페이지 198 - Intel 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
GD82550GMSL4ML	Intel	IC CTRL ETH PCI/CARDBUS 196-BGA Protocol: Ethernet Function: MAC Controller Interface: PCI Standards: 100 Base-TX PHY Voltage - Supply: - Current - Supply: - Operating Temperature: - Package / Case: 196-BGA Supplier Device Package: 196-BGA (15x15)	패키지: 196-BGA	재고6,208
10AS066N3F40I2SGES	Intel	IC SOC FPGA 588 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	패키지: 1517-BBGA, FCBGA	재고6,576
5ASXBB3D4F35C6N	Intel	IC FPGA 350 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	패키지: 1152-BBGA, FCBGA	재고5,056
10AS027H2F35I2LG	Intel	1152-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	패키지: -	재고5,728
10AS022E4F29I3LG	Intel	780-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 220K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	패키지: -	재고4,800
EP20K160ETI144-3	Intel	IC FPGA Number of LABs/CLBs: 640 Number of Logic Elements/Cells: 6400 Total RAM Bits: 81920 Number of I/O: 88 Number of Gates: 404000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	패키지: 144-LQFP	재고5,328
EPF10K130EFC484-2N	Intel	IC FPGA 369 I/O 484FBGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 6656 Total RAM Bits: 65536 Number of I/O: 369 Number of Gates: 342000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	패키지: 484-BBGA	재고6,016
5CEBA9F31C7N	Intel	IC FPGA 480 I/O 896FBGA Number of LABs/CLBs: 113560 Number of Logic Elements/Cells: 301000 Total RAM Bits: 14251008 Number of I/O: 480 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	패키지: 896-BGA	재고4,880
EP4CE6F17C8N	Intel	IC FPGA 179 I/O 256FBGA Number of LABs/CLBs: 392 Number of Logic Elements/Cells: 6272 Total RAM Bits: 276480 Number of I/O: 179 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	패키지: 256-LBGA	재고7,792
5SGXMABN1F45C2LN	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 65561600 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	패키지: 1932-BBGA, FCBGA	재고5,840
5SGXEA7N2F40I2L	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	패키지: 1517-BBGA, FCBGA	재고7,056
5SGXMA4H2F35I2LN	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 43983872 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	패키지: 1152-BBGA, FCBGA	재고5,760
5SGSMD3H2F35C2N	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 16937984 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	패키지: 1152-BBGA, FCBGA	재고3,520
5SGXEB6R1F40C2N	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 61688832 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	패키지: 1517-BBGA, FCBGA	재고4,688
5SGSMD3E3H29I3LN	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 16937984 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	패키지: 780-BBGA, FCBGA	재고3,968
EP2AGX65DF25I3G	Intel	572-PIN FBGA Number of LABs/CLBs: 2530 Number of Logic Elements/Cells: 60214 Total RAM Bits: 5371904 Number of I/O: 252 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25x25)	패키지: 572-BGA, FCBGA	재고5,712
EP2C8AF256I8N	Intel	IC CYCLONE II FPGA 8K 256FBGA Number of LABs/CLBs: 516 Number of Logic Elements/Cells: 8256 Total RAM Bits: 165888 Number of I/O: 182 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	패키지: 256-LBGA	재고6,996
10M08DCU324C8G	Intel	IC FPGA 246 I/O 324UBGA Number of LABs/CLBs: 500 Number of Logic Elements/Cells: 8000 Total RAM Bits: 387072 Number of I/O: 246 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-LFBGA Supplier Device Package: 324-UBGA (15x15)	패키지: 324-LFBGA	재고8,208
EP2C15AF256C8N	Intel	IC FPGA 152 I/O 256FBGA Number of LABs/CLBs: 903 Number of Logic Elements/Cells: 14448 Total RAM Bits: 239616 Number of I/O: 152 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	패키지: 256-LBGA	재고6,512
EPM7096LC84-10	Intel	IC CPLD 96MC 10NS 84PLCC Programmable Type: EE PLD Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 6 Number of Macrocells: 96 Number of Gates: 1800 Number of I/O: 68 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	패키지: 84-LCC (J-Lead)	재고5,472
EPM240GM100C5N	Intel	IC CPLD 192MC 4.7NS 100MBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 4.7ns Voltage Supply - Internal: 1.71 V ~ 1.89 V Number of Logic Elements/Blocks: 240 Number of Macrocells: 192 Number of Gates: - Number of I/O: 80 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 100-TFBGA Supplier Device Package: 100-MBGA (6x6)	패키지: 100-TFBGA	재고56,712
5SGXMA3K2F40C3G	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	패키지: -	Request a Quote
S82433LX	Intel	PCI BUS CONTROLLER, MOS, PQFP160 Protocol: - Function: Controller Interface: Bus Standards: - Voltage - Supply: 4.75V ~ 5.25V Current - Supply: - Operating Temperature: 0°C ~ 85°C (TC) Package / Case: 160-QFP Supplier Device Package: 160-QFP	패키지: -	Request a Quote
NK80530MZ866256	Intel	MOBILE CELERON PROCESSOR Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
1SG211HN3F43I2VG	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	패키지: -	Request a Quote
AGFA019R24C2I2V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	패키지: -	Request a Quote
1SG165HN3F43I3VG	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	패키지: -	Request a Quote
5AGXFB5H4F35C5G	Intel	IC FPGA 544 I/O 1152FBGA Number of LABs/CLBs: 158491 Number of Logic Elements/Cells: 420000 Total RAM Bits: 23625728 Number of I/O: 544 Number of Gates: - Voltage - Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35x35)	패키지: -	Request a Quote

GD82550GMSL4ML

Intel

IC CTRL ETH PCI/CARDBUS 196-BGA

Protocol: Ethernet
Function: MAC Controller
Interface: PCI
Standards: 100 Base-TX PHY
Voltage - Supply: -
Current - Supply: -
Operating Temperature: -
Package / Case: 196-BGA
Supplier Device Package: 196-BGA (15x15)

패키지: 196-BGA

재고6,208

10AS066N3F40I2SGES

Intel

IC SOC FPGA 588 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

패키지: 1517-BBGA, FCBGA

재고6,576

5ASXBB3D4F35C6N

Intel

IC FPGA 350 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 700MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

패키지: 1152-BBGA, FCBGA

재고5,056

10AS027H2F35I2LG

Intel

1152-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 270K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

패키지: -

재고5,728

10AS022E4F29I3LG

Intel

780-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 220K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

패키지: -

재고4,800

EP20K160ETI144-3

Intel

IC FPGA

Number of LABs/CLBs: 640
Number of Logic Elements/Cells: 6400
Total RAM Bits: 81920
Number of I/O: 88
Number of Gates: 404000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

패키지: 144-LQFP

재고5,328

EPF10K130EFC484-2N

Intel

IC FPGA 369 I/O 484FBGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 6656
Total RAM Bits: 65536
Number of I/O: 369
Number of Gates: 342000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

패키지: 484-BBGA

재고6,016

5CEBA9F31C7N

Intel

IC FPGA 480 I/O 896FBGA

Number of LABs/CLBs: 113560
Number of Logic Elements/Cells: 301000
Total RAM Bits: 14251008
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)

패키지: 896-BGA

재고4,880

EP4CE6F17C8N

Intel

IC FPGA 179 I/O 256FBGA

Number of LABs/CLBs: 392
Number of Logic Elements/Cells: 6272
Total RAM Bits: 276480
Number of I/O: 179
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

패키지: 256-LBGA

재고7,792

5SGXMABN1F45C2LN

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 65561600
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

패키지: 1932-BBGA, FCBGA

재고5,840

5SGXEA7N2F40I2L

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

패키지: 1517-BBGA, FCBGA

재고7,056

5SGXMA4H2F35I2LN

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 43983872
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

패키지: 1152-BBGA, FCBGA

재고5,760

5SGSMD3H2F35C2N

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 16937984
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

패키지: 1152-BBGA, FCBGA

재고3,520

5SGXEB6R1F40C2N

Intel

IC FPGA 432 I/O 1517FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 61688832
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

패키지: 1517-BBGA, FCBGA

재고4,688

5SGSMD3E3H29I3LN

Intel

IC FPGA 360 I/O 780HBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 16937984
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

패키지: 780-BBGA, FCBGA

재고3,968

EP2AGX65DF25I3G

Intel

572-PIN FBGA

Number of LABs/CLBs: 2530
Number of Logic Elements/Cells: 60214
Total RAM Bits: 5371904
Number of I/O: 252
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 572-BGA, FCBGA
Supplier Device Package: 572-FBGA, FC (25x25)

패키지: 572-BGA, FCBGA

재고5,712

EP2C8AF256I8N

Intel

IC CYCLONE II FPGA 8K 256FBGA

Number of LABs/CLBs: 516
Number of Logic Elements/Cells: 8256
Total RAM Bits: 165888
Number of I/O: 182
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

패키지: 256-LBGA

재고6,996

10M08DCU324C8G

Intel

IC FPGA 246 I/O 324UBGA

Number of LABs/CLBs: 500
Number of Logic Elements/Cells: 8000
Total RAM Bits: 387072
Number of I/O: 246
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 324-LFBGA
Supplier Device Package: 324-UBGA (15x15)

패키지: 324-LFBGA

재고8,208

EP2C15AF256C8N

Intel

IC FPGA 152 I/O 256FBGA

Number of LABs/CLBs: 903
Number of Logic Elements/Cells: 14448
Total RAM Bits: 239616
Number of I/O: 152
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

패키지: 256-LBGA

재고6,512

EPM7096LC84-10

Intel

IC CPLD 96MC 10NS 84PLCC

Programmable Type: EE PLD
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 6
Number of Macrocells: 96
Number of Gates: 1800
Number of I/O: 68
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

패키지: 84-LCC (J-Lead)

재고5,472

EPM240GM100C5N

Intel

IC CPLD 192MC 4.7NS 100MBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 4.7ns
Voltage Supply - Internal: 1.71 V ~ 1.89 V
Number of Logic Elements/Blocks: 240
Number of Macrocells: 192
Number of Gates: -
Number of I/O: 80
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Supplier Device Package: 100-MBGA (6x6)

패키지: 100-TFBGA

재고56,712

5SGXMA3K2F40C3G

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 19456000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

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S82433LX

Intel

PCI BUS CONTROLLER, MOS, PQFP160

Protocol: -
Function: Controller
Interface: Bus
Standards: -
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: -
Operating Temperature: 0°C ~ 85°C (TC)
Package / Case: 160-QFP
Supplier Device Package: 160-QFP

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NK80530MZ866256

Intel

MOBILE CELERON PROCESSOR

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

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1SG211HN3F43I2VG

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 263750
Number of Logic Elements/Cells: 2110000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

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AGFA019R24C2I2V

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

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1SG165HN3F43I3VG

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 206250
Number of Logic Elements/Cells: 1650000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

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5AGXFB5H4F35C5G

Intel

IC FPGA 544 I/O 1152FBGA

Number of LABs/CLBs: 158491
Number of Logic Elements/Cells: 420000
Total RAM Bits: 23625728
Number of I/O: 544
Number of Gates: -
Voltage - Supply: 1.07V ~ 1.13V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA, FC (35x35)

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