페이지 18 - 내장형 - 마이크로 컨트롤러, 마이크로 프로세서, FPGA 모듈 | 집적 회로(IC)

부품 번호	제조업체	설명	패키지	재고	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
M5485BFEE-E	Logic	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5485 Co-Processor: - Speed: 200MHz Flash Size: 16MB (NOR), 2MB (Boot) RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (95mm x 114mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고5,328	ColdFire V4e, MCF5485	-	200MHz	16MB (NOR), 2MB (Boot)	64MB	-	3.7" x 4.5" (95mm x 114mm)	-40°C ~ 85°C
CC-9C-V237-Z1-B	Digi International	MODULE 9C 64MB SDRAM 128MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 128MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고7,232	ARM926EJ-S, NS9360	-	155MHz	128MB	64MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
SOMAM3517-10-1780RJXR	Logic	SYSTEM ON MODULE AM3517 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3517 Co-Processor: - Speed: 600MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 300 Size / Dimension: 1.61" x 2.02" (40.9mm x 51.2mm) Operating Temperature: -20°C ~ 70°C	패키지: -	재고4,448	ARM? Cortex?-A8, AM3517	-	600MHz	512MB	256MB	Board-to-Board (BTB) Socket - 300	1.61" x 2.02" (40.9mm x 51.2mm)	-20°C ~ 70°C
M5475CFE	NXP	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5475 Co-Processor: - Speed: 266MHz Flash Size: 16MB RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고7,424	ColdFire V4e, MCF5475	-	266MHz	16MB	64MB	-	3.7" x 4.5" (93.4mm x 114.3mm)	0°C ~ 70°C
MK67Q5250V-0101YC	Rohm Semiconductor	IC BIOMETRIX MODULE SCREW IN Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고5,840	-	-	-	-	-	-	-	-
DLP-2232PB-G	DLP Design Inc.	MODULE USB-MCU FT2232D W/16F877A Module/Board Type: MCU, USB Core Core Processor: PIC16F877A Co-Processor: FT2232D Speed: 20MHz Flash Size: 8KB RAM Size: 368KB Connector Type: USB - B, Pin Header Size / Dimension: 2.8" x 1" (71.1mm x 25.4mm) Operating Temperature: -	패키지: -	재고6,992	PIC16F877A	FT2232D	20MHz	8KB	368KB	USB - B, Pin Header	2.8" x 1" (71.1mm x 25.4mm)	-
FS-387	Digi International	MODULE XP 128MB SDRAM 32MB FLSH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고5,104	-	-	-	-	-	-	-	-
101-0446	Digi International	MODULE RABBITCORE RCM2130 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 2" x 3.5" (51mm x 89mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고6,080	Rabbit 2000	-	22.1MHz	256KB	128KB	2 IDC Headers 2x20	2" x 3.5" (51mm x 89mm)	-40°C ~ 85°C
CC-9C-V223-RJ-25	Digi International	MODULE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고5,344	-	-	-	-	-	-	-	-
CC-9P-V534-LX-B	Digi International	MODULE 9P 64MB SDRAM 16MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고5,936	-	-	-	-	-	-	-	-
TE0600-03IMVF	Trenz Electronic GmbH	SOM GIGABEE 2X512MB REV. 3 Module/Board Type: FPGA Core Processor: Spartan-6 LX-150 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고4,800	Spartan-6 LX-150	-	125MHz	16MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
DC-ME-Y402-LX-JT	Digi International	MOD ME 9210 8MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	패키지: -	재고6,560	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
EZ80F915005MODG	Zilog	MODULE EZ80F91 512K 50MHZ Module/Board Type: MCU, Ethernet Core Core Processor: eZ80F91 Co-Processor: - Speed: 50MHz Flash Size: 256KB RAM Size: 8KB (Internal), 128KB (External) Connector Type: Mini-Headers 2x56 Size / Dimension: 2" x 1.9" (50.8mm x 48.3mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고3,584	eZ80F91	-	50MHz	256KB	8KB (Internal), 128KB (External)	Mini-Headers 2x56	2" x 1.9" (50.8mm x 48.3mm)	0°C ~ 70°C
TE0723-03-07S-1C	Trenz Electronic GmbH	SOM ARDUZYNQ ZYNQ Z-7007S Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7007S) Speed: 766MHz Flash Size: 16MB RAM Size: 512MB Connector Type: B2B Size / Dimension: - Operating Temperature: 0°C ~ 70°C	패키지: -	재고6,560	ARM Cortex-A9	Zynq-7000 (Z-7007S)	766MHz	16MB	512MB	B2B	-	0°C ~ 70°C
TE0720-03-1QF	Trenz Electronic GmbH	SOM ZYNQ XA7Z020-1Q 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -	패키지: -	재고6,372	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-
XPDNC200S-01	Lantronix, Inc.	XPORT DIRECT PLUS DEVICE NETWORK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고5,968	-	-	-	-	-	-	-	-
TEC0850-03-015EG1E	Trenz Electronic GmbH	IC MODULE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고5,232	-	-	-	-	-	-	-	-
UC2550-13NNN	GHI Electronics, LLC	IC MOD CORTEX-M4 100MHZ 320KB Module/Board Type: MPU Core Core Processor: ARM® Cortex®-M4 Co-Processor: - Speed: 100MHz Flash Size: 1MB (Internal), 4MB (External) RAM Size: 320KB Connector Type: - Size / Dimension: 2.67" x 1.25" (67.7mm x 31.7mm) Operating Temperature: -	패키지: -	재고5,824	ARM® Cortex®-M4	-	100MHz	1MB (Internal), 4MB (External)	320KB	-	2.67" x 1.25" (67.7mm x 31.7mm)	-
TE0600-03-52I11-A	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Core Processor: Spartan-6 LX-45 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	Spartan-6 LX-45	-	125MHz	16MB	256MB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0820-05-3AE81MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	Request a Quote	-	-	-	-	-	-	-	-
5729-PX-4AA-RC	Critical Link LLC	TEXAS INSTRUMENTS AM5729 SOM (32 Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A15 Co-Processor: - Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: 0°C ~ 70°C	패키지: -	Request a Quote	ARM® Cortex®-A15	-	1.5GHz	32MB	1GB	Board-to-Board (BTB) - 100, Edge Connector - 310	3.460" L x 2.730" W (87.88mm x 69.34mm)	0°C ~ 70°C
TE0715-05-73E33-A	Trenz Electronic GmbH	SOC MODULE WITH XILINX ZYNQ 7030 Module/Board Type: MPU Core Core Processor: Zynq™ XC7Z030-3SBG485E Co-Processor: ARM Cortex-A9 Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	Zynq™ XC7Z030-3SBG485E	ARM Cortex-A9	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0803-04-4AE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	Zynq UltraScale+ XCZU4CG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0808-05-6BE81-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	Request a Quote	-	-	-	-	-	-	-	-
TE0818-02-BBE81-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH AMD Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0745-02-93E11-KA	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0715-04-71I33-A	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
AM0010-02-5DI21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU5EV-1I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	Zynq™ UltraScale+™ ZU5EV-1I	-	-	128MB	4GB	Board-to-Board (BTB) Socket	2.220" L x 1.575" W (56.40mm x 40.00mm)	-40°C ~ 85°C

M5485BFEE-E

Logic

MODULE FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5485
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB (NOR), 2MB (Boot)
RAM Size: 64MB
Connector Type: -
Size / Dimension: 3.7" x 4.5" (95mm x 114mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고5,328

ColdFire V4e, MCF5485

-

200MHz

16MB (NOR), 2MB (Boot)

64MB

-

3.7" x 4.5" (95mm x 114mm)

-40°C ~ 85°C

CC-9C-V237-Z1-B

Digi International

MODULE 9C 64MB SDRAM 128MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 128MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고7,232

ARM926EJ-S, NS9360

-

155MHz

128MB

64MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

SOMAM3517-10-1780RJXR

Logic

SYSTEM ON MODULE AM3517

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3517
Co-Processor: -
Speed: 600MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 300
Size / Dimension: 1.61" x 2.02" (40.9mm x 51.2mm)
Operating Temperature: -20°C ~ 70°C

패키지: -

재고4,448

ARM? Cortex?-A8, AM3517

-

600MHz

512MB

256MB

Board-to-Board (BTB) Socket - 300

1.61" x 2.02" (40.9mm x 51.2mm)

-20°C ~ 70°C

M5475CFE

NXP

MODULE FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5475
Co-Processor: -
Speed: 266MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: -
Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고7,424

ColdFire V4e, MCF5475

-

266MHz

16MB

64MB

-

3.7" x 4.5" (93.4mm x 114.3mm)

0°C ~ 70°C

MK67Q5250V-0101YC

Rohm Semiconductor

IC BIOMETRIX MODULE SCREW IN

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고5,840

-

DLP-2232PB-G

DLP Design Inc.

MODULE USB-MCU FT2232D W/16F877A

Module/Board Type: MCU, USB Core
Core Processor: PIC16F877A
Co-Processor: FT2232D
Speed: 20MHz
Flash Size: 8KB
RAM Size: 368KB
Connector Type: USB - B, Pin Header
Size / Dimension: 2.8" x 1" (71.1mm x 25.4mm)
Operating Temperature: -

패키지: -

재고6,992

PIC16F877A

FT2232D

20MHz

8KB

368KB

USB - B, Pin Header

2.8" x 1" (71.1mm x 25.4mm)

-

FS-387

Digi International

MODULE XP 128MB SDRAM 32MB FLSH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고5,104

-

101-0446

Digi International

MODULE RABBITCORE RCM2130

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x20
Size / Dimension: 2" x 3.5" (51mm x 89mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고6,080

Rabbit 2000

-

22.1MHz

256KB

128KB

2 IDC Headers 2x20

2" x 3.5" (51mm x 89mm)

-40°C ~ 85°C

CC-9C-V223-RJ-25

Digi International

MODULE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고5,344

-

CC-9P-V534-LX-B

Digi International

MODULE 9P 64MB SDRAM 16MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고5,936

-

TE0600-03IMVF

Trenz Electronic GmbH

SOM GIGABEE 2X512MB REV. 3

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-150
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고4,800

Spartan-6 LX-150

-

125MHz

16MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

DC-ME-Y402-LX-JT

Digi International

MOD ME 9210 8MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

패키지: -

재고6,560

ARM926EJ-S, NS9210

-

75MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

EZ80F915005MODG

Zilog

MODULE EZ80F91 512K 50MHZ

Module/Board Type: MCU, Ethernet Core
Core Processor: eZ80F91
Co-Processor: -
Speed: 50MHz
Flash Size: 256KB
RAM Size: 8KB (Internal), 128KB (External)
Connector Type: Mini-Headers 2x56
Size / Dimension: 2" x 1.9" (50.8mm x 48.3mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고3,584

eZ80F91

-

50MHz

256KB

8KB (Internal), 128KB (External)

Mini-Headers 2x56

2" x 1.9" (50.8mm x 48.3mm)

0°C ~ 70°C

TE0723-03-07S-1C

Trenz Electronic GmbH

SOM ARDUZYNQ ZYNQ Z-7007S

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7007S)
Speed: 766MHz
Flash Size: 16MB
RAM Size: 512MB
Connector Type: B2B
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

패키지: -

재고6,560

ARM Cortex-A9

Zynq-7000 (Z-7007S)

766MHz

16MB

512MB

B2B

-

0°C ~ 70°C

TE0720-03-1QF

Trenz Electronic GmbH

SOM ZYNQ XA7Z020-1Q 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -

패키지: -

재고6,372

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-

XPDNC200S-01

Lantronix, Inc.

XPORT DIRECT PLUS DEVICE NETWORK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고5,968

-

TEC0850-03-015EG1E

Trenz Electronic GmbH

IC MODULE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고5,232

-

UC2550-13NNN

GHI Electronics, LLC

IC MOD CORTEX-M4 100MHZ 320KB

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-M4
Co-Processor: -
Speed: 100MHz
Flash Size: 1MB (Internal), 4MB (External)
RAM Size: 320KB
Connector Type: -
Size / Dimension: 2.67" x 1.25" (67.7mm x 31.7mm)
Operating Temperature: -

패키지: -

재고5,824

ARM® Cortex®-M4

-

100MHz

1MB (Internal), 4MB (External)

320KB

-

2.67" x 1.25" (67.7mm x 31.7mm)

-

TE0600-03-52I11-A

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA Core
Core Processor: Spartan-6 LX-45
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

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Spartan-6 LX-45

-

125MHz

16MB

256MB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0820-05-3AE81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

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-

5729-PX-4AA-RC

Critical Link LLC

TEXAS INSTRUMENTS AM5729 SOM (32

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A15
Co-Processor: -
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: 0°C ~ 70°C

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ARM® Cortex®-A15

-

1.5GHz

32MB

1GB

Board-to-Board (BTB) - 100, Edge Connector - 310

3.460" L x 2.730" W (87.88mm x 69.34mm)

0°C ~ 70°C

TE0715-05-73E33-A

Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ 7030

Module/Board Type: MPU Core
Core Processor: Zynq™ XC7Z030-3SBG485E
Co-Processor: ARM Cortex-A9
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

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Zynq™ XC7Z030-3SBG485E

ARM Cortex-A9

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0803-04-4AE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

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Zynq UltraScale+ XCZU4CG-1SFVC784E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0808-05-6BE81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

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-

TE0818-02-BBE81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH AMD

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

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Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0745-02-93E11-KA

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM Cortex-A9

Zynq-7000 (Z-7045)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0715-04-71I33-A

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

AM0010-02-5DI21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU5EV-1I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

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Zynq™ UltraScale+™ ZU5EV-1I

-

128MB

4GB

Board-to-Board (BTB) Socket

2.220" L x 1.575" W (56.40mm x 40.00mm)

-40°C ~ 85°C