이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
|
패키지: 783-BBGA, FCBGA |
재고7,040 |
|
1 Core, 32-Bit | 1.333GHz | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
패키지: 425-FBGA |
재고4,080 |
|
1 Core, 32-Bit | 1.0GHz | Security; SEC 4.4 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | 0°C ~ 105°C (TA) | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | 425-FBGA | 425-TEPBGA I (19x19) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
패키지: 689-BBGA Exposed Pad |
재고5,280 |
|
1 Core, 32-Bit | 800MHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC86XX 1.5GHZ 1023FCCBGA
|
패키지: 1023-BCBGA, FCCBGA |
재고5,984 |
|
2 Core, 32-Bit | 1.5GHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BCBGA, FCCBGA | 1023-FCCBGA (33x33) |
||
NXP |
IC MPU MPC85XX 1.067GHZ 1023BGA
|
패키지: 1023-BFBGA, FCBGA |
재고5,136 |
|
2 Core, 32-Bit | 1.067GHz | Signal Processing; SPE | DDR2, DDR3 | No | - | 10/100/1000 Mbps (4) | - | - | 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BFBGA, FCBGA | 1023-FCPBGA (33x33) |
||
IDT, Integrated Device Technology Inc |
IC MPU INTERPRISE 150MHZ 256BGA
|
패키지: 256-BBGA |
재고10,152 |
|
1 Core, 32-Bit | 150MHz | - | SDRAM | No | - | - | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 256-BBGA | 256-PBGA (17x17) |
||
IDT, Integrated Device Technology Inc |
IC MPU INTERPRISE 133MHZ 208QFP
|
패키지: 208-BFQFP |
재고4,352 |
|
1 Core, 32-Bit | 133MHz | - | SDRAM | No | - | - | - | - | 3.3V | -40°C ~ 85°C (TA) | - | 208-BFQFP | 208-PQFP (28x28) |
||
Cirrus Logic Inc. |
IC MPU EP7 74MHZ 208LQFP
|
패키지: 208-LQFP |
재고3,696 |
|
1 Core, 32-Bit | 74MHz | - | SDRAM | No | Keypad, LCD, Touchscreen | - | - | - | 2.5V, 2.7V, 3.0V, 3.3V | -40°C ~ 85°C (TA) | Hardware ID | 208-LQFP | 208-LQFP |
||
NXP |
IC MPU MPC83XX 266MHZ 620BGA
|
패키지: 620-BBGA Exposed Pad |
재고4,592 |
|
1 Core, 32-Bit | 266MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC82XX 266MHZ 408TBGA
|
패키지: 480-LBGA |
재고2,912 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU I.MXL 150MHZ 225MAPBGA
|
패키지: 225-LFBGA |
재고4,240 |
|
1 Core, 32-Bit | 150MHz | - | SDRAM | No | LCD | - | - | USB 1.x (1) | 1.8V, 3.0V | -40°C ~ 85°C (TA) | - | 225-LFBGA | 225-MAPBGA (13x13) |
||
NXP |
IC MPU MPC8XX 80MHZ 357BGA
|
패키지: 357-BBGA |
재고6,480 |
|
1 Core, 32-Bit | 80MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 115°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC82XX 350MHZ 352TBGA
|
패키지: 352-LBGA |
재고7,920 |
|
1 Core, 32-Bit | 350MHz | - | SDRAM | No | - | - | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 352-LBGA | 352-TBGA (35x35) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
패키지: 256-BBGA |
재고7,744 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | -40°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC82XX 300MHZ 408TBGA
|
패키지: 480-LBGA |
재고6,688 |
|
1 Core, 32-Bit | 300MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
|
패키지: 783-BBGA, FCBGA |
재고5,184 |
|
1 Core, 32-Bit | 1.333GHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU M683XX 25MHZ 357BGA
|
패키지: 357-BBGA |
재고7,152 |
|
1 Core, 32-Bit | 25MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC82XX 200MHZ 357BGA
|
패키지: 357-BBGA |
재고7,056 |
|
1 Core, 32-Bit | 200MHz | - | SDRAM | No | - | - | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
Microchip Technology |
IC MCU 32BIT 196TFBGA
|
패키지: 196-TFBGA, CSBGA |
재고4,256 |
|
1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 105°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 196-TFBGA, CSBGA | 196-TFBGA (11x11) |
||
Renesas Electronics Corporation |
IC MPU RZ/A2M 528MHZ 256LFBGA
|
패키지: - |
재고594 |
|
1 Core | 528MHz | Multimedia; NEON™ MPE | - | Yes | LCD, LVDS, MIPICSI2, Video | - | - | USB 2.0 (1) | - | -40°C ~ 85°C (TA) | AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 | 256-LFBGA | 256-LFBGA (11x11) |
||
NXP |
IC MPU 609FBGA
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | 609-BFBGA | 609-FBGA (21x21) |
||
NXP |
I.MX 8DUALXPLUS 21X21
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU QORIQ 1.5GHZ 448FBGA
|
패키지: - |
재고225 |
|
2 Core, 64-Bit | 1.5GHz | - | DDR3L, DDR4 | Yes | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | USB 3.0 (2) | - | -40°C ~ 105°C (TA) | Secure Boot, TrustZone® | 448-BFBGA | 448-FBGA (17x17) |
||
Texas Instruments |
PROTOTYPE
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Intel |
IC MPU 266MHZ 492BGA
|
패키지: - |
Request a Quote |
|
1 Core, 32-Bit | 266MHz | Communications; Network Processor Engine, Math Engine; Multiply-Accumulate | SDRAM | No | - | 10/100Mbps (2) | - | USB 1.1 (1) | 3.3V | 0°C ~ 70°C (TA) | Cryptography | 492-BBGA | 492-BGA (35x35) |
||
Advanced Micro Devices |
IC MPU I186 12MHZ
|
패키지: - |
Request a Quote |
|
1 Core, 16-Bit | 12MHz | - | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | - | - |
||
NXP |
IC MPU QORIQ 1.3GHZ 448FBGA
|
패키지: - |
Request a Quote |
|
2 Core, 64-Bit | 1.3GHz | - | DDR3L SDRAM, DDR4 SDRAM | - | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | - | - | -40°C ~ 105°C (TA) | - | 448-BFBGA | 448-FBGA (17x17) |
||
NXP |
MIMX8DX6CVLFZAC
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |