페이지 12 - 내장형 - 마이크로 컨트롤러, 마이크로 프로세서, FPGA 모듈 | 집적 회로(IC)

부품 번호	제조업체	설명	패키지	재고	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
SOMDM3730-30-1880AKIR	Logic	SYSTEM ON MODULE TORP Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 800MHz Flash Size: 512MB RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.06" (15mm x 27mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고3,376	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	800MHz	512MB	512MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.06" (15mm x 27mm)	-40°C ~ 85°C
DC-SP-01R-C-W	Digi International	ADAPTER SP CUSTOMIZABLE MODEL Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고7,600	ARM7TDMI, NS7520	-	55MHz	4MB	16MB	RJ45	3.88" x 1.68" (98.5mm x 42.7mm)	-40°C ~ 85°C
DC-ME-Y413-C-B	Digi International	MOD ME 9210 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 16MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	패키지: -	재고7,968	ARM926EJ-S, NS9210	-	75MHz	16MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
20-101-1307	Digi International	CORE MODULE RCM5760 Module/Board Type: MPU Core Core Processor: Rabbit 5000 Co-Processor: - Speed: 50MHz Flash Size: 1MB (Internal), 2MB (External) RAM Size: 128KB (Internal), 512KB (External) Connector Type: Edge Connector - 52 Size / Dimension: 1.2" x 2" (30mm x 51mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고5,920	Rabbit 5000	-	50MHz	1MB (Internal), 2MB (External)	128KB (Internal), 512KB (External)	Edge Connector - 52	1.2" x 2" (30mm x 51mm)	-40°C ~ 85°C
20-101-1235	Digi International	CORE MODULE RCM5700 Module/Board Type: MPU Core Core Processor: Rabbit 5000 Co-Processor: - Speed: 50MHz Flash Size: 1MB RAM Size: 128KB Connector Type: Edge Connector - 52 Size / Dimension: 1.2" x 2" (30mm x 51mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고4,128	Rabbit 5000	-	50MHz	1MB	128KB	Edge Connector - 52	1.2" x 2" (30mm x 51mm)	-40°C ~ 85°C
101-0521	Digi International	MODULE RABBITCORE RCM3210 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 29.5MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	패키지: -	재고3,408	Rabbit 3000	-	29.5MHz	256KB	128KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
CENGLH79524-10-403HC	Logic	CARD ENGINE 16MB FLASH 32MB RAM Module/Board Type: MPU Core Core Processor: ARM720T, LH79524 Co-Processor: - Speed: 77.4MHz Flash Size: 16MB RAM Size: 32MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고5,120	ARM720T, LH79524	-	77.4MHz	16MB	32MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
101-0950	Digi International	MODULE RABBITCORE RCM3370 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	패키지: -	재고2,096	Rabbit 3000	-	44.2MHz	512KB	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
101-0497	Digi International	MODULAR RABBIT CORE OP6810 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: IDC Header 2x20 Size / Dimension: 2.6" x 3" (66mm x 76mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고7,856	Rabbit 2000	-	22.1MHz	256KB	128KB	IDC Header 2x20	2.6" x 3" (66mm x 76mm)	-40°C ~ 85°C
TE0712-02-100-2C3	Trenz Electronic GmbH	SOM ARTIX7 XC7A100T-2C 1GB LOPRO Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고3,872	Artix-7 A100T	-	200MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
CC-7U-Z111-Z1	Digi International	MODULE 7U 16MB SDRAM 2MB FLASH Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 16MB Connector Type: 48-DIP Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고2,960	ARM7TDMI, NS7520	-	55MHz	2MB	16MB	48-DIP	2.48" x 0.73" (62.9mm x 18.5mm)	0°C ~ 70°C
CC-MX-L96C-Z1-1	Digi International	MOD WI-I.MX6 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A9, i.MX6Quad Co-Processor: - Speed: 800MHz Flash Size: 4GB RAM Size: 512MB Connector Type: - Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고4,336	ARM? Cortex?-A9, i.MX6Quad	-	800MHz	4GB	512MB	-	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
20-101-0453	Digi International	MODULE RABBITCORE RCM2300 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x26 Size / Dimension: 1.15" x 1.6" (29mm x 41mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고7,608	Rabbit 2000	-	22.1MHz	256KB	128KB	2 IDC Headers 2x26	1.15" x 1.6" (29mm x 41mm)	-40°C ~ 85°C
OSD3358-512M-ISM	Octavo Systems LLC	IC SIP ARM A8 21MM 256BGA Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A8, AM3358 Co-Processor: NEON™ SIMD Speed: 1GHz Flash Size: - RAM Size: 512MB Connector Type: 256-BGA Size / Dimension: 0.83" x 0.83" (21mm x 21mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고15,444	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	-	512MB	256-BGA	0.83" x 0.83" (21mm x 21mm)	-40°C ~ 85°C
TE0820-03-03CG-1ED	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 1GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 85°C	패키지: -	재고6,416	Zynq UltraScale+ XCZU3CG-1SFVC784E	-	-	128MB	1GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 85°C
TE0630-02IBF	Trenz Electronic GmbH	IC MOD SPARTAN-6 100MHZ 128MB Module/Board Type: FPGA, USB Core Core Processor: Spartan-6 LX-75 Co-Processor: Cypress EZ-USB FX2LP Speed: 100MHz Flash Size: 8MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고6,960	Spartan-6 LX-75	Cypress EZ-USB FX2LP	100MHz	8MB	128MB	B2B	1.6" x 1.9" (40.5mm x 47.5mm)	-40°C ~ 85°C
MRZG2LS-BAA	ARIES Embedded	SOM RZ/G2L Module/Board Type: MCU Core Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Co-Processor: - Speed: 1.5GHz Flash Size: 4GB eMMC, 128MB (NOR) RAM Size: 1GB Connector Type: Pin(s) Size / Dimension: 32.283" L x 19.685" W (820.00mm x 500.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM® Cortex®-A55, ARM® Cortex®-M33	-	1.5GHz	4GB eMMC, 128MB (NOR)	1GB	Pin(s)	32.283" L x 19.685" W (820.00mm x 500.00mm)	-40°C ~ 85°C
TE0726-03-41C64-A	Trenz Electronic GmbH	IC MODULE ZYNQBERRY Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: - Flash Size: 16MB RAM Size: 512MB Connector Type: CSI, DSI Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	패키지: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7010)	-	16MB	512MB	CSI, DSI	1.180" L x 1.570" W (30.00mm x 40.00mm)	0°C ~ 70°C
TE0630-03-63I22-A	Trenz Electronic GmbH	IC MOD SPARTAN-6 100MHZ 128MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	Request a Quote	-	-	-	-	-	-	-	-
ME-XU8-7EV-2I-D12E-R2-2	Enclustra FPGA Solutions	SOM ZYNQ XU8 US+ ZU7EV Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0710-02-72I21-A	Trenz Electronic GmbH	MOD FPGA ARTIX7 100T 512MB 78BGA Module/Board Type: FPGA Core Core Processor: Artix-7 A100T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: 512MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	Artix-7 A100T	-	100MHz	32MB	512MB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0715-04-51I33-L	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0803-03-3BE11-AS	Trenz Electronic GmbH	MODULE SOM TE0803-03 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0820-05-3BE21ML	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
6231-IX-XXA-RI	Critical Link LLC	SOM WITH TI SITARA AM6231, 1GHZ, Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: - RAM Size: 1GB Connector Type: SO-DIMM-260 Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM® Cortex®-A53	NEON SIMD	800MHz	-	1GB	SO-DIMM-260	2.740" L x 1.500" W (69.60mm x 38.10mm)	-40°C ~ 85°C
TE0745-03-93E31-A	Trenz Electronic GmbH	SOM WITH AMD ZYNQ 7045-3E, 1 GBY Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-3FFG676E Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	ARM Cortex-A9	Xilinx Zynq 7045 SoC XC7Z045-3FFG676E	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0818-02-9BE81-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH AMD Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0808-04-9BE21-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 4GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	Zynq UltraScale+ XCZU9EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C

SOMDM3730-30-1880AKIR

Logic

SYSTEM ON MODULE TORP

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 800MHz
Flash Size: 512MB
RAM Size: 512MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고3,376

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

800MHz

512MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.06" (15mm x 27mm)

-40°C ~ 85°C

DC-SP-01R-C-W

Digi International

ADAPTER SP CUSTOMIZABLE MODEL

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고7,600

ARM7TDMI, NS7520

-

55MHz

4MB

16MB

RJ45

3.88" x 1.68" (98.5mm x 42.7mm)

-40°C ~ 85°C

DC-ME-Y413-C-B

Digi International

MOD ME 9210 16MB SDRAM 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 16MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

패키지: -

재고7,968

ARM926EJ-S, NS9210

-

75MHz

16MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

20-101-1307

Digi International

CORE MODULE RCM5760

Module/Board Type: MPU Core
Core Processor: Rabbit 5000
Co-Processor: -
Speed: 50MHz
Flash Size: 1MB (Internal), 2MB (External)
RAM Size: 128KB (Internal), 512KB (External)
Connector Type: Edge Connector - 52
Size / Dimension: 1.2" x 2" (30mm x 51mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고5,920

Rabbit 5000

-

50MHz

1MB (Internal), 2MB (External)

128KB (Internal), 512KB (External)

Edge Connector - 52

1.2" x 2" (30mm x 51mm)

-40°C ~ 85°C

20-101-1235

Digi International

CORE MODULE RCM5700

Module/Board Type: MPU Core
Core Processor: Rabbit 5000
Co-Processor: -
Speed: 50MHz
Flash Size: 1MB
RAM Size: 128KB
Connector Type: Edge Connector - 52
Size / Dimension: 1.2" x 2" (30mm x 51mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고4,128

Rabbit 5000

-

50MHz

1MB

128KB

Edge Connector - 52

1.2" x 2" (30mm x 51mm)

-40°C ~ 85°C

101-0521

Digi International

MODULE RABBITCORE RCM3210

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 29.5MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

패키지: -

재고3,408

Rabbit 3000

-

29.5MHz

256KB

128KB

2 IDC Headers 2x17

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

CENGLH79524-10-403HC

Logic

CARD ENGINE 16MB FLASH 32MB RAM

Module/Board Type: MPU Core
Core Processor: ARM720T, LH79524
Co-Processor: -
Speed: 77.4MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고5,120

ARM720T, LH79524

-

77.4MHz

16MB

32MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

101-0950

Digi International

MODULE RABBITCORE RCM3370

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

패키지: -

재고2,096

Rabbit 3000

-

44.2MHz

512KB

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

101-0497

Digi International

MODULAR RABBIT CORE OP6810

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: IDC Header 2x20
Size / Dimension: 2.6" x 3" (66mm x 76mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고7,856

Rabbit 2000

-

22.1MHz

256KB

128KB

IDC Header 2x20

2.6" x 3" (66mm x 76mm)

-40°C ~ 85°C

TE0712-02-100-2C3

Trenz Electronic GmbH

SOM ARTIX7 XC7A100T-2C 1GB LOPRO

Module/Board Type: FPGA
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고3,872

Artix-7 A100T

-

200MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

CC-7U-Z111-Z1

Digi International

MODULE 7U 16MB SDRAM 2MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 16MB
Connector Type: 48-DIP
Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고2,960

ARM7TDMI, NS7520

-

55MHz

2MB

16MB

48-DIP

2.48" x 0.73" (62.9mm x 18.5mm)

0°C ~ 70°C

CC-MX-L96C-Z1-1

Digi International

MOD WI-I.MX6

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A9, i.MX6Quad
Co-Processor: -
Speed: 800MHz
Flash Size: 4GB
RAM Size: 512MB
Connector Type: -
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고4,336

ARM? Cortex?-A9, i.MX6Quad

-

800MHz

4GB

512MB

-

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

20-101-0453

Digi International

MODULE RABBITCORE RCM2300

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x26
Size / Dimension: 1.15" x 1.6" (29mm x 41mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고7,608

Rabbit 2000

-

22.1MHz

256KB

128KB

2 IDC Headers 2x26

1.15" x 1.6" (29mm x 41mm)

-40°C ~ 85°C

OSD3358-512M-ISM

Octavo Systems LLC

IC SIP ARM A8 21MM 256BGA

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A8, AM3358
Co-Processor: NEON™ SIMD
Speed: 1GHz
Flash Size: -
RAM Size: 512MB
Connector Type: 256-BGA
Size / Dimension: 0.83" x 0.83" (21mm x 21mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고15,444

ARM® Cortex®-A8, AM3358

NEON™ SIMD

1GHz

-

512MB

256-BGA

0.83" x 0.83" (21mm x 21mm)

-40°C ~ 85°C

TE0820-03-03CG-1ED

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 1GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 1GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 85°C

패키지: -

재고6,416

Zynq UltraScale+ XCZU3CG-1SFVC784E

-

128MB

1GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 85°C

TE0630-02IBF

Trenz Electronic GmbH

IC MOD SPARTAN-6 100MHZ 128MB

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-6 LX-75
Co-Processor: Cypress EZ-USB FX2LP
Speed: 100MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고6,960

Spartan-6 LX-75

Cypress EZ-USB FX2LP

100MHz

8MB

128MB

B2B

1.6" x 1.9" (40.5mm x 47.5mm)

-40°C ~ 85°C

MRZG2LS-BAA

ARIES Embedded

SOM RZ/G2L

Module/Board Type: MCU Core
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Co-Processor: -
Speed: 1.5GHz
Flash Size: 4GB eMMC, 128MB (NOR)
RAM Size: 1GB
Connector Type: Pin(s)
Size / Dimension: 32.283" L x 19.685" W (820.00mm x 500.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM® Cortex®-A55, ARM® Cortex®-M33

-

1.5GHz

4GB eMMC, 128MB (NOR)

1GB

Pin(s)

32.283" L x 19.685" W (820.00mm x 500.00mm)

-40°C ~ 85°C

TE0726-03-41C64-A

Trenz Electronic GmbH

IC MODULE ZYNQBERRY

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: -
Flash Size: 16MB
RAM Size: 512MB
Connector Type: CSI, DSI
Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

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ARM Cortex-A9

Zynq-7000 (Z-7010)

-

16MB

512MB

CSI, DSI

1.180" L x 1.570" W (30.00mm x 40.00mm)

0°C ~ 70°C

TE0630-03-63I22-A

Trenz Electronic GmbH

IC MOD SPARTAN-6 100MHZ 128MB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

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-

ME-XU8-7EV-2I-D12E-R2-2

Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU7EV

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0710-02-72I21-A

Trenz Electronic GmbH

MOD FPGA ARTIX7 100T 512MB 78BGA

Module/Board Type: FPGA Core
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: 512MB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

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Artix-7 A100T

-

100MHz

32MB

512MB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0715-04-51I33-L

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7015)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM Cortex-A9

Zynq-7000 (Z-7015)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0803-03-3BE11-AS

Trenz Electronic GmbH

MODULE SOM TE0803-03

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

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Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0820-05-3BE21ML

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

Pin(s)

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

6231-IX-XXA-RI

Critical Link LLC

SOM WITH TI SITARA AM6231, 1GHZ,

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: -
RAM Size: 1GB
Connector Type: SO-DIMM-260
Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm)
Operating Temperature: -40°C ~ 85°C

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ARM® Cortex®-A53

NEON SIMD

800MHz

-

1GB

SO-DIMM-260

2.740" L x 1.500" W (69.60mm x 38.10mm)

-40°C ~ 85°C

TE0745-03-93E31-A

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7045-3E, 1 GBY

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-3FFG676E
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

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ARM Cortex-A9

Xilinx Zynq 7045 SoC XC7Z045-3FFG676E

-

64MB

1GB

Samtec ST5

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0818-02-9BE81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH AMD

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

패키지: -

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Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0808-04-9BE21-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 4GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

패키지: -

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Zynq UltraScale+ XCZU9EG-1FFVC900E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C