페이지 209 - Intel 제품 | Heisener Electronics
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Intel 제품

기록 9,824
페이지  209/351
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EE87C51RB1
Intel

IC MCU 8BIT 16KB OTP 44PLCC

  • Core Processor: MCS 51
  • Core Size: 8-Bit
  • Speed: 16MHz
  • Connectivity: SIO
  • Peripherals: WDT
  • Number of I/O: 32
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC
패키지: 44-LCC (J-Lead)
재고18,846
5CSEBA2U23C7SN
Intel

IC FPGA 188 I/O 672UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 25K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-FBGA
  • Supplier Device Package: 672-UBGA (23x23)
패키지: 672-FBGA
재고2,100
EP1SGX40GF1020C6BN
Intel

IC FPGA FBGA

  • Number of LABs/CLBs: 4125
  • Number of Logic Elements/Cells: 41250
  • Total RAM Bits: 3423744
  • Number of I/O: 624
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1020-BBGA, FCBGA
  • Supplier Device Package: 1020-FBGA (33x33)
패키지: 1020-BBGA, FCBGA
재고5,232
EP20K600EFC33-3
Intel

IC FPGA 588 I/O 1020FBGA

  • Number of LABs/CLBs: 2432
  • Number of Logic Elements/Cells: 24320
  • Total RAM Bits: 311296
  • Number of I/O: 588
  • Number of Gates: 1537000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
패키지: 1020-BBGA
재고5,632
EP20K100FC324-2N
Intel

IC FPGA 252 I/O 324FBGA

  • Number of LABs/CLBs: 416
  • Number of Logic Elements/Cells: 4160
  • Total RAM Bits: 53248
  • Number of I/O: 252
  • Number of Gates: 263000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-FBGA (19x19)
패키지: 324-BGA
재고2,176
EP1S30F1020C5
Intel

IC FPGA 726 I/O 1020FBGA

  • Number of LABs/CLBs: 3247
  • Number of Logic Elements/Cells: 32470
  • Total RAM Bits: 3317184
  • Number of I/O: 726
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
패키지: 1020-BBGA
재고7,952
EP4SGX230FF35C3NES
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: 9120
  • Number of Logic Elements/Cells: 228000
  • Total RAM Bits: 17544192
  • Number of I/O: 564
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BBGA, FCBGA
재고6,976
EP3SL340F1760C3
Intel

IC FPGA 1120 I/O 1760FBGA

  • Number of LABs/CLBs: 13500
  • Number of Logic Elements/Cells: 337500
  • Total RAM Bits: 18822144
  • Number of I/O: 1120
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
패키지: 1760-BBGA, FCBGA
재고3,328
5SGXEA4K1F35I2N
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 43983872
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BBGA, FCBGA
재고2,480
5SGXEA5K3F35C2LN
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BBGA, FCBGA
재고6,880
5SGSMD4K2F40I3N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 135840
  • Number of Logic Elements/Cells: 360000
  • Total RAM Bits: 23946240
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: 1517-BBGA, FCBGA
재고7,344
EP4SGX110FF35C3
Intel

IC FPGA 372 I/O 1152FBGA

  • Number of LABs/CLBs: 4224
  • Number of Logic Elements/Cells: 105600
  • Total RAM Bits: 9793536
  • Number of I/O: 372
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BBGA, FCBGA
재고7,712
EP3SE80F1152C4LN
Intel

IC FPGA 744 I/O 1152FBGA

  • Number of LABs/CLBs: 3200
  • Number of Logic Elements/Cells: 80000
  • Total RAM Bits: 6843392
  • Number of I/O: 744
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BBGA, FCBGA
재고7,936
5AGXMB3G4F40C4N
Intel

IC FPGA 704 I/O 1517FBGA

  • Number of LABs/CLBs: 17110
  • Number of Logic Elements/Cells: 362000
  • Total RAM Bits: 19822592
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: 1517-BBGA
재고5,664
5CGTFD9E5F35I7N
Intel

IC FPGA 560 I/O 1152FBGA

  • Number of LABs/CLBs: 113560
  • Number of Logic Elements/Cells: 301000
  • Total RAM Bits: 14251008
  • Number of I/O: 560
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BGA
재고4,800
EP2SGX30DF780C4N
Intel

IC FPGA 361 I/O 780FBGA

  • Number of LABs/CLBs: 1694
  • Number of Logic Elements/Cells: 33880
  • Total RAM Bits: 1369728
  • Number of I/O: 361
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA
  • Supplier Device Package: 780-FBGA (29x29)
패키지: 780-BBGA
재고4,896
hot EP3C25E144I7N
Intel

IC FPGA 82 I/O 144EQFP

  • Number of LABs/CLBs: 1539
  • Number of Logic Elements/Cells: 24624
  • Total RAM Bits: 608256
  • Number of I/O: 82
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-EQFP (20x20)
패키지: 144-LQFP Exposed Pad
재고4,976
EPM7256EGI192-15
Intel

IC CPLD 256MC 15NS 192PGA

  • Programmable Type: EE PLD
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.5 V ~ 5.5 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 5000
  • Number of I/O: 164
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고6,192
hot EPM7128STC100-6N
Intel

IC CPLD 128MC 6NS 100TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 84
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
패키지: 100-TQFP
재고4,768
5AGXMB1G6F31C6G
Intel

IC FPGA 384 I/O 896FBGA

  • Number of LABs/CLBs: 14151
  • Number of Logic Elements/Cells: 300000
  • Total RAM Bits: 17358848
  • Number of I/O: 384
  • Number of Gates: -
  • Voltage - Supply: 1.07V ~ 1.13V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
패키지: 896-BBGA, FCBGA
재고5,120
1SG165HN2F43I2VGAS
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 206250
  • Number of Logic Elements/Cells: 1650000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
패키지: -
Request a Quote
5SGXMBBR1H43C2LG
Intel

IC FPGA 600 I/O 1760HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-HBGA (45x45)
패키지: -
Request a Quote
A82385-33
Intel

MEMORY CONTROLLER, CMOS

  • Controller Type: Controller Hub
  • Voltage - Supply: 4.75V ~ 5.25V
  • Operating Temperature: 0°C ~ 75°C (TC)
  • Package / Case: 132-BCPGA
  • Supplier Device Package: 132-CPGA (36.8x36.8)
패키지: -
Request a Quote
AGIB041R29D1E2VR1
Intel

IC FPGA AGILEX-I 2957BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 4M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2957-BFBGA Exposed Pad
  • Supplier Device Package: 2957-BGA (56x45)
패키지: -
Request a Quote
AGFB027R24C2I2VB
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
패키지: -
Request a Quote
1SX280HU2F50E2LGS3
Intel

IC FPGA STRATIX 10 2397FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2800K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
패키지: -
Request a Quote
AF82SM35
Intel

IC INTERFACE SYSTEM 493FCBGA

  • Type: Interface System
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 493-TFBGA, FCBGA
  • Supplier Device Package: 493-FCBGA (14x14)
패키지: -
Request a Quote
5SGXEA5H2F35I2G
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: -
Request a Quote