페이지 7 - IC용 소켓, 트랜지스터 - 어댑터 | 커넥터, 상호 연결

부품 번호	제조업체	설명	패키지	재고	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
242-1281-39-0602J	3M	RECEPTACLE DIP SOCKET 42POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	패키지: -	재고5,652	-	-	-	-	-	-	-	-	-	-
52-505-110	Aries Electronics	SOCKET ADAPTER PLCC TO 52PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 52 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고3,096	PGA	52	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
32-450001-11-RC	Aries Electronics	SOCKET ADAPTER SOJ TO 32DIP 0.4 Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고4,752	DIP, 0.4" (10.16mm) Row Spacing	32	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
95-132I25	Aries Electronics	SOCKET ADAPTER QFP TO 132PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 132 Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고8,010	PGA	132	0.025" (0.64mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
14-651000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 14DIP 0.6 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고4,050	DIP, 0.6" (15.24mm) Row Spacing	14	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
24-650000-11-RC-P	Aries Electronics	SOCKET ADAPTER SOIC TO 24DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고8,118	DIP, 0.6" (15.24mm) Row Spacing	24	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
24-354000-20	Aries Electronics	SOCKET ADAPTER DIP TO 24SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 24 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	패키지: -	재고6,534	SOIC	24	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
16-354W00-10	Aries Electronics	CONN ADAPTER 16PIN DIP TO SOWIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	패키지: -	재고8,586	SOWIC	16	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
16-35W000-11-RC	Aries Electronics	SOCKET ADAPT SOIC-W TO 16DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고7,596	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
20-301550-10	Aries Electronics	SOCKET ADAPTER SOIC TO 20PLCC Convert From (Adapter End): SOIC Convert To (Adapter End): PLCC Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고4,554	PLCC	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
24-650000-10-P	Aries Electronics	SOCKET ADAPTER SOIC TO 24DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고8,892	DIP, 0.6" (15.24mm) Row Spacing	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
22-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 22SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 22 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고3,580	SOWIC	22	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
10-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 10SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 10 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고7,920	SOWIC	10	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
28-505-111	Aries Electronics	SOCKET ADAPTER PLCC TO 28PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고8,496	PGA	28	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
1109522	Aries Electronics	SOCKET ADAPTER DIP TO TO-8 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): JEDEC Number of Pins: 8 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: FR4 Epoxy Glass	패키지: -	재고2,502	JEDEC	8	0.100" (2.54mm)	Gold	Through Hole	Solder	-	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	FR4 Epoxy Glass
1106396-20	Aries Electronics	SOCKET ADAPTER DIP TO 20DIP 0.6 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	패키지: -	재고8,820	DIP, 0.6" (15.24mm) Row Spacing	20	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
LCQT-QFP0.8-32	Aries Electronics	SOCKET ADAPTER MULT PKG TO 32QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 32 Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	패키지: -	재고6,948	QFP	32	0.031" (0.80mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
LCQT-QFP0.5-40	Aries Electronics	SOCKET ADAPTER MULT PKG TO 40QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 40 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	패키지: -	재고7,074	QFP	40	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
10-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 10DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 10 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	패키지: -	재고3,006	DIP, 0.3" (7.62mm) Row Spacing	10	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
228-4817-09-0602J	3M	RECEPTACLE DIP SOCKET 28POS .4" Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	패키지: -	재고6,930	DIP, 0.4" (10.16mm) Row Spacing	28	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
232-1285-19-0602J	3M	RECEPTACLE DIP SOCKET 32POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	패키지: -	재고5,580	-	-	-	-	-	-	-	-	-	-
PA-SSD3SM18-16	Logical Systems Inc.	SOCKET ADAPTER SSOP TO 16DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	패키지: -	재고8,766	DIP	16	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
LCQT-MSOP10	Aries Electronics	SOCKET ADAPTER MSOP TO 10DIP Convert From (Adapter End): MSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 10 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	패키지: -	재고16,104	DIP, 0.3" (7.62mm) Row Spacing	10	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
20-351000-11-RC	Aries Electronics	SOCKET ADAPTER SSOP TO 20DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고8,448	DIP, 0.3" (7.62mm) Row Spacing	20	0.026" (0.65mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
28-35W000-10	Aries Electronics	SOCKET ADAPT SOIC-W TO 28DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	패키지: -	재고8,244	DIP, 0.3" (7.62mm) Row Spacing	28	-	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
PA-SSD3SM18-14	Logical Systems Inc.	SOCKET ADAPTER SSOP TO 14DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 14 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	패키지: -	재고6,966	DIP	14	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
20-350000-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 20DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: - Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: - Board Material: Polyimide (PI)	패키지: -	재고16,596	DIP, 0.3" (7.62mm) Row Spacing	20	-	Gold	Through Hole	Solder	0.050" (1.27mm)	Gold	-	Polyimide (PI)
08-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 8DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 8 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	패키지: -	재고12,390	DIP, 0.3" (7.62mm) Row Spacing	8	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)

242-1281-39-0602J

3M

RECEPTACLE DIP SOCKET 42POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

패키지: -

재고5,652

-

52-505-110

Aries Electronics

SOCKET ADAPTER PLCC TO 52PGA

Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Number of Pins: 52
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고3,096

PGA

52

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

32-450001-11-RC

Aries Electronics

SOCKET ADAPTER SOJ TO 32DIP 0.4

Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Number of Pins: 32
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고4,752

DIP, 0.4" (10.16mm) Row Spacing

32

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

95-132I25

Aries Electronics

SOCKET ADAPTER QFP TO 132PGA

Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Number of Pins: 132
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고8,010

PGA

132

0.025" (0.64mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

14-651000-10

Aries Electronics

SOCKET ADAPTER SSOP TO 14DIP 0.6

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 14
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고4,050

DIP, 0.6" (15.24mm) Row Spacing

14

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

24-650000-11-RC-P

Aries Electronics

SOCKET ADAPTER SOIC TO 24DIP 0.6

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고8,118

DIP, 0.6" (15.24mm) Row Spacing

24

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

24-354000-20

Aries Electronics

SOCKET ADAPTER DIP TO 24SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 24
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

패키지: -

재고6,534

SOIC

24

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

16-354W00-10

Aries Electronics

CONN ADAPTER 16PIN DIP TO SOWIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Number of Pins: 16
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

패키지: -

재고8,586

SOWIC

16

0.100" (2.54mm)

Gold

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

-

16-35W000-11-RC

Aries Electronics

SOCKET ADAPT SOIC-W TO 16DIP 0.3

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고7,596

DIP, 0.3" (7.62mm) Row Spacing

16

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

20-301550-10

Aries Electronics

SOCKET ADAPTER SOIC TO 20PLCC

Convert From (Adapter End): SOIC
Convert To (Adapter End): PLCC
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고4,554

PLCC

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

24-650000-10-P

Aries Electronics

SOCKET ADAPTER SOIC TO 24DIP 0.6

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고8,892

DIP, 0.6" (15.24mm) Row Spacing

24

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

22-666000-00

Aries Electronics

SOCKET ADAPTER SOIC TO 22SOWIC

Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Number of Pins: 22
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고3,580

SOWIC

22

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

10-666000-00

Aries Electronics

SOCKET ADAPTER SOIC TO 10SOWIC

Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Number of Pins: 10
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고7,920

SOWIC

10

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

28-505-111

Aries Electronics

SOCKET ADAPTER PLCC TO 28PGA

Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고8,496

PGA

28

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

1109522

Aries Electronics

SOCKET ADAPTER DIP TO TO-8

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): JEDEC
Number of Pins: 8
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: FR4 Epoxy Glass

패키지: -

재고2,502

JEDEC

8

0.100" (2.54mm)

Gold

Through Hole

Solder

-

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

FR4 Epoxy Glass

1106396-20

Aries Electronics

SOCKET ADAPTER DIP TO 20DIP 0.6

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 20
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

패키지: -

재고8,820

DIP, 0.6" (15.24mm) Row Spacing

20

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

LCQT-QFP0.8-32

Aries Electronics

SOCKET ADAPTER MULT PKG TO 32QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 32
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

패키지: -

재고6,948

QFP

32

0.031" (0.80mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

LCQT-QFP0.5-40

Aries Electronics

SOCKET ADAPTER MULT PKG TO 40QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 40
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

패키지: -

재고7,074

QFP

40

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

10-350000-10

Aries Electronics

SOCKET ADAPTER SOIC TO 10DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 10
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

패키지: -

재고3,006

DIP, 0.3" (7.62mm) Row Spacing

10

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

228-4817-09-0602J

3M

RECEPTACLE DIP SOCKET 28POS .4"

Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

패키지: -

재고6,930

DIP, 0.4" (10.16mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

232-1285-19-0602J

3M

RECEPTACLE DIP SOCKET 32POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

패키지: -

재고5,580

-

PA-SSD3SM18-16

Logical Systems Inc.

SOCKET ADAPTER SSOP TO 16DIP

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP
Number of Pins: 16
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

패키지: -

재고8,766

DIP

16

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

LCQT-MSOP10

Aries Electronics

SOCKET ADAPTER MSOP TO 10DIP

Convert From (Adapter End): MSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 10
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

패키지: -

재고16,104

DIP, 0.3" (7.62mm) Row Spacing

10

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

20-351000-11-RC

Aries Electronics

SOCKET ADAPTER SSOP TO 20DIP 0.3

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 20
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고8,448

DIP, 0.3" (7.62mm) Row Spacing

20

0.026" (0.65mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

28-35W000-10

Aries Electronics

SOCKET ADAPT SOIC-W TO 28DIP 0.3

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 28
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

패키지: -

재고8,244

DIP, 0.3" (7.62mm) Row Spacing

28

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

PA-SSD3SM18-14

Logical Systems Inc.

SOCKET ADAPTER SSOP TO 14DIP

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP
Number of Pins: 14
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

패키지: -

재고6,966

DIP

14

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

20-350000-11-RC

Aries Electronics

SOCKET ADAPTER SOIC TO 20DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 20
Pitch - Mating: -
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: Polyimide (PI)

패키지: -

재고16,596

DIP, 0.3" (7.62mm) Row Spacing

20

-

Gold

Through Hole

Solder

0.050" (1.27mm)

Gold

-

Polyimide (PI)

08-350000-10

Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 8
Pitch - Mating: -
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

패키지: -

재고12,390

DIP, 0.3" (7.62mm) Row Spacing

8

-

Tin

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

Polyimide (PI)