Intel 제품

5CSXFC4C6U23C6N

Intel

IC FPGA 224 I/O 672UBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 925MHz
• Primary Attributes: FPGA - 40K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-FBGA
• Supplier Device Package: 672-UBGA (23x23)

패키지: 672-FBGA

EP1S40F780I8

Intel

IC FPGA STRATIX 780FBGA

• Number of LABs/CLBs: 4125
• Number of Logic Elements/Cells: 41250
• Total RAM Bits: 3423744
• Number of I/O: 615
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

패키지: 780-BBGA, FCBGA

EPF10K130EBC600-1E

Intel

IC FPGA

• Number of LABs/CLBs: 832
• Number of Logic Elements/Cells: 6656
• Total RAM Bits: 65536
• Number of I/O: 424
• Number of Gates: 342000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 600-BGA
• Supplier Device Package: 600-BGA (45x45)

패키지: 600-BGA

EPF10K30EFC256-1

Intel

IC FPGA 176 I/O 256FBGA

• Number of LABs/CLBs: 216
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 24576
• Number of I/O: 176
• Number of Gates: 119000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

패키지: 256-BGA

EPF10K130EBC356-2

Intel

IC FPGA 274 I/O 356BGA

• Number of LABs/CLBs: 832
• Number of Logic Elements/Cells: 6656
• Total RAM Bits: 65536
• Number of I/O: 274
• Number of Gates: 342000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 356-LBGA
• Supplier Device Package: 356-BGA (35x35)

패키지: 356-LBGA

EP1S80F1508I7N

Intel

IC FPGA 1203 I/O 1508FBGA

• Number of LABs/CLBs: 7904
• Number of Logic Elements/Cells: 79040
• Total RAM Bits: 7427520
• Number of I/O: 1203
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1508-BBGA, FCBGA
• Supplier Device Package: 1508-FBGA (30x30)

패키지: 1508-BBGA, FCBGA

EP4SE360H29I3

Intel

IC FPGA 488 I/O 780HBGA

• Number of LABs/CLBs: 14144
• Number of Logic Elements/Cells: 353600
• Total RAM Bits: 23105536
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

패키지: 780-BBGA, FCBGA

5SGXEA7N3F45C4

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

패키지: 1932-BBGA, FCBGA

5SGSED6K3F40C4N

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 220000
• Number of Logic Elements/Cells: 583000
• Total RAM Bits: 54553600
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

패키지: 1517-BBGA, FCBGA

10AX090H3F34I2SG

Intel

IC FPGA 504 I/O 1152FCBGA

• Number of LABs/CLBs: 339620
• Number of Logic Elements/Cells: 900000
• Total RAM Bits: 59234304
• Number of I/O: 504
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

패키지: 1152-BBGA, FCBGA

10AX057K2F40I1HG

Intel

IC FPGA 696 I/O 1517FCBGA

• Number of LABs/CLBs: 217080
• Number of Logic Elements/Cells: 570000
• Total RAM Bits: 42082304
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

패키지: 1517-BBGA, FCBGA

10AX027E3F29I2LG

Intel

780-PIN FBGA

• Number of LABs/CLBs: 101620
• Number of Logic Elements/Cells: 270000
• Total RAM Bits: 17870848
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

패키지: 780-BBGA, FCBGA

EPM3032ALC44-7

Intel

IC CPLD 32MC 7.5NS 44PLCC

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 32
• Number of Gates: 600
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

패키지: 44-LCC (J-Lead)

AGID019R18A1I2VB

Intel

IC

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1805-BBGA Exposed Pad
• Supplier Device Package: 1805-BGA (42.5x42.5)

패키지: -

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AGFC023R24C3E3E

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

패키지: -

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1SX210HN3F43I3VG

Intel

IC FPGA STRATIX 10 1760FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2100K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

패키지: -

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1SG110HN3F43E1VG

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 137500
• Number of Logic Elements/Cells: 1100000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

패키지: -

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5SGXMA7K3F40I4WN

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

패키지: -

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AGIA035R39A2I3V

Intel

IC FPGA AGILEX-I 3948FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 3.54M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3948-BFBGA Exposed Pad
• Supplier Device Package: 3948-BGA (56x56)

패키지: -

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5SGXMABN2F45C2G

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 359200
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 53248000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

패키지: -

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1ST110EN2F43I2LGAS

Intel

IC FPGA 440 I/O 1760FBGA

• Number of LABs/CLBs: 137500
• Number of Logic Elements/Cells: 1100000
• Total RAM Bits: -
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

패키지: -

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5SGSMD4E2H29C3WN

Intel

IC FPGA 360 I/O 780HBGA

• Number of LABs/CLBs: 135840
• Number of Logic Elements/Cells: 360000
• Total RAM Bits: 19456000
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

패키지: -

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EP2AGZ350HF40I4G

Intel

IC FPGA 734 I/O 1517FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

패키지: -

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TN82527

Intel

LAN CONTROLLER, 2 CHANNEL(S), CM

• Protocol: -
• Function: Controller
• Interface: -
• Standards: -
• Voltage - Supply: 4.5V ~ 5.5V
• Current - Supply: 50mA
• Operating Temperature: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC

패키지: -

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5AGXFB7K4F40I5G

Intel

IC FPGA 704 I/O 1517FBGA

• Number of LABs/CLBs: 23786
• Number of Logic Elements/Cells: 504140
• Total RAM Bits: 2975744
• Number of I/O: 704
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA, FC (40x40)

패키지: -

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EPM240T100C5AA

Intel

IC CPLD 192MC 7.5NS 100TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5 ns
• Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
• Number of Logic Elements/Blocks: 240
• Number of Macrocells: 192
• Number of Gates: -
• Number of I/O: 80
• Operating Temperature: 0°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

패키지: -

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AGFD023R24C2E4X

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

패키지: -

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A5EC065BB32AE4SR0

Intel

IC

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

패키지: -

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