페이지 324 - Intel 제품 | Heisener Electronics
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Intel 제품

기록 9,824
페이지  324/351
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hot S82562EH
Intel

IC ETH 10/100 PLC DEV CTRL 64QFP

  • Protocol: Ethernet
  • Function: Controller
  • Interface: PCI
  • Standards: 10/100 Base-T/TX PHY
  • Voltage - Supply: 3 V ~ 3.6 V
  • Current - Supply: -
  • Operating Temperature: -
  • Package / Case: 64-QFP
  • Supplier Device Package: 64-QFP
패키지: 64-QFP
재고6,384
EP20K100CF144C7ES
Intel

IC FPGA

  • Number of LABs/CLBs: 416
  • Number of Logic Elements/Cells: 4160
  • Total RAM Bits: 53248
  • Number of I/O: 93
  • Number of Gates: 263000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고7,536
10M08DFF484C7G
Intel

IC FPGA 250 I/O 484FBGA

  • Number of LABs/CLBs: 500
  • Number of Logic Elements/Cells: 8000
  • Total RAM Bits: 387072
  • Number of I/O: 250
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BGA
재고7,776
hot EP20K100ETC144-1
Intel

IC FPGA 92 I/O 144TQFP

  • Number of LABs/CLBs: 416
  • Number of Logic Elements/Cells: 4160
  • Total RAM Bits: 53248
  • Number of I/O: 92
  • Number of Gates: 263000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고3,936
EP1S10F672C6N
Intel

IC FPGA 345 I/O 672FBGA

  • Number of LABs/CLBs: 1057
  • Number of Logic Elements/Cells: 10570
  • Total RAM Bits: 920448
  • Number of I/O: 345
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA
  • Supplier Device Package: 672-FBGA (27x27)
패키지: 672-BBGA
재고7,296
EPF10K30AFC484-1
Intel

IC FPGA 246 I/O 484FBGA

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 12288
  • Number of I/O: 246
  • Number of Gates: 69000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고7,920
hot EP20K200EFC484-2
Intel

IC FPGA 376 I/O 484FBGA

  • Number of LABs/CLBs: 832
  • Number of Logic Elements/Cells: 8320
  • Total RAM Bits: 106496
  • Number of I/O: 376
  • Number of Gates: 526000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고14,352
EP3SE110F1152C4L
Intel

IC FPGA 744 I/O 1152FBGA

  • Number of LABs/CLBs: 4300
  • Number of Logic Elements/Cells: 107500
  • Total RAM Bits: 8936448
  • Number of I/O: 744
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: 1152-BBGA, FCBGA
재고2,144
5SGSMD3E2H29C2L
Intel

IC FPGA 360 I/O 780HBGA

  • Number of LABs/CLBs: 89000
  • Number of Logic Elements/Cells: 236000
  • Total RAM Bits: 16937984
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
패키지: 780-BBGA, FCBGA
재고2,096
5SGXMA5N3F40C3N
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: 1517-BBGA, FCBGA
재고5,456
EP3SL110F780I3N
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: 4300
  • Number of Logic Elements/Cells: 107500
  • Total RAM Bits: 4992000
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
패키지: 780-BBGA, FCBGA
재고4,992
hot EPM7128SLC84-10
Intel

IC CPLD 128MC 10NS 84PLCC

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 68
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
패키지: 84-LCC (J-Lead)
재고6,192
hot EPM1270T144C4N
Intel

IC CPLD 980MC 6.2NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.2ns
  • Voltage Supply - Internal: 2.5V, 3.3V
  • Number of Logic Elements/Blocks: 1270
  • Number of Macrocells: 980
  • Number of Gates: -
  • Number of I/O: 116
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고6,352
5M40ZE64I5N
Intel

IC CPLD 32MC 7.5NS 64EQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 1.71 V ~ 1.89 V
  • Number of Logic Elements/Blocks: 40
  • Number of Macrocells: 32
  • Number of Gates: -
  • Number of I/O: 54
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 64-TQFP Exposed Pad
  • Supplier Device Package: 64-EQFP (7x7)
패키지: 64-TQFP Exposed Pad
재고49,734
5SGXEA5K3F35C4G
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: -
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5SGSMD6N3F45I4G
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 220000
  • Number of Logic Elements/Cells: 583000
  • Total RAM Bits: 46080000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
패키지: -
Request a Quote
5SGSMD3H3F35C4WN
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 89000
  • Number of Logic Elements/Cells: 236000
  • Total RAM Bits: 13312000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: -
Request a Quote
1SD280PT3F55I3VGS1
Intel

IC FPGA 816 I/O 2912FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 2753000
  • Total RAM Bits: 240123904
  • Number of I/O: 816
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2912-BBGA, FCBGA
  • Supplier Device Package: 2912-FBGA (55x55)
패키지: -
Request a Quote
RK80532KE056512
Intel

IC MPU INTEL XEON 2.4GHZ 604PPGA

  • Core Processor: Intel® Xeon® Processor
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 2.4GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V
  • Operating Temperature: 74°C (TC)
  • Security Features: -
  • Package / Case: 604-PGA
  • Supplier Device Package: 604-PPGA (42.5x42.5)
패키지: -
Request a Quote
AGFB023R25A1I1V
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
5SGXEA7N1F45C1WN
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
패키지: -
Request a Quote
AGFC019R25A3E3E
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
1SG250HN1F43I1VG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 312500
  • Number of Logic Elements/Cells: 2500000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
패키지: -
Request a Quote
AGFA027R24C2I2V
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
EWIXP455BAC
Intel

IC MPU INTEL 400MHZ PBGA544

  • Core Processor: Intel® IXP45x
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: Mll (3), SMII (3)
  • SATA: -
  • USB: USB 1.1 (1), USB 2.0 (1)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: 3DES, AES, DES, MD5, RNG, SHA1
  • Package / Case: 544-BBGA
  • Supplier Device Package: 544-PBGA (35x35)
패키지: -
Request a Quote
AGFA023R25A2E3E
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
5SGXEA3H2F35C2LG
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: -
Request a Quote
AGFB006R24D1E2V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 573K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
패키지: -
Request a Quote