페이지 11 - 내장형 - 단일 칩 시스템(SoC) | 집적 회로(IC) | Heisener Electronics
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내장형 - 단일 칩 시스템(SoC)

기록 5,589
페이지  11/200
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
10AS048E2F29E1SG
Altera

IC SOC FPGA 360 I/O 780FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 480K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
패키지: 780-BBGA, FCBGA
재고5,376
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 480K Logic Elements
0°C ~ 100°C (TJ)
780-BBGA, FCBGA
780-FBGA (29x29)
5ASTMD3E3F31I3N
Altera

IC FPGA 170 I/O 896FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.05GHz
  • Primary Attributes: FPGA - 350K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
패키지: 896-BBGA, FCBGA
재고2,304
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.05GHz
FPGA - 350K Logic Elements
-40°C ~ 100°C (TJ)
896-BBGA, FCBGA
896-FBGA (31x31)
5CSEBA6U19A7N
Altera

IC FPGA 66 I/O 484UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 700MHz
  • Primary Attributes: FPGA - 110K Logic Elements
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 484-FBGA
  • Supplier Device Package: 484-UBGA (19x19)
패키지: 484-FBGA
재고3,296
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
64KB
DMA, POR, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
700MHz
FPGA - 110K Logic Elements
-40°C ~ 125°C (TJ)
484-FBGA
484-UBGA (19x19)
XCZU6EG-1FFVC900I
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
패키지: 900-BBGA, FCBGA
재고5,968
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 469K+ Logic Cells
-40°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
M2S090-FCS325I
Microsemi Corporation

IC FPGA SOC 90K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 90K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
패키지: 325-TFBGA
재고3,248
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 90K Logic Modules
-40°C ~ 100°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S060TS-VFG400
Microsemi Corporation

IC FPGA SOC 60K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 60K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-VFBGA (17x17)
패키지: 400-LFBGA
재고2,960
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 60K Logic Modules
0°C ~ 85°C (TJ)
400-LFBGA
400-VFBGA (17x17)
M2S010TS-1FGG484M
Microsemi Corporation

IC FPGA SOC 10K LUTS 484FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 10K Logic Modules
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
패키지: 484-BGA
재고2,592
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 10K Logic Modules
-55°C ~ 125°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S060-1FCS325I
Microsemi Corporation

IC FPGA SOC 60K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 60K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
패키지: 325-TFBGA
재고4,848
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 60K Logic Modules
-40°C ~ 100°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S060T-FCSG325I
Microsemi Corporation

IC FPGA SOC 60K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 60K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
패키지: 325-TFBGA
재고3,744
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 60K Logic Modules
-40°C ~ 100°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S005-1TQ144
Microsemi Corporation

IC FPGA SOC 5K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 64KB
  • Peripherals: DDR
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 5K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고7,360
ARM? Cortex?-M3
128KB
64KB
DDR
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 5K Logic Modules
0°C ~ 85°C (TJ)
144-LQFP
144-TQFP (20x20)
10AS057N1F40I1SG
Intel

IC SOC FPGA 588 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 570K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
패키지: 1517-BBGA, FCBGA
재고6,976
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 570K Logic Elements
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
BCM3384MDKFSBG
Broadcom Limited

CABLE MODEM

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고5,232
-
-
-
-
-
-
-
-
-
-
hot BCM3384GKFSBG
Broadcom Limited

CABLE MODEM

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고64,332
-
-
-
-
-
-
-
-
-
-
5CSEBA6U23C8SN
Intel

IC FPGA 145 I/O 672UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz
  • Primary Attributes: FPGA - 110K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-FBGA
  • Supplier Device Package: 672-UBGA (23x23)
패키지: 672-FBGA
재고7,744
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz
FPGA - 110K Logic Elements
0°C ~ 85°C (TJ)
672-FBGA
672-UBGA (23x23)
5CSEBA2U23C8SN
Intel

IC FPGA 188 I/O 672UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz
  • Primary Attributes: FPGA - 25K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-FBGA
  • Supplier Device Package: 672-UBGA (23x23)
패키지: 672-FBGA
재고4,720
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz
FPGA - 25K Logic Elements
0°C ~ 85°C (TJ)
672-FBGA
672-UBGA (23x23)
XCZU1EG-L1SFVC784I
AMD

IC ZUP MPSOC LP A53 FPGA 784BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: -
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: -
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BFBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
-
256KB
DMA, WDT
-
500MHz, 600MHz, 1.2GHz
-
-40°C ~ 100°C (TJ)
784-BFBGA, FCBGA
784-FCBGA (23x23)
AGIC040R39A1E2V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 4.047M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3948-BFBGA Exposed Pad
  • Supplier Device Package: 3948-BGA (56x56)
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 4.047M Logic Elements
0°C ~ 100°C (TJ)
3948-BFBGA Exposed Pad
3948-BGA (56x56)
AGFD019R24C2E2VB
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 1.9M Logic Elements
0°C ~ 100°C (TJ)
2340-BFBGA Exposed Pad
2340-BGA (45x42)
XCZU57DR-L1FSVE1156I
AMD

IC ZUP RFSOC A53 FPGA LP 1156BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size: -
  • RAM Size: -
  • Peripherals: DDR, DMA, PCIe, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 1.2GHz
  • Primary Attributes: Zynq® UltraScale+™ RFSoC
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
-
-
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq® UltraScale+™ RFSoC
-40°C ~ 100°C (TJ)
1156-BBGA, FCBGA
1156-FCBGA (35x35)
AGFB014R24C3E3E
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.4M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 1.4M Logic Elements
0°C ~ 100°C (TJ)
-
-
AGFB008R24C2E2VB
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 764K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 764K Logic Elements
0°C ~ 100°C (TJ)
2340-BFBGA Exposed Pad
2340-BGA (45x42)
MPFS250TL-FCVG784I
Microchip Technology

IC SOC RISC-V 784FCBGA

  • Architecture: MPU, FPGA
  • Core Processor: RISC-V
  • Flash Size: 128kB
  • RAM Size: 2.2MB
  • Peripherals: DMA, PCI, PWM
  • Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
  • Speed: -
  • Primary Attributes: FPGA - 254K Logic Modules
  • Operating Temperature: -40°C ~ 100°C
  • Package / Case: 784-BFBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
패키지: -
재고6
RISC-V
128kB
2.2MB
DMA, PCI, PWM
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
-
FPGA - 254K Logic Modules
-40°C ~ 100°C
784-BFBGA, FCBGA
784-FCBGA (23x23)
AGFB022R31C3I3V
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.2M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.2M Logic Elements
-40°C ~ 100°C (TJ)
-
-
TCI6630K2LXCMSA2
Texas Instruments

PROTOTYPE

  • Architecture: DSP, MPU
  • Core Processor: Dual ARM® Cortex®-A15 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 3MB
  • Peripherals: DDR, DMA, PCIe, POR, WDT
  • Connectivity: Ethernet, I2C, PCIe, SPI, UART/USART, USB
  • Speed: 1.2GHz
  • Primary Attributes: -
  • Operating Temperature: -40°C ~ 100°C (TC)
  • Package / Case: 900-BFBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (25x25)
패키지: -
Request a Quote
Dual ARM® Cortex®-A15 MPCore™ with CoreSight™
-
3MB
DDR, DMA, PCIe, POR, WDT
Ethernet, I2C, PCIe, SPI, UART/USART, USB
1.2GHz
-
-40°C ~ 100°C (TC)
900-BFBGA, FCBGA
900-FCBGA (25x25)
AGFB023R31C2I2VB
Intel

IC FPGA AGILEX-F 3184BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
패키지: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.3M Logic Elements
-40°C ~ 100°C (TJ)
3184-BFBGA Exposed Pad
3184-BGA (56x45)
1SX040HH1F35I1VG
Intel

IC FPGA STRATIX10SX 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 400K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 400K Logic Elements
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FBGA (35x35)
XCVC1902-2MSIVIVA1596
AMD

IC VERSAL AICORE FPGA 1596BGA

  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.4GHz
  • Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1596-BFBGA, FCBGA
  • Supplier Device Package: 1596-FCBGA (40x40)
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
-
256KB
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.4GHz
Versal™ AI Core FPGA, 1.9M Logic Cells
-40°C ~ 100°C (TJ)
1596-BFBGA, FCBGA
1596-FCBGA (40x40)
1SX250HH2F55E2LG
Intel

IC FPGA STRATIX 10 2912FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2912-BBGA, FCBGA
  • Supplier Device Package: 2912-FBGA, FC (55x55)
패키지: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 2500K Logic Elements
0°C ~ 100°C (TJ)
2912-BBGA, FCBGA
2912-FBGA, FC (55x55)