페이지 24 - 내장형 - 마이크로 컨트롤러, 마이크로 프로세서, FPGA 모듈 | 집적 회로(IC)

부품 번호	제조업체	설명	패키지	재고	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
DC-ME-Y402-NC-B	Digi International	MOD ME 8MB SDRAM 4MB FLASH 50P Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	패키지: -	재고2,368	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
DC-ME-01T-NS-1	Digi International	MODULE ME 8MB SDRAM 2MB FLASH Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고4,848	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
EZ80F916050MODG	Zilog	MODULE FLASH FOR EZ80F91 Module/Board Type: MCU, Ethernet Core Core Processor: eZ80F91 Co-Processor: - Speed: 50MHz Flash Size: 256KB (Internal), 1MB (External) RAM Size: 16KB (Internal), 512KB (External) Connector Type: Header 2x30 Size / Dimension: 2.5" x 3.1" (63.5mm x 78.7mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고6,736	eZ80F91	-	50MHz	256KB (Internal), 1MB (External)	16KB (Internal), 512KB (External)	Header 2x30	2.5" x 3.1" (63.5mm x 78.7mm)	0°C ~ 70°C
CC-9C-V212-RJ-25	Digi International	MODULE 9C 16MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 4MB RAM Size: 16MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고6,576	ARM926EJ-S, NS9360	-	155MHz	4MB	16MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
CC-MX-PF58-ZK-B	Digi International	MOD WI-IMX287 256M FLASH 25/PK Module/Board Type: MPU Core Core Processor: ARM926EJ-S i.mx287 Co-Processor: - Speed: 454MHz Flash Size: 256MB RAM Size: 256MB Connector Type: Edge Connector - 52 Size / Dimension: 2" x 1.38" (51mm x 35mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고5,520	ARM926EJ-S i.mx287	-	454MHz	256MB	256MB	Edge Connector - 52	2" x 1.38" (51mm x 35mm)	-40°C ~ 85°C
DC-ME-Y402-S-B	Digi International	MOD ME 9210 8MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	패키지: -	재고4,336	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
DC-ME4-01T-S-10	Digi International	DIGI CONNECT 4MB FLASH 8MB RAM Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고5,792	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
MOD5234-100IR	NetBurner Inc.	MOD5234 10/100 ETHERNET MODULE Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5234 Co-Processor: - Speed: 147.5MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.95" x 2" (74.9mm x 50.8mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고4,224	ColdFire 5234	-	147.5MHz	2MB	8MB	RJ-45, 2x50 Header	2.95" x 2" (74.9mm x 50.8mm)	-40°C ~ 85°C
20-101-0517	Digi International	MODULE RABBITCORE RCM3100 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 29.4MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 1.65" (47mm x 42mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고8,820	Rabbit 3000	-	29.4MHz	512KB	512KB	2 IDC Headers 2x17	1.85" x 1.65" (47mm x 42mm)	-40°C ~ 85°C
DC-ME-01T-VCY-1	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고7,360	-	-	-	-	-	-	-	-
TE0820-03-02EG-1EL	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 85°C	패키지: -	재고6,480	Zynq UltraScale+ XCZU2EG-1SFVC784E	-	-	128MB	2GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 85°C
TE0841-02-035-1I	Trenz Electronic GmbH	SOM USCALE 2GB DDR4 Module/Board Type: FPGA Core Core Processor: Kintex UltraScale KU035 Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고2,576	Kintex UltraScale KU035	-	-	64MB	2GB	B2B	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
TE0725LP-01-72C-1	Trenz Electronic GmbH	IC MOD ARTIX-7 A100T 25MHZ 64MB Module/Board Type: FPGA Core Core Processor: Artix-7 A100T Co-Processor: - Speed: 25MHz Flash Size: 64MB RAM Size: - Connector Type: 50 Pin Size / Dimension: 2.87" x 1.38" (73mm x 35mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고4,912	Artix-7 A100T	-	25MHz	64MB	-	50 Pin	2.87" x 1.38" (73mm x 35mm)	0°C ~ 70°C
TE0712-02-82C36-P	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: - Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	-	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0783-02-92I33MA	Trenz Electronic GmbH	HIGH-PERFORMANCE SOM WITH XILINX Module/Board Type: MPU Core Core Processor: Zynq™ 7000 XC7Z045-2FFG900I Co-Processor: ARM Cortex-A9 Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	Zynq™ 7000 XC7Z045-2FFG900I	ARM Cortex-A9	-	32MB	1GB	Board-to-Board (BTB) Socket	3.350" L x 3.350" W (85.00mm x 85.00mm)	-40°C ~ 85°C
ME-XU1-6EG-1I-D11E-G1-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU6EG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0820-05-3BE21MAZ	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: 8GB eMMC, 128MB QSPI RAM Size: 2GB Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	Request a Quote	-	-	-	8GB eMMC, 128MB QSPI	2GB	-	-	-
TE0820-05-4DE81MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	Request a Quote	-	-	-	-	-	-	-	-
L138-DI-336-RI	Critical Link LLC	MITYDSP-L138F SOM W/ OMAP-L138 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	Request a Quote	-	-	-	-	-	-	-	-
TE0820-05-3BI21ML	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: 8GB eMMC, 128MB QSPI RAM Size: 2GB Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	Request a Quote	-	-	-	8GB eMMC, 128MB QSPI	2GB	-	-	-
TE0720-03-64I63MA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 8GB RAM Size: 512MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	패키지: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	8GB	512MB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0813-01-2AE11-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
L138-DI-325-RI	Critical Link LLC	MITYDSP-L138F SOM W/ OMAP-L138 Module/Board Type: MPU, DSP, FPGA Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) Speed: 375MHz Flash Size: 256MB (NAND), 16MB (NOR) RAM Size: 128MB Connector Type: SO-DIMM-200 Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)	375MHz	256MB (NAND), 16MB (NOR)	128MB	SO-DIMM-200	2.660" L x 2.000" W (67.60mm x 50.80mm)	-40°C ~ 85°C
TE0715-05-71I33-A	Trenz Electronic GmbH	IC SOC MODULE Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0841-02-41I21-L	Trenz Electronic GmbH	IC MODULE Module/Board Type: FPGA Core Core Processor: Kintex UltraScale KU040 Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	Kintex UltraScale KU040	-	-	64MB	2GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0820-04-2BI21M	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	Zynq UltraScale+ XCZU2EG-1SFVC784I	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU1-15EG-1E-D12E-G1-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU15EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
TE0820-05-4DI21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU4EV-1SFVC784I Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	Zynq™ UltraScale+™ XCZU4EV-1SFVC784I	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	2GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C

DC-ME-Y402-NC-B

Digi International

MOD ME 8MB SDRAM 4MB FLASH 50P

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

패키지: -

재고2,368

ARM926EJ-S, NS9210

-

75MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

DC-ME-01T-NS-1

Digi International

MODULE ME 8MB SDRAM 2MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고4,848

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

EZ80F916050MODG

Zilog

MODULE FLASH FOR EZ80F91

Module/Board Type: MCU, Ethernet Core
Core Processor: eZ80F91
Co-Processor: -
Speed: 50MHz
Flash Size: 256KB (Internal), 1MB (External)
RAM Size: 16KB (Internal), 512KB (External)
Connector Type: Header 2x30
Size / Dimension: 2.5" x 3.1" (63.5mm x 78.7mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고6,736

eZ80F91

-

50MHz

256KB (Internal), 1MB (External)

16KB (Internal), 512KB (External)

Header 2x30

2.5" x 3.1" (63.5mm x 78.7mm)

0°C ~ 70°C

CC-9C-V212-RJ-25

Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고6,576

ARM926EJ-S, NS9360

-

155MHz

4MB

16MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

CC-MX-PF58-ZK-B

Digi International

MOD WI-IMX287 256M FLASH 25/PK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S i.mx287
Co-Processor: -
Speed: 454MHz
Flash Size: 256MB
RAM Size: 256MB
Connector Type: Edge Connector - 52
Size / Dimension: 2" x 1.38" (51mm x 35mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고5,520

ARM926EJ-S i.mx287

-

454MHz

256MB

Edge Connector - 52

2" x 1.38" (51mm x 35mm)

-40°C ~ 85°C

DC-ME-Y402-S-B

Digi International

MOD ME 9210 8MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

패키지: -

재고4,336

ARM926EJ-S, NS9210

-

75MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

DC-ME4-01T-S-10

Digi International

DIGI CONNECT 4MB FLASH 8MB RAM

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고5,792

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

MOD5234-100IR

NetBurner Inc.

MOD5234 10/100 ETHERNET MODULE

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5234
Co-Processor: -
Speed: 147.5MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.95" x 2" (74.9mm x 50.8mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고4,224

ColdFire 5234

-

147.5MHz

2MB

8MB

RJ-45, 2x50 Header

2.95" x 2" (74.9mm x 50.8mm)

-40°C ~ 85°C

20-101-0517

Digi International

MODULE RABBITCORE RCM3100

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 29.4MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 1.65" (47mm x 42mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고8,820

Rabbit 3000

-

29.4MHz

512KB

2 IDC Headers 2x17

1.85" x 1.65" (47mm x 42mm)

-40°C ~ 85°C

DC-ME-01T-VCY-1

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고7,360

-

TE0820-03-02EG-1EL

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 85°C

패키지: -

재고6,480

Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

2GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 85°C

TE0841-02-035-1I

Trenz Electronic GmbH

SOM USCALE 2GB DDR4

Module/Board Type: FPGA Core
Core Processor: Kintex UltraScale KU035
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고2,576

Kintex UltraScale KU035

-

64MB

2GB

B2B

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

TE0725LP-01-72C-1

Trenz Electronic GmbH

IC MOD ARTIX-7 A100T 25MHZ 64MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 25MHz
Flash Size: 64MB
RAM Size: -
Connector Type: 50 Pin
Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고4,912

Artix-7 A100T

-

25MHz

64MB

-

50 Pin

2.87" x 1.38" (73mm x 35mm)

0°C ~ 70°C

TE0712-02-82C36-P

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: -
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

패키지: -

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-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0783-02-92I33MA

Trenz Electronic GmbH

HIGH-PERFORMANCE SOM WITH XILINX

Module/Board Type: MPU Core
Core Processor: Zynq™ 7000 XC7Z045-2FFG900I
Co-Processor: ARM Cortex-A9
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
Operating Temperature: -40°C ~ 85°C

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Zynq™ 7000 XC7Z045-2FFG900I

ARM Cortex-A9

-

32MB

1GB

Board-to-Board (BTB) Socket

3.350" L x 3.350" W (85.00mm x 85.00mm)

-40°C ~ 85°C

ME-XU1-6EG-1I-D11E-G1-R4-2

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU6EG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0820-05-3BE21MAZ

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 8GB eMMC, 128MB QSPI
RAM Size: 2GB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

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-

8GB eMMC, 128MB QSPI

2GB

-

TE0820-05-4DE81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

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-

L138-DI-336-RI

Critical Link LLC

MITYDSP-L138F SOM W/ OMAP-L138

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

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-

TE0820-05-3BI21ML

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 8GB eMMC, 128MB QSPI
RAM Size: 2GB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

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-

8GB eMMC, 128MB QSPI

2GB

-

TE0720-03-64I63MA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 8GB
RAM Size: 512MB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

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ARM Cortex-A9

Zynq-7000 (Z-7020)

-

8GB

512MB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

TE0813-01-2AE11-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

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Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

2GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

L138-DI-325-RI

Critical Link LLC

MITYDSP-L138F SOM W/ OMAP-L138

Module/Board Type: MPU, DSP, FPGA Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
Speed: 375MHz
Flash Size: 256MB (NAND), 16MB (NOR)
RAM Size: 128MB
Connector Type: SO-DIMM-200
Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm)
Operating Temperature: -40°C ~ 85°C

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ARM926EJ-S, OMAP-L138

TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)

375MHz

256MB (NAND), 16MB (NOR)

128MB

SO-DIMM-200

2.660" L x 2.000" W (67.60mm x 50.80mm)

-40°C ~ 85°C

TE0715-05-71I33-A

Trenz Electronic GmbH

IC SOC MODULE

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0841-02-41I21-L

Trenz Electronic GmbH

IC MODULE

Module/Board Type: FPGA Core
Core Processor: Kintex UltraScale KU040
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

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Kintex UltraScale KU040

-

64MB

2GB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0820-04-2BI21M

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

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Zynq UltraScale+ XCZU2EG-1SFVC784I

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU1-15EG-1E-D12E-G1-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU15EG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

TE0820-05-4DI21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EV-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

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Zynq™ UltraScale+™ XCZU4EV-1SFVC784I

ARM® Cortex®-A53, ARM® Cortex®-R5

-

128MB

2GB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C