페이지 48 - 내장형 - 단일 칩 시스템(SoC) | 집적 회로(IC) | Heisener Electronics
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내장형 - 단일 칩 시스템(SoC)

기록 5,589
페이지  48/200
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제조업체
설명
패키지
재고
수량
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
10AS057N3F40E2LG
Altera

IC SOC FPGA 588 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 570K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
패키지: 1517-BBGA, FCBGA
재고4,896
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 570K Logic Elements
0°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
XCZU2EG-L1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
패키지: 784-BBGA, FCBGA
재고5,376
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 103K+ Logic Cells
-40°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
XCZU2EG-2SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
패키지: 784-BBGA, FCBGA
재고4,704
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 103K+ Logic Cells
0°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
M2S025-FCS325I
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
패키지: 325-TFBGA
재고5,088
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
-40°C ~ 100°C (TJ)
325-TFBGA
325-BGA (11x11)
XC7Z030-2FBG676I
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고6,256
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
Kintex?-7 FPGA, 125K Logic Cells
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
hot XC7Z020-1CLG484C
Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 484BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-LFBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
패키지: 484-LFBGA, CSPBGA
재고7,616
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Artix?-7 FPGA, 85K Logic Cells
0°C ~ 85°C (TJ)
484-LFBGA, CSPBGA
484-CSPBGA (19x19)
BCM33843MVKFSBG
Broadcom Limited

CABLE MODEM

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고7,776
-
-
-
-
-
-
-
-
-
-
10AS048K2F35I2LG
Intel

1152-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 480K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고3,568
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 480K Logic Elements
-40°C ~ 100°C (TJ)
-
-
10AS066N3F40E2SG
Intel

IC SOC FPGA 588 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 660K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
패키지: 1517-BBGA, FCBGA
재고2,032
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 660K Logic Elements
0°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
10AS057H4F34I3SG
Intel

IC SOC FPGA 492 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 570K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
패키지: 1152-BBGA, FCBGA
재고6,976
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 570K Logic Elements
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
10AS027H3F34E2LG
Intel

1152-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 270K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고5,152
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 270K Logic Elements
0°C ~ 100°C (TJ)
-
-
AGIA040R39A2I2V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 4.047M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3948-BFBGA Exposed Pad
  • Supplier Device Package: 3948-BGA (56x56)
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 4.047M Logic Elements
-40°C ~ 100°C (TJ)
3948-BFBGA Exposed Pad
3948-BGA (56x56)
AGID041R29D2E2VR1
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 4M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2957-BFBGA Exposed Pad
  • Supplier Device Package: 2957-BGA (56x45)
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 4M Logic Elements
0°C ~ 100°C (TJ)
2957-BFBGA Exposed Pad
2957-BGA (56x45)
XCZU1CG-L1UBVA494I
AMD

IC ZUP MPSOC CG A53 FPGA 494BGA

  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: -
  • Speed: 500MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 494-WFBGA, FCBGA
  • Supplier Device Package: 494-FCBGA (14x14)
패키지: -
Request a Quote
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
-
256KB
DMA, WDT
-
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
-40°C ~ 100°C (TJ)
494-WFBGA, FCBGA
494-FCBGA (14x14)
XCVM1402-2LLEVFVC1596
AMD

IC VERSALPRIME ACAP FPGA 1596BGA

  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size: -
  • RAM Size: -
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 450MHz, 1.08GHz
  • Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1596-BFBGA
  • Supplier Device Package: 1596-BGA (37.5x37.5)
패키지: -
Request a Quote
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
-
-
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
450MHz, 1.08GHz
Versal™ Prime FPGA, 1.2M Logic Cells
0°C ~ 100°C (TJ)
1596-BFBGA
1596-BGA (37.5x37.5)
AGID019R31B2I2V
Intel

IC FPGA AGILEX-I 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 1.9M Logic Elements
-40°C ~ 100°C (TJ)
3184-BFBGA Exposed Pad
3184-BGA (56x45)
AGFA027R25A2E3E
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.7M Logic Elements
0°C ~ 100°C (TJ)
-
-
BCM5892PD0KFBG
Broadcom Limited

BCM5892 400MHZ CU WIREBOND

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
MPFS095T-1FCVG784T2
Microchip Technology

IC SOC RISC-V 784FCBGA

  • Architecture: MPU, FPGA
  • Core Processor: RISC-V
  • Flash Size: 128KB
  • RAM Size: 857.6KB
  • Peripherals: DMA, PCI, PWM
  • Connectivity: CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
  • Speed: -
  • Primary Attributes: FPGA - 93K Logic Modules
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 784-BFBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
패키지: -
Request a Quote
RISC-V
128KB
857.6KB
DMA, PCI, PWM
CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
-
FPGA - 93K Logic Modules
-40°C ~ 125°C (TJ)
784-BFBGA, FCBGA
784-FCBGA (23x23)
AGIB022R31B1I2V
Intel

IC FPGA AGILEX-I 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.2M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.2M Logic Elements
-40°C ~ 100°C (TJ)
-
-
AGIC035R39A1I1V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 3.54M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3948-BFBGA Exposed Pad
  • Supplier Device Package: 3948-BGA (56x56)
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 3.54M Logic Elements
-40°C ~ 100°C (TJ)
3948-BFBGA Exposed Pad
3948-BGA (56x56)
XCZU48DR-2FFVG1517E
AMD

IC ZUP RFSOC A53 FPGA 1517BGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.333GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
-
256KB
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.333GHz
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
0°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
AGFB012R24D1E2V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
패키지: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 1.2M Logic Elements
0°C ~ 100°C (TJ)
2340-BFBGA Exposed Pad
2340-BGA (45x42)
TDA2SABRQABCRQ1
Texas Instruments

SOC PROCESSOR W/ HIGHLY-FEATURED

  • Architecture: DSP, MPU
  • Core Processor: ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
  • Flash Size: -
  • RAM Size: 2.5MB
  • Peripherals: DMA, POR, PWM, WDT
  • Connectivity: CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
  • Speed: 750MHz, 750MHz
  • Primary Attributes: -
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 760-BFBGA, FCBGA
  • Supplier Device Package: 760-FCBGA (23x23)
패키지: -
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ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
-
2.5MB
DMA, POR, PWM, WDT
CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
750MHz, 750MHz
-
-40°C ~ 125°C (TJ)
760-BFBGA, FCBGA
760-FCBGA (23x23)
AGFB027R25A1E1V
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.7M Logic Elements
0°C ~ 100°C (TJ)
-
-
1SX280HU3F50E2LGS3
Intel

IC FPGA STRATIX 10 2397FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2800K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
패키지: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 2800K Logic Elements
0°C ~ 100°C (TJ)
2397-BBGA, FCBGA
2397-FBGA, FC (50x50)
XCZU49DR-L2FFVF1760I
AMD

IC ZUP RFSOC A53 FPGA LP 1760BGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.333GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
패키지: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
-
256KB
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.333GHz
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-40°C ~ 100°C (TJ)
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
XCZU1EG-1SFVC784E
AMD

IC ZUP MPSOC A53 FPGA 784BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: -
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: -
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BFBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
패키지: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
-
256KB
DMA, WDT
-
500MHz, 600MHz, 1.2GHz
-
0°C ~ 100°C (TJ)
784-BFBGA, FCBGA
784-FCBGA (23x23)