이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
패키지: 783-BBGA, FCBGA |
재고5,472 |
|
1 Core, 32-Bit | 1.0GHz | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU Q OR IQ 800MHZ 425TEBGA
|
패키지: 425-FBGA |
재고4,144 |
|
1 Core, 32-Bit | 800MHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | -40°C ~ 105°C (TA) | - | 425-FBGA | 425-TEPBGA I (19x19) |
||
NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA1
|
패키지: 425-FBGA |
재고5,360 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | 0°C ~ 105°C (TA) | - | 425-FBGA | 425-TEPBGA1 |
||
NXP |
IC MPU MPC83XX 533MHZ 672TBGA
|
패키지: 672-LBGA |
재고6,672 |
|
1 Core, 32-Bit | 533MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU MPC83XX 266MHZ 740TBGA
|
패키지: 740-LBGA |
재고6,000 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC74XX 1.267GHZ 360BGA
|
패키지: 360-BCBGA, FCCBGA |
재고5,168 |
|
1 Core, 32-Bit | 1.267GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-BCBGA, FCCBGA | 360-FCCBGA (25x25) |
||
NXP |
IC MPU M680X0 33MHZ 132CQFP
|
패키지: 132-BCQFP |
재고5,712 |
|
1 Core, 32-Bit | 33MHz | - | - | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 132-BCQFP | 132-CQFP (24x24) |
||
NXP |
IC MPU MPC82XX 166MHZ 357BGA
|
패키지: 357-BBGA |
재고3,952 |
|
1 Core, 32-Bit | 166MHz | - | SDRAM | No | - | - | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
Microchip Technology |
IC MPU 603E 233MHZ 255CICBGA
|
패키지: 255-BFCBGA |
재고4,800 |
|
1 Core, 32-Bit | 233MHz | - | - | No | - | - | - | - | 3.3V | -40°C ~ 110°C (TC) | - | 255-BFCBGA | 255-CI-CBGA (21x21) |
||
Microchip Technology |
IC MPU 68000 16.67MHZ 132CQFP
|
패키지: 132-BCQFP |
재고5,424 |
|
1 Core, 32-Bit | 16.67MHz | - | - | No | - | - | - | - | 5.0V | -55°C ~ 125°C (TC) | - | 132-BCQFP | 132-CQFP (24x24) |
||
Zilog |
IC MPU Z80 10MHZ 44QFP
|
패키지: 44-LQFP |
재고3,312 |
|
1 Core, 8-Bit | 10MHz | - | - | No | - | - | - | - | 5.0V | -40°C ~ 100°C (TA) | - | 44-LQFP | 44-QFP |
||
Texas Instruments |
IC MPU INTEL486 SX 25MHZ 132QFP
|
패키지: 132-BQFP Bumpered |
재고5,808 |
|
1 Core, 32-Bit | 25MHz | - | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) |
||
Advantech Corp |
XEON 2.0G 15M 2011P 6CORE E5-261
|
패키지: - |
재고2,976 |
|
6 Core, 64-Bit | 2.0GHz | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU Q OR IQ 2.0GHZ 1295FCBGA
|
패키지: 1295-BBGA, FCBGA |
재고7,136 |
|
2 Core, 64-Bit | 2.0GHz | - | DDR3, DDR3L | No | - | 1 Gbps (5), 10 Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | - | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) |
||
NXP |
IC MPU MPC85XX 600MHZ 783FCBGA
|
패키지: 783-BBGA, FCBGA |
재고4,976 |
|
1 Core, 32-Bit | 600MHz | Security; SEC | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (1) | USB 2.0 (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC82XX 200MHZ 516BGA
|
패키지: 516-BBGA |
재고6,768 |
|
1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC83XX 400MHZ 668BGA
|
패키지: 668-BBGA Exposed Pad |
재고7,904 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 668-BBGA Exposed Pad | 668-PBGA-PGE (29x29) |
||
Intel |
IC MPU I960 66MHZ 132QFP
|
패키지: 132-BQFP Bumpered |
재고5,760 |
|
1 Core, 32-Bit | 66MHz | - | - | No | - | - | - | - | 3.3V | 0°C ~ 100°C (TC) | - | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) |
||
NXP |
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
패키지: 432-TFBGA |
재고5,568 |
|
1 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | 0°C ~ 95°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 432-TFBGA | 432-MAPBGA (13x13) |
||
Microchip Technology |
IC MEDIA PROCESSOR
|
패키지: 292-LFBGA |
재고13,632 |
|
1 Core, 32-Bit | 240MHz | Multimedia: Audio Engine, Security; Real Time Secure | SDRAM, SRAM | Yes | LCD | 10/100 Mbps | - | USB 2.0 OTG (1) | - | - | - | 292-LFBGA | 292-LFBGA (17x17) |
||
NXP |
I.MX 6 SERIES 32-BIT MPU ARM CO
|
패키지: 400-LFBGA |
재고6,368 |
|
2 Core, 32-Bit | 200MHz, 1GHz | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | -20°C ~ 105°C (TJ) | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | 400-LFBGA | 400-MAPBGA (14x14) |
||
Texas Instruments |
MICROCONTROLLER ARM CORTEX
|
패키지: - |
재고2,256 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC MPU RZ/G 1GHZ 361BGA
|
패키지: - |
재고711 |
|
1 Core, 16-Bit | 1GHz | - | DDR3L, DDR4 | No | - | GbE (2) | - | USB 2.0 (2) | - | -40°C ~ 85°C (TA) | AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG | 361-LFBGA | 361-BGA (13x13) |
||
NXP |
S32G234M ARM CORTEX-M7, HSE, LLC
|
패키지: - |
Request a Quote |
|
3 Core, 32/64-Bit | 400MHz | Multimedia; NEON | - | No | - | 1/2.5Gbps (4) | - | - | 1.2V, 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | 525-FBGA, FCBGA | 525-FCPBGA (19x19) |
||
Microchip Technology |
ARM926 MPU, 1GBIT DDR3L,MIPI,LVD
|
패키지: - |
Request a Quote |
|
1 Core, 32-Bit | 800MHz | - | DDR2, DDR3, DDR3L, SDRAM | No | LCD, LVDS, MIPI/DSI | 10/100/1000Mbps (1) | - | USB (3) | 1.8V, 2.5V, 3.3V | -40°C ~ 85°C (TA) | AES, Boot Security, Cryptography, DES, SHA, TRNG | 243-LFBGA | 243-TFBGA (16x16) |
||
Intel |
DOTHAN, PENTIUM M PROCESSOR, 750
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX 6 SERIES 32 BIT MPU, ARM CO
|
패키지: - |
Request a Quote |
|
1 Core, 32-Bit | 1GHz | Multimedia; NEON™ SIMD | DDR3, LPDDR2 | Yes | LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1) | 1.2V, 1.8V, 3V | 0°C ~ 95°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 432-TFBGA | 432-MAPBGA (13x13) |
||
IBM |
IC MPU 200MHZ 278FCPBGA
|
패키지: - |
Request a Quote |
|
1 Core, 32-Bit | 200MHz | - | - | No | - | - | - | - | 2.5V, 3.3V | 0°C ~ 105°C (TJ) | - | 278-BBGA, FCBGA | 278-FCPBGA (21x21) |