이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE Connectivity AMP Connectors |
CONN SOCKET PGA 638POS GOLD
|
패키지: - |
재고6,930 |
|
638 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Copper Alloy | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | - | Copper Alloy | Thermoplastic | - |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
패키지: - |
재고2,520 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS TIN
|
패키지: - |
재고2,340 |
|
44 (2 x 22) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
|
Preci-Dip |
CONN SOCKET PGA 144POS GOLD
|
패키지: - |
재고7,938 |
|
144 (15 x 15) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
|
패키지: - |
재고6,300 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS GOLD
|
패키지: - |
재고7,668 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS GOLD
|
패키지: - |
재고7,740 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 22POS GOLD
|
패키지: - |
재고2,484 |
|
22 (2 x 11) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
|
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 3POS GOLD
|
패키지: - |
재고7,416 |
|
3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 20POS GOLD
|
패키지: - |
재고3,454 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
|
패키지: - |
재고2,286 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
|
Samtec Inc. |
ADAPTOR PLUG
|
패키지: - |
재고3,600 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Samtec Inc. |
ADAPTOR PLUG
|
패키지: - |
재고2,772 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
패키지: - |
재고6,228 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
|
Samtec Inc. |
ADAPTOR PLUG
|
패키지: - |
재고3,132 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
Preci-Dip |
CONN IC DIP SOCKET 32POS GOLD
|
패키지: - |
재고2,286 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
|
Preci-Dip |
CONN SOCKET PGA 142POS GOLD
|
패키지: - |
재고8,910 |
|
142 (15 x 15) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
|
Preci-Dip |
CONN SOCKET PGA 128POS GOLD
|
패키지: - |
재고3,582 |
|
128 (13 x 13) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 20POS GOLD
|
패키지: - |
재고2,412 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
|
Aries Electronics |
CONN SOCKET SIP 2POS TIN
|
패키지: - |
재고4,536 |
|
2 (1 x 2) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
|
Aries Electronics |
CONN SOCKET SIP 2POS TIN
|
패키지: - |
재고2,700 |
|
2 (1 x 2) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
Preci-Dip |
CONN IC DIP SOCKET 42POS GOLD
|
패키지: - |
재고6,084 |
|
42 (2 x 21) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
|
Samtec Inc. |
ADAPTOR PLUG
|
패키지: - |
재고3,400 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
Preci-Dip |
CONN IC DIP SOCKET 24POS GOLD
|
패키지: - |
재고6,642 |
|
24 (2 x 12) | 0.070" (1.78mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
Mill-Max Manufacturing Corp. |
CONN SOCKET TRANSIST TO-100 8POS
|
패키지: - |
재고4,338 |
|
8 (Round) | - | Gold | 30µin (0.76µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | - | Tin | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
|
CNC Tech |
CONN IC DIP SOCKET 6POS GOLD
|
패키지: - |
재고3,582 |
|
6 (2 x 3) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | -55°C ~ 105°C |
|
|
3M |
CONN SOCKET QFN 40POS GOLD
|
패키지: - |
재고6,750 |
|
40 (4 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
|
|
TE Connectivity AMP Connectors |
LGA3647-0 SOCKET P0 KIT FOR ODM
|
패키지: - |
재고6,822 |
|
3647 | - | Gold | 30µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - |
