페이지 310 - Intel 제품 | Heisener Electronics
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Intel 제품

기록 9,824
페이지  310/351
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hot GT28F320C3BA110
Intel

IC FLASH 32MBIT 110NS 48UBGA

  • Memory Type: Non-Volatile
  • Memory Format: FLASH
  • Technology: FLASH - Boot Block
  • Memory Size: 32Mb (2M x 16)
  • Memory Interface: Parallel
  • Clock Frequency: -
  • Write Cycle Time - Word, Page: 110ns
  • Access Time: 110ns
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFBGA
  • Supplier Device Package: 48-µBGA CSP
패키지: 48-VFBGA
재고39,936
1SX250LN3F43I2LG
Intel

1760-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고6,768
10AS057N3F40E2SG
Intel

IC SOC FPGA 588 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 570K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
패키지: 1517-BBGA, FCBGA
재고2,592
EPXA1F484C2
Intel

IC EXCALIBUR ARM 484FBGA

  • Core Type: 32-Bit ARM9
  • Speed: 200MHz
  • Interface: EBI/EMI, UART/USART
  • Program SRAM Bytes: 32K
  • FPGA SRAM: -
  • EEPROM Size: -
  • Data SRAM Bytes: 16K
  • FPGA Core Cells: 4160
  • FPGA Gates: 100K
  • FPGA Registers: -
  • Voltage - Supply: 1.8V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고7,712
HC20K600BC652
Intel

IC FPGA APEX 652BGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 24320
  • Total RAM Bits: 311296
  • Number of I/O: -
  • Number of Gates: 600000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: -
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고3,008
EP20K600EFC784-2
Intel

IC FPGA

  • Number of LABs/CLBs: 2432
  • Number of Logic Elements/Cells: 24320
  • Total RAM Bits: 311296
  • Number of I/O: -
  • Number of Gates: 1537000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고2,944
10M08DAF484C7G
Intel

IC FPGA 250 I/O 484FBGA

  • Number of LABs/CLBs: 500
  • Number of Logic Elements/Cells: 8000
  • Total RAM Bits: 387072
  • Number of I/O: 250
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BGA
재고3,136
hot EPF8636ALC84-3
Intel

IC FPGA 68 I/O 84PLCC

  • Number of LABs/CLBs: 63
  • Number of Logic Elements/Cells: 504
  • Total RAM Bits: -
  • Number of I/O: 68
  • Number of Gates: 6000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.21x29.21)
패키지: 84-LCC (J-Lead)
재고5,344
EPF10K30EFC484-2
Intel

IC FPGA 220 I/O 484FBGA

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 24576
  • Number of I/O: 220
  • Number of Gates: 119000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고6,624
EP20K1000EBC652-2
Intel

IC FPGA 488 I/O 652BGA

  • Number of LABs/CLBs: 3840
  • Number of Logic Elements/Cells: 38400
  • Total RAM Bits: 327680
  • Number of I/O: 488
  • Number of Gates: 1772000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 652-BBGA
  • Supplier Device Package: 652-BGA (45x45)
패키지: 652-BBGA
재고5,248
EPF10K50VBI356-4N
Intel

IC FPGA 274 I/O 356BGA

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 20480
  • Number of I/O: 274
  • Number of Gates: 116000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 356-LBGA
  • Supplier Device Package: 356-BGA (35x35)
패키지: 356-LBGA
재고7,232
hot EP1S40F1020C7N
Intel

IC FPGA 773 I/O 1020FBGA

  • Number of LABs/CLBs: 4125
  • Number of Logic Elements/Cells: 41250
  • Total RAM Bits: 3423744
  • Number of I/O: 773
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
패키지: 1020-BBGA
재고6,176
hot EP1K30FC256-1
Intel

IC FPGA 171 I/O 256FBGA

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 24576
  • Number of I/O: 171
  • Number of Gates: 119000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BBGA
재고4,528
5SGSMD5H3F35I3L
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 172600
  • Number of Logic Elements/Cells: 457000
  • Total RAM Bits: 46769152
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BBGA, FCBGA
재고2,112
5SGXEA5N3F45C2N
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
패키지: 1932-BBGA, FCBGA
재고6,592
5AGZME5K2F40C3N
Intel

IC FPGA 674 I/O 1517FBGA

  • Number of LABs/CLBs: 18870
  • Number of Logic Elements/Cells: 400000
  • Total RAM Bits: 34322432
  • Number of I/O: 674
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: 1517-BBGA, FCBGA
재고7,808
5SGXMA7K2F40C1N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: 1517-BBGA, FCBGA
재고5,392
5AGXFB5H4F35I5N
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 19811
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 23625728
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA Exposed Pad
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BBGA, FCBGA Exposed Pad
재고3,824
5AGXBA7D4F35I5N
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 11460
  • Number of Logic Elements/Cells: 242000
  • Total RAM Bits: 15470592
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA Exposed Pad
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BBGA, FCBGA Exposed Pad
재고5,856
hot EP3C55F484C7N
Intel

IC FPGA 327 I/O 484FBGA

  • Number of LABs/CLBs: 3491
  • Number of Logic Elements/Cells: 55856
  • Total RAM Bits: 2396160
  • Number of I/O: 327
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BGA
재고4,720
EP4CE15E22C9LN
Intel

IC FPGA 81 I/O 144EQFP

  • Number of LABs/CLBs: 963
  • Number of Logic Elements/Cells: 15408
  • Total RAM Bits: 516096
  • Number of I/O: 81
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-EQFP (20x20)
패키지: 144-LQFP Exposed Pad
재고7,408
hot EPM7160STC100-7N
Intel

IC CPLD 160MC 7.5NS 100TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 10
  • Number of Macrocells: 160
  • Number of Gates: 3200
  • Number of I/O: 84
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
패키지: 100-TQFP
재고5,984
hot EPM9560RC240-15
Intel

IC CPLD 560MC 15NS 240RQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 35
  • Number of Macrocells: 560
  • Number of Gates: 12000
  • Number of I/O: 191
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-RQFP (32x32)
패키지: 240-BFQFP Exposed Pad
재고13,128
5AGXBA5D4F35I5G
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 8962
  • Number of Logic Elements/Cells: 190000
  • Total RAM Bits: 13284352
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07V ~ 1.13V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BBGA, FCBGA
재고6,064
5SGXMB5R3F43I3LG
Intel

IC FPGA 600 I/O 1760FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 41984000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
패키지: -
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AGIB022R31B2I1V
Intel

IC FPGA AGILEX-I 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.2M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
AGID023R18A2E2VB
Intel

IC FPGA AGILEX-I 1805BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1805-BBGA Exposed Pad
  • Supplier Device Package: 1805-BGA (42.5x42.5)
패키지: -
Request a Quote
5SGXMB9R2H43I2G
Intel

IC FPGA 600 I/O 1760HBGA

  • Number of LABs/CLBs: 317000
  • Number of Logic Elements/Cells: 840000
  • Total RAM Bits: 53248000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-HBGA (45x45)
패키지: -
Request a Quote