이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC SOC 64BIT 8X1.5GHZ 780FCBGA
|
패키지: 780-FBGA, FCBGA |
재고7,808 |
|
4 Core, 64-Bit | 1.8GHz | - | DDR3, DDR3L | No | - | 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | - | 780-FBGA, FCBGA | 780-FCPBGA (23x23) |
||
NXP |
IC SOC 64BIT 8X1.2GHZ 780FCBGA
|
패키지: 780-FBGA, FCBGA |
재고5,584 |
|
4 Core, 64-Bit | 1.8GHz | - | DDR3, DDR3L | No | - | 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | - | 780-FBGA, FCBGA | 780-FCPBGA (23x23) |
||
NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
|
패키지: 783-BBGA, FCBGA |
재고6,992 |
|
1 Core, 32-Bit | 1.333GHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.067GHZ 783BGA
|
패키지: 783-BBGA, FCBGA |
재고2,096 |
|
1 Core, 32-Bit | 1.067GHz | Communications; QUICC Engine, Security; SEC | DDR2, DDR3, SDRAM | No | - | 10/100 Mbps (8), 1 Gbps (4) | - | USB 2.0 (1) | 1.0V, 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
|
패키지: 783-BBGA, FCBGA |
재고7,360 |
|
1 Core, 32-Bit | 1.333GHz | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC86XX 1.067GHZ 994BGA
|
패키지: 994-BCBGA, FCCBGA |
재고8,556 |
|
1 Core, 32-Bit | 1.067GHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 994-BCBGA, FCCBGA | 994-FCCBGA (33x33) |
||
NXP |
IC MPU Q OR IQ 1.2GHZ 689TEBGA
|
패키지: 689-BBGA Exposed Pad |
재고6,960 |
|
2 Core, 32-Bit | 1.2GHz | Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | 0°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC86XX 1.25GHZ 1023BGA
|
패키지: 1023-BCBGA, FCCBGA |
재고6,848 |
|
2 Core, 32-Bit | 1.25GHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BCBGA, FCCBGA | 1023-FCCBGA (33x33) |
||
NXP |
IC MPU MPC74XX 600MHZ 360FCCLGA
|
패키지: 360-CLGA, FCCLGA |
재고5,472 |
|
1 Core, 32-Bit | 600MHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-CLGA, FCCLGA | 360-FCCLGA (25x25) |
||
NXP |
IC MPU M683XX 25MHZ 240FQFP
|
패키지: 240-BFQFP |
재고6,768 |
|
1 Core, 32-Bit | 25MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 240-BFQFP | 240-FQFP (32x32) |
||
NXP |
IC MPU Q OR IQ 1.2GHZ 780FCBGA
|
패키지: 780-BFBGA |
재고7,728 |
|
4 Core, 32-Bit | 1.2GHz | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (5) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | 780-BFBGA | 780-FCPBGA (23x23) |
||
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
|
패키지: 783-BBGA, FCBGA |
재고5,328 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
패키지: 689-BBGA Exposed Pad |
재고7,456 |
|
1 Core, 32-Bit | 1.055GHz | - | DDR2, DDR3 | No | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
Texas Instruments |
IC MPU OMAP-35XX 600MHZ 515FCBGA
|
패키지: 515-VFBGA, FCBGA |
재고2,544 |
|
1 Core, 32-Bit | 600MHz | Signal Processing; C64x+, Multimedia; NEON? SIMD | LPDDR | Yes | LCD | - | - | USB 1.x (3), USB 2.0 (1) | 1.8V, 3.0V | -40°C ~ 105°C (TJ) | - | 515-VFBGA, FCBGA | 515-POP-FCBGA (12x12) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
패키지: 256-BBGA |
재고6,192 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | 0°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
패키지: 425-FBGA |
재고4,032 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | 0°C ~ 105°C (TA) | - | 425-FBGA | 425-TEPBGA I (19x19) |
||
Texas Instruments |
IC MPU SITARA 600MHZ 298NFBGA
|
패키지: 298-LFBGA |
재고6,792 |
|
1 Core, 32-Bit | 600MHz | Multimedia; NEON? SIMD | LPDDR, DDR2, DDR3, DDR3L | Yes | LCD, Touchscreen | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | -40°C ~ 105°C (TJ) | Cryptography, Random Number Generator | 298-LFBGA | 298-NFBGA (13x13) |
||
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
패키지: 689-BBGA Exposed Pad |
재고7,184 |
|
1 Core, 32-Bit | 667MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
Intel |
IC MPU INTEL 266MHZ PBGA544
|
패키지: - |
Request a Quote |
|
1 Core, 32-Bit | 266MHz | Communications; Network Processor Engine, Math Engine; Multiply Accumulate | DDR, SDRAM | No | - | Mll (3), SMII (3) | - | USB 1.1 (1), USB 2.0 (1) | 2.5V, 3.3V | 0°C ~ 70°C (TA) | 3DES, AES, DES, MD5, RNG, SHA1 | 544-BBGA | 544-PBGA (35x35) |
||
MaxLinear, Inc. |
IC PROC S7120 IND 361FBGA
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Motorola |
IC MPU MPC86XX 100MHZ 357BGA
|
패키지: - |
Request a Quote |
|
1 Core, 32-Bit | 100MHz | Communications; CPM | SDRAM, SRAM | No | - | 10Mbps (4), 10/100Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TJ) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
I.MX 8QUADXPLUS 21X21
|
패키지: - |
Request a Quote |
|
3 Core, 64-Bit | 1.2GHz, 264MHz | Multimedia; NEON, Hi-Fi4 DSP | DDR3L SDRAM, LPDDR4 DRAM | Yes | LCD, LVDS, MIPI-CSI, MIPI-DSI | 10/100/1000Mbps (2) | - | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | 1.8V, 2.5V, 3.3V | - | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | 609-BFBGA | 609-FBGA (21x21) |
||
Intel |
IC MPU 80486 25MHZ 168CPGA
|
패키지: - |
Request a Quote |
|
1 Core, 32-Bit | 25MHz | - | - | No | - | - | - | - | 5V | -55°C ~ 125°C (TC) | - | 168-BCPGA | 168-CPGA (44.45x44.45) |
||
Intersil |
IC MPU 80C86 5MHZ 40CERDIP
|
패키지: - |
Request a Quote |
|
1 Core, 16-Bit | 5MHz | - | - | No | - | - | - | - | 5V | -55°C ~ 125°C (TC) | - | 40-CDIP (0.600", 15.24mm) | 40-CERDIP |
||
NXP |
IC MPU QORLQ 1.8GHZ 1517FCPBGA
|
패키지: - |
Request a Quote |
|
8 Core, 64-Bit | 1.8GHz | - | DDR4 | Yes | - | 100Gbps (2) | SATA 3.0 (4) | USB 3.0 (2) + PHY (2) | 1.2V, 1.8V, 3.3V | -40°C ~ 105°C (TJ) | Secure Boot, TrustZone® | 1517-BBGA, FCBGA | 1517-FCPBGA (40x40) |
||
NXP |
I.MX 8DUALXPLUS
|
패키지: - |
Request a Quote |
|
3 Core, 64-Bit | 1.2GHz, 264MHz | Multimedia; NEON, Hi-Fi4 DSP | DDR3L SDRAM, LPDDR4 DRAM | Yes | LCD, LVDS, MIPI-CSI, MIPI-DSI | 10/100/1000Mbps (2) | - | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TJ) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | 609-BFBGA | 609-FBGA (21x21) |
||
Renesas |
IC MPU RZ 600/800MHZ 176LFQFP
|
패키지: - |
Request a Quote |
|
1 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | 10/100/1000Mbps (2) | - | USB 2.0 (1) | 1.8V, 3.3V | -40°C ~ 125°C (TJ) | Boot Security, Crypto Accelerator, JTAG, TRNG | 176-LQFP Exposed Pad | 176-LFQFP (24x24) |
||
NXP |
POWERQUICC 32 BIT POWER ARCHITEC
|
패키지: - |
Request a Quote |
|
1 Core, 32-Bit | 133MHz | Communications; CPM | DRAM | No | - | 10Mbps (1), 10/100Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |