
||
Bourns Inc. |
RES SMD 4.7 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고5,238 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±50ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 3.3 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고8,604 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±50ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 2.2 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고5,238 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±50ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 2 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고4,302 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±50ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 2.7K OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고4,968 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±20ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |
||
Bourns Inc. |
RES SMD 1.8 OHM 5% 1W 2615
|
패키지: 2615 J-Lead |
재고3,150 |
|
±5% | 1W | Wirewound | Current Sense, Moisture Resistant, Pulse Withstanding | ±50ppm/°C | -55°C ~ 275°C | 2615 J-Lead | - | 0.260" L x 0.154" W (6.60mm x 3.90mm) | 0.142" (3.60mm) | 2 | - |