페이지 180 - Intel 제품 | Heisener Electronics
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Intel 제품

기록 9,824
페이지  180/351
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SB80C188EC13
Intel

IC MPU I186 13MHZ 100SQFP

  • Core Processor: 80C186
  • Number of Cores/Bus Width: 1 Core, 16-Bit
  • Speed: 13MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 100-BFQFP
  • Supplier Device Package: 100-SQFP
패키지: 100-BFQFP
재고6,704
1SX250LN3F43E3VG
Intel

1760-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고2,064
hot EP3C25U256I7N
Intel

IC FPGA 156 I/O 256UBGA

  • Number of LABs/CLBs: 1539
  • Number of Logic Elements/Cells: 24624
  • Total RAM Bits: 608256
  • Number of I/O: 156
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LFBGA
  • Supplier Device Package: 256-UBGA (14x14)
패키지: 256-LFBGA
재고6,204
EP20K1500XXC
Intel

IC FPGA

  • Number of LABs/CLBs: 5184
  • Number of Logic Elements/Cells: 51840
  • Total RAM Bits: 442368
  • Number of I/O: -
  • Number of Gates: 2392000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고3,600
hot EP1K30QC208-2N
Intel

IC FPGA 147 I/O 208QFP

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 24576
  • Number of I/O: 147
  • Number of Gates: 119000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
패키지: 208-BFQFP
재고4,224
EP3SL340F1517I3
Intel

IC FPGA 976 I/O 1517FBGA

  • Number of LABs/CLBs: 13500
  • Number of Logic Elements/Cells: 337500
  • Total RAM Bits: 18822144
  • Number of I/O: 976
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: 1517-BBGA, FCBGA
재고5,984
10AX066N2F40I1HG
Intel

IC FPGA 588 I/O 1517FCBGA

  • Number of LABs/CLBs: 250540
  • Number of Logic Elements/Cells: 660000
  • Total RAM Bits: 49610752
  • Number of I/O: 588
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: 1517-BBGA, FCBGA
재고5,360
5SGXEA4H3F35C2LN
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 43983872
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BBGA, FCBGA
재고7,616
5SGXEA3H3F35I4N
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 23704576
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BBGA, FCBGA
재고7,344
5SGXEB6R3F40C4
Intel

IC FPGA 432 I/O 1517FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 61688832
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: 1517-BBGA, FCBGA
재고6,000
5CGTFD9D5F27C7N
Intel

IC FPGA 336 I/O 672FBGA

  • Number of LABs/CLBs: 113560
  • Number of Logic Elements/Cells: 301000
  • Total RAM Bits: 14251008
  • Number of I/O: 336
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BGA
  • Supplier Device Package: 672-FBGA (27x27)
패키지: 672-BGA
재고6,512
5CGXFC5C6M13C6N
Intel

IC FPGA 175 I/O 383MBGA

  • Number of LABs/CLBs: 29080
  • Number of Logic Elements/Cells: 77000
  • Total RAM Bits: 5001216
  • Number of I/O: 175
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 383-TFBGA
  • Supplier Device Package: 383-MBGA (13x13)
패키지: 383-TFBGA
재고5,088
5CGXFC4C6M13C7N
Intel

IC FPGA 175 I/O 383MBGA

  • Number of LABs/CLBs: 18868
  • Number of Logic Elements/Cells: 50000
  • Total RAM Bits: 2862080
  • Number of I/O: 175
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 383-TFBGA
  • Supplier Device Package: 383-MBGA (13x13)
패키지: 383-TFBGA
재고2,912
EP1C20F400C7
Intel

IC FPGA 301 I/O 400FBGA

  • Number of LABs/CLBs: 2006
  • Number of Logic Elements/Cells: 20060
  • Total RAM Bits: 294912
  • Number of I/O: 301
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-BGA
  • Supplier Device Package: 400-FBGA (21x21)
패키지: 400-BGA
재고5,072
EP4CGX22BF14I7N
Intel

IC FPGA 72 I/O 169FBGA

  • Number of LABs/CLBs: 1330
  • Number of Logic Elements/Cells: 21280
  • Total RAM Bits: 774144
  • Number of I/O: 72
  • Number of Gates: -
  • Voltage - Supply: 1.16 V ~ 1.24 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 169-LBGA
  • Supplier Device Package: 169-FBGA (14x14)
패키지: 169-LBGA
재고3,824
hot EP2C8F256C6
Intel

IC FPGA 182 I/O 256FBGA

  • Number of LABs/CLBs: 516
  • Number of Logic Elements/Cells: 8256
  • Total RAM Bits: 165888
  • Number of I/O: 182
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-LBGA
재고6,672
hot EP1C4F400C7N
Intel

IC FPGA 301 I/O 400FBGA

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 4000
  • Total RAM Bits: 78336
  • Number of I/O: 301
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-BGA
  • Supplier Device Package: 400-FBGA (21x21)
패키지: 400-BGA
재고6,144
EP2C5T144C6
Intel

IC FPGA 89 I/O 144TQFP

  • Number of LABs/CLBs: 288
  • Number of Logic Elements/Cells: 4608
  • Total RAM Bits: 119808
  • Number of I/O: 89
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고5,808
EPM7064BFC100-5
Intel

IC CPLD 64MC 5NS 100FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.0ns
  • Voltage Supply - Internal: 2.375 V ~ 2.625 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1250
  • Number of I/O: 68
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LBGA
  • Supplier Device Package: 100-FBGA (11x11)
패키지: 100-LBGA
재고3,824
hot EPM7128ELI84-20
Intel

IC CPLD 128MC 20NS 84PLCC

  • Programmable Type: EE PLD
  • Delay Time tpd(1) Max: 20.0ns
  • Voltage Supply - Internal: 4.5 V ~ 5.5 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 68
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
패키지: 84-LCC (J-Lead)
재고3,520
EPM7256AEQI208-7
Intel

IC CPLD 256MC 7.5NS 208QFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 5000
  • Number of I/O: 164
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
패키지: 208-BFQFP
재고3,760
1SG280HU1F50E2LG
Intel

IC FPGA 704 I/O 2397BGA

  • Number of LABs/CLBs: 350000
  • Number of Logic Elements/Cells: 2800000
  • Total RAM Bits: -
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
패키지: -
Request a Quote
AGFB014R24C3I3V
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.4M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
5SGXEABK2H40C2LG
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
패키지: -
Request a Quote
5SGSED6N1F45C2G
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 220000
  • Number of Logic Elements/Cells: 583000
  • Total RAM Bits: 46080000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
패키지: -
Request a Quote
5SGXEA5N3F40I3G
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: -
Request a Quote
1SG165HN3F43I2VG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 206250
  • Number of Logic Elements/Cells: 1650000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
패키지: -
Request a Quote
AGFB014R24D2E3V
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.4M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
패키지: -
Request a Quote