이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC COMPONENT DUALFALC 160-LBGA
|
패키지: 160-LBGA |
재고5,200 |
|
E1, J1, SCI, SPI, T1 | 2 | 1.8V, 3.3V | - | 150mW | -40°C ~ 85°C | Surface Mount | 160-LBGA | PG-LBGA-160 |
||
Infineon Technologies |
IC LIU E1/T1/J1 81LBGA
|
패키지: 81-LBGA |
재고6,240 |
|
E1, HDLC, J1, T1 | 1 | 1.8V, 3.3V | 80mA | 250mW | -40°C ~ 85°C | Surface Mount | 81-LBGA | P-LBGA-81 |
||
Infineon Technologies |
IC CODEC VOIP TQFP-100
|
패키지: 100-LQFP |
재고7,120 |
|
Parallel, PCM, Serial | 1 | - | - | - | - | Surface Mount | 100-LQFP | PG-TQFP-100 |
||
Microsemi Corporation |
IC SYNCHRONIZER T1/E1 48SSOP
|
패키지: 48-BSSOP (0.295", 7.50mm Width) |
재고15,312 |
|
- | 1 | 3 V ~ 3.6 V | 1.8mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 20SOIC
|
패키지: 20-SOIC (0.295", 7.50mm Width) |
재고7,712 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC VOIP ATA ASSP 128QFP
|
패키지: 128-BFQFP |
재고4,816 |
|
PCM | 1 | 1.2V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 128-BFQFP | 128-PQFP (14x20) |
||
Maxim Integrated |
IC QUAD DS3/E3 TXRX 400BGA
|
패키지: 400-BBGA |
재고5,456 |
|
DS3, E3 | 4 | 3.135 V ~ 3.465 V | 725mA | - | -40°C ~ 85°C | Surface Mount | 400-BBGA | 400-PBGA (27x27) |
||
Silicon Labs |
IC ISOMODEM LINE-SIDE DAA 16SOIC
|
패키지: 16-SOIC (0.154", 3.90mm Width) |
재고8,124 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 8.5mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC VOICE-SWITCH SPKR CIRC 28SOIC
|
패키지: 28-SOIC (0.295", 7.50mm Width) |
재고164,040 |
|
- | 1 | 3.5 V ~ 6.5 V | 5.5mA | 520W | -20°C ~ 60°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SO |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 SGL 52TQFP
|
패키지: 52-LQFP |
재고2,544 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-TQFP (10x10) |
||
Maxim Integrated |
IC LINE QUAD 3.3V E1/T1/J1 BGA
|
패키지: 144-BGA |
재고4,672 |
|
- | 4 | 3.135 V ~ 3.465 V | 320mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA | 144-TEPBGA (17x17) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 QUAD SHORT 128-TQFP
|
패키지: 128-LQFP |
재고5,808 |
|
LIU | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
Silicon Labs |
IC PROSLIC FXS DTMF -110V 42QFN
|
패키지: 42-WFQFN Exposed Pad |
재고7,456 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Maxim Integrated |
IC LIU E1/T1/J1 3.3V 144-ELQFP
|
패키지: 144-LQFP Exposed Pad |
재고6,592 |
|
LIU | 8 | 3.135 V ~ 3.465 V | 250mA | - | 0°C ~ 70°C | Surface Mount | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) |
||
Microchip Technology |
1P, CU FE PHY, RGMII/RMII, ITEMP
|
패키지: 48-VFQFN Exposed Pad |
재고6,924 |
|
- | - | - | - | - | - | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |
||
Microchip Technology |
IC DGTL SWITCH FLEX 344BGA
|
패키지: 344-BBGA |
재고6,816 |
|
- | 1 | 3V ~ 3.6V | 480mA | - | -40°C ~ 85°C | Surface Mount | 344-BBGA | 344-PBGA (27x27) |
||
Broadcom Limited |
24GE + 4X1G/2.5G SWITCH
|
패키지: - |
재고4,896 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 1CH UNIV 100V 48QFN
|
패키지: 56-VFQFN Exposed Pad |
재고3,024 |
|
4-Wire | 1 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
IC TXRX DTMF 20SOIC
|
패키지: 20-SOIC (0.295", 7.50mm Width) |
재고15,648 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Infineon Technologies |
ISDN ECHO-CANCELLATION CIRCUIT-Q
|
패키지: - |
Request a Quote |
|
IOM-2, PCM | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.6x16.6) |
||
Analog Devices Inc./Maxim Integrated |
4 X 3 12 CHANNEL E1 FRAMER
|
패키지: - |
Request a Quote |
|
E1 | 12 | 2.97V ~ 3.63V | 75mA | - | -40°C ~ 85°C | Surface Mount | 300-BGA | 300-BGA (27x27) |
||
Texas Instruments |
TELECOM CIRCUIT, 1-FUNC, PQFP48
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
VINETIC VOICE OVER IP PROCESSOR
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
4X2.5G+4X10G+4X10G/HG SWITCH
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
EIA/ITU PABX SLIC WITH 30MILLI A
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
DUSLIC DUAL CHANNEL SUBSCRIBER L
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
EIA/ITU 24V PABX SLIC
|
패키지: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -20V ~ -28V, 4.75V ~ 5.25V | - | 60 mW | 0°C ~ 70°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Texas Instruments |
DSP WIRELESS CELLULAR
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |