페이지 94 - 특수 IC | 집적 회로(IC)

부품 번호	제조업체	설명	패키지	재고	Applications	Mounting Type	Package / Case	Supplier Device Package
TDA3653B/N2,112	NXP	IC VERT DEFLECT 9-SIL Type: - Applications: - Mounting Type: Surface Mount Package / Case: 9-SIP Exposed Tab Supplier Device Package: 9-SIL MPF	패키지: 9-SIP Exposed Tab	재고7,024	-	Surface Mount	9-SIP Exposed Tab	9-SIL MPF
TDA8351/N6,112	NXP	IC DC COUPLED V-DEFL 9-SIL Type: - Applications: - Mounting Type: Through Hole Package / Case: 9-SIP Supplier Device Package: 9-SIL	패키지: 9-SIP	재고7,872	-	Through Hole	9-SIP	9-SIL
TSI578A-10GILV	IDT, Integrated Device Technology Inc	IC SWITCH RIO Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고7,456	-	-	-	-
80HCPS1616CHMG	IDT, Integrated Device Technology Inc	IC RIO SWITCH GEN2 400FCBGA Type: Serial RapidIO? Switch Applications: Wireless Infrastructure Mounting Type: Surface Mount Package / Case: 400-BBGA, FCBGA Supplier Device Package: 400-FBGA (21x21)	패키지: 400-BBGA, FCBGA	재고6,192	Wireless Infrastructure	Surface Mount	400-BBGA, FCBGA	400-FBGA (21x21)
XCMECH-FF1136	Xilinx Inc.	FF1136 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고6,816	-	-	-	-
AD9963BCPZRL	Analog Devices Inc.	IC DAC DUAL 16BIT 72LFCSP Type: Broadband Front-End Applications: Wireless Networking Mounting Type: Surface Mount Package / Case: 72-VFQFN Exposed Pad, CSP Supplier Device Package: 72-LFCSP-VQ (10x10)	패키지: 72-VFQFN Exposed Pad, CSP	재고4,336	Wireless Networking	Surface Mount	72-VFQFN Exposed Pad, CSP	72-LFCSP-VQ (10x10)
CAP016DG-TL	Power Integrations	IC CAPZERO 1000V 2000NF 8-SOIC Type: Capacitor Discharge Applications: Converter, ACDC Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	패키지: 8-SOIC (0.154", 3.90mm Width)	재고3,344	Converter, ACDC	Surface Mount	8-SOIC (0.154", 3.90mm Width)	8-SO
MCP2036T-I/SL	Microchip Technology	IC KEYLESS ENTRY AFE 14-SOIC Type: Sensor Interface Applications: Analog I/O Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SOIC	패키지: 14-SOIC (0.154", 3.90mm Width)	재고4,672	Analog I/O	Surface Mount	14-SOIC (0.154", 3.90mm Width)	14-SOIC
MAX4840EXT+T	Maxim Integrated	IC CTLR OVP 5.8V SC70-6 Type: Overvoltage Protection Controller Applications: Cell Phones, Digital Cameras, Media Players Mounting Type: Surface Mount Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: SC-70-6	패키지: 6-TSSOP, SC-88, SOT-363	재고1,025,772	Cell Phones, Digital Cameras, Media Players	Surface Mount	6-TSSOP, SC-88, SOT-363	SC-70-6
DS2411P+T&R	Maxim Integrated	IC SILICON SERIAL NUMBER 6TSOC Type: Silicon Serial Number Applications: PCB, Network Node, Equipment Identification/Registration Mounting Type: Surface Mount Package / Case: 6-LSOJ (0.148", 3.76mm Width) Supplier Device Package: 6-TSOC	패키지: 6-LSOJ (0.148", 3.76mm Width)	재고6,000	PCB, Network Node, Equipment Identification/Registration	Surface Mount	6-LSOJ (0.148", 3.76mm Width)	6-TSOC
DLP230GPAFQP	Texas Instruments	IC DLP CTLR DLP2010 Type: Digital Micromirror Device (DMD) Applications: - Mounting Type: Surface Mount Package / Case: - Supplier Device Package: 54-CLGA (16.8x5.92)	패키지: -	재고5,600	-	Surface Mount	-	54-CLGA (16.8x5.92)
MAX4944ELA+TGC7	Maxim Integrated	INTEGRATED CIRCUIT Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고6,080	-	-	-	-
BCM75835NCKFEBA03G	Broadcom Limited	SOC SET TOP BOX IC Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고4,784	-	-	-	-
BCM75831ZZKFEB03G	Broadcom Limited	SOC SET TOP BOX IC Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고2,928	-	-	-	-
ST2100TR	STMicroelectronics	IC BROADBAND FRONT-END 373TFBGA Type: Broadband Front-End Applications: Power Line Communications Mounting Type: Surface Mount Package / Case: 373-TFBGA Supplier Device Package: 373-TFBGA (12x12)	패키지: 373-TFBGA	재고7,920	Power Line Communications	Surface Mount	373-TFBGA	373-TFBGA (12x12)
LTC4331IUFD#PBF	Linear Technology	I2C SLAVE EXTEND OVER DIFFERENTI Type: Differential Link Applications: Industrial, Lighting Mounting Type: Surface Mount Package / Case: 20-WFQFN Exposed Pad Supplier Device Package: 20-QFN (5x4)	패키지: 20-WFQFN Exposed Pad	재고2,848	Industrial, Lighting	Surface Mount	20-WFQFN Exposed Pad	20-QFN (5x4)
DS28E83Q+T	Maxim Integrated	1-WIRE 5K RAD SECURE AUTHENTICAT Type: Authentication Chip Applications: Medical Mounting Type: Surface Mount Package / Case: 6-WDFN Exposed Pad Supplier Device Package: 6-TDFN-EP (3x3)	패키지: 6-WDFN Exposed Pad	재고5,520	Medical	Surface Mount	6-WDFN Exposed Pad	6-TDFN-EP (3x3)
ATECC608B-MAVDA-S	Microchip Technology	IC AUTHENTICATION CHIP 8UDFN Type: Authentication Chip Applications: - Mounting Type: Surface Mount Package / Case: 8-UFDFN Exposed Pad Supplier Device Package: 8-UDFN (2x3)	패키지: -	재고24,828	-	Surface Mount	8-UFDFN Exposed Pad	8-UDFN (2x3)
090-03240-003	Microchip Technology	IC EMBEDDED ATOMIC CLK Type: Embedded Atomic Clocks Applications: - Mounting Type: Through Hole Package / Case: 12-DIP Module, 9 Leads Supplier Device Package: -	패키지: -	Request a Quote	-	Through Hole	12-DIP Module, 9 Leads	-
DLP800REA0FYV	Texas Instruments	IC DIG MICROMIRROR DEV 350CPGA Type: Digital Micromirror Device (DMD) Applications: - Mounting Type: Through Hole Package / Case: 350-BFCPGA Supplier Device Package: 350-CPGA (35x32.2)	패키지: -	Request a Quote	-	Through Hole	350-BFCPGA	350-CPGA (35x32.2)
MAX22516AWO-T	Analog Devices Inc./Maxim Integrated	IC Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote	-	-	-	-
KSZ8999I-GL	Microchip Technology	IC Type: 10/100 Integrated Switch Applications: - Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	패키지: -	Request a Quote	-	Surface Mount	208-BFQFP	208-PQFP (28x28)
DS3650B	Analog Devices Inc./Maxim Integrated	IC DEEPCOVER 16CSBGA Type: DeepCover Applications: - Mounting Type: Surface Mount Package / Case: 16-LBGA, CSPBGA Supplier Device Package: 16-CSBGA (4x4)	패키지: -	Request a Quote	-	Surface Mount	16-LBGA, CSPBGA	16-CSBGA (4x4)
VT225FCR-ADJ	Analog Devices Inc./Maxim Integrated	VT225FCR-ADJ Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote	-	-	-	-
HFA3824IV96	Harris Corporation	IC SPREAD SPECT PROC 48TQFP Type: Direct Sequence Spread Spectrum Baseband Processor Applications: - Mounting Type: Surface Mount Package / Case: 48-TQFP Supplier Device Package: 48-TQFP (7x7)	패키지: -	Request a Quote	-	Surface Mount	48-TQFP	48-TQFP (7x7)
LS7084N	LSI/CSI	IC CLOCK CONVERTER 8DIP Type: Clock Converter Applications: Interface Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP	패키지: -	Request a Quote	Interface	Through Hole	8-DIP (0.300", 7.62mm)	8-DIP
ATECC608C-SSHCZ-T	Microchip Technology	ECC/ECDH, SWI, SOIC T/R Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote	-	-	-	-
HD6473847RFV	Renesas Electronics Corporation	HD6473847 - H8/300L SLP MICROCON Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote	-	-	-	-

TDA3653B/N2,112

NXP

IC VERT DEFLECT 9-SIL

Type: -
Applications: -
Mounting Type: Surface Mount
Package / Case: 9-SIP Exposed Tab
Supplier Device Package: 9-SIL MPF

패키지: 9-SIP Exposed Tab

재고7,024

-

Surface Mount

9-SIP Exposed Tab

9-SIL MPF

TDA8351/N6,112

NXP

IC DC COUPLED V-DEFL 9-SIL

Type: -
Applications: -
Mounting Type: Through Hole
Package / Case: 9-SIP
Supplier Device Package: 9-SIL

패키지: 9-SIP

재고7,872

-

Through Hole

9-SIP

9-SIL

TSI578A-10GILV

IDT, Integrated Device Technology Inc

IC SWITCH RIO

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고7,456

-

80HCPS1616CHMG

IDT, Integrated Device Technology Inc

IC RIO SWITCH GEN2 400FCBGA

Type: Serial RapidIO? Switch
Applications: Wireless Infrastructure
Mounting Type: Surface Mount
Package / Case: 400-BBGA, FCBGA
Supplier Device Package: 400-FBGA (21x21)

패키지: 400-BBGA, FCBGA

재고6,192

Wireless Infrastructure

Surface Mount

400-BBGA, FCBGA

400-FBGA (21x21)

XCMECH-FF1136

Xilinx Inc.

FF1136 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고6,816

-

AD9963BCPZRL

Analog Devices Inc.

IC DAC DUAL 16BIT 72LFCSP

Type: Broadband Front-End
Applications: Wireless Networking
Mounting Type: Surface Mount
Package / Case: 72-VFQFN Exposed Pad, CSP
Supplier Device Package: 72-LFCSP-VQ (10x10)

패키지: 72-VFQFN Exposed Pad, CSP

재고4,336

Wireless Networking

Surface Mount

72-VFQFN Exposed Pad, CSP

72-LFCSP-VQ (10x10)

CAP016DG-TL

Power Integrations

IC CAPZERO 1000V 2000NF 8-SOIC

Type: Capacitor Discharge
Applications: Converter, ACDC
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

패키지: 8-SOIC (0.154", 3.90mm Width)

재고3,344

Converter, ACDC

Surface Mount

8-SOIC (0.154", 3.90mm Width)

8-SO

MCP2036T-I/SL

Microchip Technology

IC KEYLESS ENTRY AFE 14-SOIC

Type: Sensor Interface
Applications: Analog I/O
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SOIC

패키지: 14-SOIC (0.154", 3.90mm Width)

재고4,672

Analog I/O

Surface Mount

14-SOIC (0.154", 3.90mm Width)

14-SOIC

MAX4840EXT+T

Maxim Integrated

IC CTLR OVP 5.8V SC70-6

Type: Overvoltage Protection Controller
Applications: Cell Phones, Digital Cameras, Media Players
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Supplier Device Package: SC-70-6

패키지: 6-TSSOP, SC-88, SOT-363

재고1,025,772

Cell Phones, Digital Cameras, Media Players

Surface Mount

6-TSSOP, SC-88, SOT-363

SC-70-6

DS2411P+T&R

Maxim Integrated

IC SILICON SERIAL NUMBER 6TSOC

Type: Silicon Serial Number
Applications: PCB, Network Node, Equipment Identification/Registration
Mounting Type: Surface Mount
Package / Case: 6-LSOJ (0.148", 3.76mm Width)
Supplier Device Package: 6-TSOC

패키지: 6-LSOJ (0.148", 3.76mm Width)

재고6,000

PCB, Network Node, Equipment Identification/Registration

Surface Mount

6-LSOJ (0.148", 3.76mm Width)

6-TSOC

DLP230GPAFQP

Texas Instruments

IC DLP CTLR DLP2010

Type: Digital Micromirror Device (DMD)
Applications: -
Mounting Type: Surface Mount
Package / Case: -
Supplier Device Package: 54-CLGA (16.8x5.92)

패키지: -

재고5,600

-

Surface Mount

-

54-CLGA (16.8x5.92)

MAX4944ELA+TGC7

Maxim Integrated

INTEGRATED CIRCUIT

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고6,080

-

BCM75835NCKFEBA03G

Broadcom Limited

SOC SET TOP BOX IC

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고4,784

-

BCM75831ZZKFEB03G

Broadcom Limited

SOC SET TOP BOX IC

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고2,928

-

ST2100TR

STMicroelectronics

IC BROADBAND FRONT-END 373TFBGA

Type: Broadband Front-End
Applications: Power Line Communications
Mounting Type: Surface Mount
Package / Case: 373-TFBGA
Supplier Device Package: 373-TFBGA (12x12)

패키지: 373-TFBGA

재고7,920

Power Line Communications

Surface Mount

373-TFBGA

373-TFBGA (12x12)

LTC4331IUFD#PBF

Linear Technology

I2C SLAVE EXTEND OVER DIFFERENTI

Type: Differential Link
Applications: Industrial, Lighting
Mounting Type: Surface Mount
Package / Case: 20-WFQFN Exposed Pad
Supplier Device Package: 20-QFN (5x4)

패키지: 20-WFQFN Exposed Pad

재고2,848

Industrial, Lighting

Surface Mount

20-WFQFN Exposed Pad

20-QFN (5x4)

DS28E83Q+T

Maxim Integrated

1-WIRE 5K RAD SECURE AUTHENTICAT

Type: Authentication Chip
Applications: Medical
Mounting Type: Surface Mount
Package / Case: 6-WDFN Exposed Pad
Supplier Device Package: 6-TDFN-EP (3x3)

패키지: 6-WDFN Exposed Pad

재고5,520

Medical

Surface Mount

6-WDFN Exposed Pad

6-TDFN-EP (3x3)

ATECC608B-MAVDA-S

Microchip Technology

IC AUTHENTICATION CHIP 8UDFN

Type: Authentication Chip
Applications: -
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Supplier Device Package: 8-UDFN (2x3)

패키지: -

재고24,828

-

Surface Mount

8-UFDFN Exposed Pad

8-UDFN (2x3)

090-03240-003

Microchip Technology

IC EMBEDDED ATOMIC CLK

Type: Embedded Atomic Clocks
Applications: -
Mounting Type: Through Hole
Package / Case: 12-DIP Module, 9 Leads
Supplier Device Package: -

패키지: -

Request a Quote

-

Through Hole

12-DIP Module, 9 Leads

-

DLP800REA0FYV

Texas Instruments

IC DIG MICROMIRROR DEV 350CPGA

Type: Digital Micromirror Device (DMD)
Applications: -
Mounting Type: Through Hole
Package / Case: 350-BFCPGA
Supplier Device Package: 350-CPGA (35x32.2)

패키지: -

Request a Quote

-

Through Hole

350-BFCPGA

350-CPGA (35x32.2)

MAX22516AWO-T

Analog Devices Inc./Maxim Integrated

IC

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

-

KSZ8999I-GL

Microchip Technology

IC

Type: 10/100 Integrated Switch
Applications: -
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

패키지: -

Request a Quote

-

Surface Mount

208-BFQFP

208-PQFP (28x28)

DS3650B

Analog Devices Inc./Maxim Integrated

IC DEEPCOVER 16CSBGA

Type: DeepCover
Applications: -
Mounting Type: Surface Mount
Package / Case: 16-LBGA, CSPBGA
Supplier Device Package: 16-CSBGA (4x4)

패키지: -

Request a Quote

-

Surface Mount

16-LBGA, CSPBGA

16-CSBGA (4x4)

VT225FCR-ADJ

Analog Devices Inc./Maxim Integrated

VT225FCR-ADJ

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

-

HFA3824IV96

Harris Corporation

IC SPREAD SPECT PROC 48TQFP

Type: Direct Sequence Spread Spectrum Baseband Processor
Applications: -
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Supplier Device Package: 48-TQFP (7x7)

패키지: -

Request a Quote

-

Surface Mount

48-TQFP

48-TQFP (7x7)

LS7084N

LSI/CSI

IC CLOCK CONVERTER 8DIP

Type: Clock Converter
Applications: Interface
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-DIP

패키지: -

Request a Quote

Interface

Through Hole

8-DIP (0.300", 7.62mm)

8-DIP

ATECC608C-SSHCZ-T

Microchip Technology

ECC/ECDH, SWI, SOIC T/R

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

-

HD6473847RFV

Renesas Electronics Corporation

HD6473847 - H8/300L SLP MICROCON

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

-