페이지 226 - IC용 소켓, 트랜지스터 | 커넥터, 상호 연결 | Heisener Electronics
고객 문의
SalesDept@heisener.com 86-755-83210559-827
로그인/등록
Language Translation

* Please refer to the English Version as our Official Version.

BOM
카트 0

IC용 소켓, 트랜지스터

기록 11,083
페이지  226/396
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
A22-LCG-T-R
Assmann WSW Components

CONN IC DIP SOCKET 22POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 22 (2 x 11)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: -
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
  • Operating Temperature: -55°C ~ 105°C
패키지: -
재고6,786
22 (2 x 11)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
24-3574-18
Aries Electronics

CONN IC DIP SOCKET ZIF 24POS TIN

  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
패키지: -
재고2,970
24 (2 x 12)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
126-93-950-41-003000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 50POS GOLD

  • Type: DIP, 0.9" (22.86mm) Row Spacing
  • Number of Positions or Pins (Grid): 50 (2 x 25)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고3,798
50 (2 x 25)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
126-93-650-41-002000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 50POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 50 (2 x 25)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고6,912
50 (2 x 25)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
614-93-306-41-001000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 6POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 6 (2 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고2,232
6 (2 x 3)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
20-7394-10
Aries Electronics

CONN SOCKET SIP 20POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 20 (1 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
패키지: -
재고2,214
20 (1 x 20)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
24-6508-301
Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
패키지: -
재고7,596
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
16-8500-310C
Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 16 (2 x 8)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame, Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
패키지: -
재고8,280
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame, Elevated
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
510-83-145-15-002101
Preci-Dip

CONN SOCKET PGA 145POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 145 (15 x 15)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고3,526
145 (15 x 15)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
10-0508-21
Aries Electronics

CONN SOCKET SIP 10POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 10 (1 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Wire Wrap
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고8,262
10 (1 x 10)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Wire Wrap
-
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6
-55°C ~ 125°C
1-1437538-3
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TINLEAD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin-Lead
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Copper Alloy
  • Housing Material: Polyester
  • Operating Temperature: -55°C ~ 105°C
패키지: -
재고7,776
28 (2 x 14)
0.100" (2.54mm)
Tin-Lead
-
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
-
Copper Alloy
Polyester
-55°C ~ 105°C
123-13-640-41-001000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 40POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고3,528
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
146-83-652-41-035101
Preci-Dip

CONN IC DIP SOCKET 52POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 52 (2 x 26)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Press-Fit
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고7,920
52 (2 x 26)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Press-Fit
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
22-0518-11H
Aries Electronics

CONN SOCKET SIP 22POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 22 (1 x 22)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
패키지: -
재고7,668
22 (1 x 22)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
8-1437529-1
TE Connectivity AMP Connectors

508-AG11F=SOCKET ASSY

  • Type: -
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: -
  • Mounting Type: -
  • Features: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
패키지: -
재고8,244
-
-
-
-
-
-
-
-
-
-
-
-
-
-
06-6513-11H
Aries Electronics

CONN IC DIP SOCKET 6POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 6 (2 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
패키지: -
재고5,634
6 (2 x 3)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
116-83-328-41-018101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고7,110
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
17-0513-10
Aries Electronics

CONN SOCKET SIP 17POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 17 (1 x 17)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
패키지: -
재고5,742
17 (1 x 17)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
116-83-210-41-013101
Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

  • Type: DIP, 0.2" (5.08mm) Row Spacing
  • Number of Positions or Pins (Grid): 10 (2 x 5)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고2,952
10 (2 x 5)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
10-6513-10
Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 10 (2 x 5)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
패키지: -
재고4,518
10 (2 x 5)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
614-83-320-31-012101
Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고8,622
20 (2 x 10)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
D01-9972942
Harwin Inc.

CONN SOCKET SIP 29POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 29 (1 x 29)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 196.8µin (5.00µm)
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고2,430
29 (1 x 29)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
116-87-320-41-006101
Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고8,586
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
114-87-420-41-117101
Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고8,496
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
110-83-210-01-742101
Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

  • Type: DIP, 0.2" (5.08mm) Row Spacing
  • Number of Positions or Pins (Grid): 10 (2 x 5), 6 Loaded
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고7,578
10 (2 x 5), 6 Loaded
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
280-5205-01
3M

CONN SOCKET QFN 80POS GOLD

  • Type: QFN
  • Number of Positions or Pins (Grid): 80 (4 x 20)
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.020" (0.50mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyethersulfone (PES)
  • Operating Temperature: -
패키지: -
재고6,480
80 (4 x 20)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.020" (0.50mm)
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
917-43-108-41-005000
Mill-Max Manufacturing Corp.

CONN TRANSIST TO-5 8POS GOLD

  • Type: Transistor, TO-5
  • Number of Positions or Pins (Grid): 8 (Round)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고20,010
8 (Round)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-87-306-41-001101
Preci-Dip

CONN IC DIP SOCKET 6POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 6 (2 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
패키지: -
재고19,668
6 (2 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C