이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
IC DRIVER ISO 9141 8SOIC
|
패키지: - |
재고4,880 |
|
- | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SMOKE DETECT PHOTO MEM 16SOIC
|
패키지: 16-SOIC (0.295", 7.50mm Width) |
재고6,976 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Texas Instruments |
IC IMAGE SENSOR
|
패키지: - |
재고6,928 |
|
Logic | Logic | - | 2mA | -20°C ~ 45°C | - | - | - |
||
ON Semiconductor |
IC TACH/SPEEDO DRIVER 16-DIP
|
패키지: 16-DIP (0.300", 7.62mm) |
재고5,760 |
|
Voltage | Differential | - | 125mA | -40°C ~ 105°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
Texas Instruments |
IC V TO I CONVERTER/XMTR 16 DIP
|
패키지: 16-DIP (0.300", 7.62mm) |
재고6,720 |
|
Voltage | Current | - | 20mA | 0°C ~ 70°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Analog Devices Inc. |
IC THERMOCOUPLE A W/COMP 8MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고4,192 |
|
Differential | Analog | - | 250µA | 25°C ~ 100°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Melexis Technologies NV |
IC OPTICAL PROXIMITY 24QFN
|
패키지: - |
재고4,176 |
|
- | - | - | 2.1mA | -40°C ~ 125°C | - | - | - |
||
Microchip Technology |
IC SENSOR FUSION MOVEA 84TFBGA
|
패키지: 84-TFBGA |
재고6,352 |
|
- | - | I2C | - | - | Surface Mount | 84-TFBGA | 84-TFBGA (6x6) |
||
Melexis Technologies NV |
IC OPTICAL PROXIMITY
|
패키지: - |
재고4,512 |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
IC THRMOCPLE COLD JNC COMP 8MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고7,792 |
|
Differential | Analog | - | 250µA | 0°C ~ 50°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Maxim Integrated |
IC CONV THERMOCOUPLE-DGTL 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고7,744 |
|
Thermocouple (J) | Digital | SPI | 900µA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC FDC CAPTIVE SENSING 16WQFN
|
패키지: 16-WFQFN Exposed Pad |
재고5,616 |
|
Capacitive | I2C | - | 2.1mA | -40°C ~ 125°C | Surface Mount | 16-WFQFN Exposed Pad | 16-WQFN (4x4) |
||
Maxim Integrated |
IC HALL EFFECT SENSOR 10UMAX
|
패키지: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
재고6,832 |
|
Logic | Analog, Digital | 2-Wire | 1mA | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
||
Microchip Technology |
IC PROXIMITY DETECTOR 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고4,256 |
|
- | - | I2C | - | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC HORN DRIVER DUAL 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고7,360 |
|
Logic | Logic | Logic | 100nA | 0°C ~ 50°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Analog Devices Inc. |
IC SIGNAL COND STRAIN GAUGE 28DI
|
패키지: 28-DIP (0.600", 15.24mm) |
재고6,800 |
|
Voltage | Voltage | - | 10mA | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Maxim Integrated |
IC CONV THERMOCOUPLE-DGTL SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고253,860 |
|
Thermocouple (Multiple) | Digital | SPI | 900µA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Maxim Integrated |
IC TIME-TO-DGTL CONV W/AFE TQFP
|
패키지: 32-TQFP Exposed Pad |
재고6,384 |
|
CMOS | CMOS | Serial | - | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP (5x5) |
||
Texas Instruments |
IC 4-20 MA I-TRANSMITTER 14-DIP
|
패키지: 14-DIP (0.300", 7.62mm) |
재고6,048 |
|
Differential | Voltage | 3-Wire | 20mA | -40°C ~ 85°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
||
Texas Instruments |
IC KNOCK SENSOR INTERFACE 20SOIC
|
패키지: 20-SOIC (0.295", 7.50mm Width) |
재고109,788 |
|
Serial | Serial | SPI | 20mA | -40°C ~ 125°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Maxim Integrated |
IC SENSOR INTERFACE VARI 16-QSOP
|
패키지: 16-SSOP (0.154", 3.90mm Width) |
재고5,808 |
|
Differential | Logic | Differential | 10mA | -40°C ~ 125°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
Melexis Technologies NV |
AUTOMOTIVE SENSOR INTERFACE
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고2,384 |
|
Differential | - | - | 8mA | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
THERMOCOUPLE I2C CONVERTER
|
패키지: 20-VQFN Exposed Pad |
재고19,020 |
|
Thermocouple | I²C | - | 2.5mA | -40°C ~ 125°C (TA) | Surface Mount | 20-VQFN Exposed Pad | 20-MQFN (5x5) |
||
Renesas Electronics Corporation |
AUTOMOTIVE SENSOR SIGNAL CONDITI
|
패키지: - |
재고15,000 |
|
- | 1-Wire®, I2C | - | - | -40°C ~ 150°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
MULTI-MODAL OPTICAL AFE, I2C
|
패키지: - |
재고4,440 |
|
Analog, Digital | I2C, SPI | - | 10 µA | -40°C ~ 85°C (TA) | Surface Mount | 33-UFBGA, WLCSP | 33-WLCSP (3.11x2.14) |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |