이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
IC CONTROLLER PCM 80MQFP
|
패키지: 80-QFP |
재고5,952 |
|
ISDN, PCM | 1 | 5V | 15mA | - | 0°C ~ 70°C | Surface Mount | 80-QFP | PG-MQFP-80 |
|
|
Microsemi Corporation |
IC VOICEPORT 1CH FXS 8KHZ 44LQFP
|
패키지: 44-LQFP |
재고116,184 |
|
PCM | 1 | - | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
|
|
|
Microsemi Corporation |
IC CESOP PROCESSOR 32CH 324BGA
|
패키지: 324-BGA |
재고7,840 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
|
|
|
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
패키지: 144-BGA, CSPBGA |
재고4,976 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
|
|
|
Maxim Integrated |
IC FRAMER OCTAL T1/E1 CSBGA
|
패키지: 256-LBGA, CSBGA |
재고3,824 |
|
WAN | 8 | 3.135 V ~ 3.465 V | 275mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
|
|
|
Exar Corporation |
IC LIU/FRAMER DS3/E3 1CH 208BGA
|
패키지: 208-LBGA |
재고5,760 |
|
LIU | - | 3.15 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-STBGA (17x17) |
|
|
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 8CH SHORT 144-TQFP
|
패키지: 144-LQFP |
재고2,496 |
|
LIU | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
|
|
Cypress Semiconductor Corp |
IC TXRX HOTLINK 256LBGA
|
패키지: 256-LBGA Exposed Pad |
재고6,416 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 590mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
|
|
Maxim Integrated |
IC FRAMER DUAL T1 LIU 100-LQFP
|
패키지: 100-LQFP |
재고3,952 |
|
Parallel/Serial | 2 | 3.135 V ~ 3.465 V | 85mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
|
|
|
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
패키지: 16-VDFN Exposed Pad |
재고2,240 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
|
|
Maxim Integrated |
IC TXRX E1 1-CHIP 5V 44-PLCC
|
패키지: 44-LCC (J-Lead) |
재고6,336 |
|
E1 | 1 | 4.75 V ~ 5.25 V | 65mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
|
|
|
Maxim Integrated |
IC TXRX E1 1-CHIP 5V 100-LQFP
|
패키지: 100-LQFP |
재고14,508 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
|
|
|
Exar Corporation |
8 CH LH/SH T1/E1 LIU + FRAMER (8
|
패키지: - |
재고5,296 |
|
- | 8 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
|
|
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 2CH SHORT 80TQFP
|
패키지: 80-LQFP |
재고4,048 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
|
|
Maxim Integrated |
IC LIU T1/J1 5V 28-PLCC
|
패키지: 28-LCC (J-Lead) |
재고4,192 |
|
LIU | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
|
|
|
Silicon Labs |
IC PROSLIC FXS DC-DC CTLR 47LGA
|
패키지: 60-WFQFN Exposed Pad |
재고7,792 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
|
|
|
Microsemi Corporation |
IC RECEIVER DTMF 16PAIR 18SOIC
|
패키지: 18-SOIC (0.295", 7.50mm Width) |
재고6,448 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
|
|
Microsemi Corporation |
IC CNIC1.1 CLIP CID TYPE1 16SOIC
|
패키지: 16-SOIC (0.295", 7.50mm Width) |
재고107,772 |
|
3-Wire | 1 | 2.7 V ~ 5.5 V | 1.9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
|
|
|
Microsemi Solutions Sdn Bhd. |
10 PORT UNMANAGED SWITCH
|
패키지: - |
재고7,740 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 302-TQFP (24x24) |
|
|
|
NXP |
CABLE FULL SPECTRUM TRANSCEIVER
|
패키지: - |
재고2,432 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Broadcom Limited |
TRAFFIC MGR PACKETPROC
|
패키지: - |
재고4,176 |
|
- | - | - | - | - | - | - | - | - |
|
|
Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN
|
패키지: 48-VFQFN Exposed Pad |
재고4,768 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |
|
|
|
Microchip Technology |
IC TDM/TSI SWITCH 256X256 48SSOP
|
패키지: 48-BSSOP (0.295", 7.50mm Width) |
재고4,192 |
|
- | 1 | 3V ~ 3.6V | 4mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
|
|
|
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 44PLCC
|
패키지: 44-LCC (J-Lead) |
재고6,192 |
|
- | 1 | 4.75V ~ 5.25V | 6mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC |
|
|
|
Microchip Technology |
32 CHANNEL T1/E1 FRAMER
|
패키지: - |
재고6,816 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256BGA
|
패키지: 256-BGA |
재고7,536 |
|
- | 1 | 1.71V ~ 1.89V | 120mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
|
|
|
Microchip Technology |
2CH 120V ABS MISLIC PCM, 53QFN,
|
패키지: - |
재고5,136 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Rohm Semiconductor |
IC SOUND GENERATOR CELL 85VCSP
|
패키지: - |
Request a Quote |
|
- | 1 | 2.25V ~ 2.75V | 65mA | 1.6 W | -30°C ~ 85°C | Surface Mount | 48-VFBGA, CSPBGA | 48-VCSP85H5 (5.14x5.14) |
