페이지 42 - Intel 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
10AX027E2F29E1SG	Intel	IC FPGA 360 I/O 780FBGA Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Total RAM Bits: 17870848 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	패키지: 780-BBGA, FCBGA	재고6,928
EP20K200EQI240-3	Intel	IC FPGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 168 Number of Gates: 526000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BQFP Supplier Device Package: 240-PQFP (32x32)	패키지: 240-BQFP	재고4,960
EP1M350F780C7ES	Intel	IC FPGA Number of LABs/CLBs: 1440 Number of Logic Elements/Cells: 14400 Total RAM Bits: 114688 Number of I/O: 486 Number of Gates: 350000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	패키지: 780-BBGA, FCBGA	재고3,888
EPF6024AFC256-1	Intel	IC FPGA 219 I/O 256FBGA Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 1960 Total RAM Bits: - Number of I/O: 219 Number of Gates: 24000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	패키지: 256-BGA	재고5,088
EP20K100FI324-2XV	Intel	IC FPGA 252 I/O 324FBGA Number of LABs/CLBs: 416 Number of Logic Elements/Cells: 4160 Total RAM Bits: 53248 Number of I/O: 252 Number of Gates: 263000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-BGA Supplier Device Package: 324-FBGA (19x19)	패키지: 324-BGA	재고7,424
EPF10K30ETC144-1	Intel	IC FPGA 102 I/O 144TQFP Number of LABs/CLBs: 216 Number of Logic Elements/Cells: 1728 Total RAM Bits: 24576 Number of I/O: 102 Number of Gates: 119000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	패키지: 144-LQFP	재고4,416
EP1S60F1020C7N	Intel	IC FPGA 773 I/O 1020FBGA Number of LABs/CLBs: 5712 Number of Logic Elements/Cells: 57120 Total RAM Bits: 5215104 Number of I/O: 773 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	패키지: 1020-BBGA	재고7,392
5SGXEB6R3F43C2N	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 61688832 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	패키지: 1760-BBGA, FCBGA	재고5,392
5SGXMA4K2F35I2LN	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 43983872 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	패키지: 1152-BBGA, FCBGA	재고5,056
5SGSMD4K2F40C2L	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Total RAM Bits: 23946240 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	패키지: 1517-BBGA, FCBGA	재고3,200
10AX057K1F40E1HG	Intel	IC FPGA 696 I/O 1517FCBGA Number of LABs/CLBs: 217080 Number of Logic Elements/Cells: 570000 Total RAM Bits: 42082304 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	패키지: 1517-BBGA, FCBGA	재고5,728
EP2SGX90FF1508C3N	Intel	IC FPGA 650 I/O 1508FBGA Number of LABs/CLBs: 4548 Number of Logic Elements/Cells: 90960 Total RAM Bits: 4520448 Number of I/O: 650 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1508-BBGA, FCBGA Supplier Device Package: 1508-FBGA (30x30)	패키지: 1508-BBGA, FCBGA	재고3,712
5SGXMA7K2F40C2	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	패키지: 1517-BBGA, FCBGA	재고4,464
5CEFA2U19I7N	Intel	IC FPGA 224 I/O 484UBGA Number of LABs/CLBs: 9434 Number of Logic Elements/Cells: 25000 Total RAM Bits: 2002944 Number of I/O: 224 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	패키지: 484-FBGA	재고21,168
AGFA006R16A2E3V	Intel	IC FPGA AGILEX-F 1546FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 573K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
AGIB022R29A1I1V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2957-BFBGA Exposed Pad Supplier Device Package: 2957-BGA (56x45)	패키지: -	Request a Quote
AGFB027R24C2E2VR2	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
5SGXEABN3F46C2LN	Intel	IC FPGA STRATIX V GX FLIP CHIP Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 54525952 Number of I/O: - Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: - Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
MQ80960MC25	Intel	IC MPU 25MHZ 164CQFP Core Processor: Intel® 80960XA Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5V Operating Temperature: 0°C ~ 85°C (TC) Security Features: - Package / Case: 164-BCQFP Exposed Pad Supplier Device Package: 164-CQFP (28.71x28.71)	패키지: -	Request a Quote
AGFB019R31C2E4X	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	패키지: -	Request a Quote
RK80532PE056512	Intel	IC MPU 2 2.4GHZ 478FCPGA Core Processor: Intel® Pentium® 4 Processor Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 2.4GHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.35V, 1.525V Operating Temperature: 71°C (TC) Security Features: - Package / Case: 478-BFCPGA Supplier Device Package: 478-FCPGA (35x35)	패키지: -	Request a Quote
AGFC019R25A2E2V	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
AGFB022R24C2E3V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
AGIB027R29A2E2VR0	Intel	IC FPGA AGILEX-I 2957FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
AGFD023R25A3E4X	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
EPMF256I5NAB	Intel	IC MAX IIZ CPLD BGA Programmable Type: - Delay Time tpd(1) Max: - Voltage Supply - Internal: - Number of Logic Elements/Blocks: - Number of Macrocells: - Number of Gates: - Number of I/O: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
AGFB022R31C2E2V	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
EP3SE110F1152C2G	Intel	IC FPGA 744 I/O 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote

10AX027E2F29E1SG

Intel

IC FPGA 360 I/O 780FBGA

Number of LABs/CLBs: 101620
Number of Logic Elements/Cells: 270000
Total RAM Bits: 17870848
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

패키지: 780-BBGA, FCBGA

재고6,928

EP20K200EQI240-3

Intel

IC FPGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: 168
Number of Gates: 526000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BQFP
Supplier Device Package: 240-PQFP (32x32)

패키지: 240-BQFP

재고4,960

EP1M350F780C7ES

Intel

IC FPGA

Number of LABs/CLBs: 1440
Number of Logic Elements/Cells: 14400
Total RAM Bits: 114688
Number of I/O: 486
Number of Gates: 350000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

패키지: 780-BBGA, FCBGA

재고3,888

EPF6024AFC256-1

Intel

IC FPGA 219 I/O 256FBGA

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 1960
Total RAM Bits: -
Number of I/O: 219
Number of Gates: 24000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

패키지: 256-BGA

재고5,088

EP20K100FI324-2XV

Intel

IC FPGA 252 I/O 324FBGA

Number of LABs/CLBs: 416
Number of Logic Elements/Cells: 4160
Total RAM Bits: 53248
Number of I/O: 252
Number of Gates: 263000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-BGA
Supplier Device Package: 324-FBGA (19x19)

패키지: 324-BGA

재고7,424

EPF10K30ETC144-1

Intel

IC FPGA 102 I/O 144TQFP

Number of LABs/CLBs: 216
Number of Logic Elements/Cells: 1728
Total RAM Bits: 24576
Number of I/O: 102
Number of Gates: 119000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

패키지: 144-LQFP

재고4,416

EP1S60F1020C7N

Intel

IC FPGA 773 I/O 1020FBGA

Number of LABs/CLBs: 5712
Number of Logic Elements/Cells: 57120
Total RAM Bits: 5215104
Number of I/O: 773
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

패키지: 1020-BBGA

재고7,392

5SGXEB6R3F43C2N

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 61688832
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

패키지: 1760-BBGA, FCBGA

재고5,392

5SGXMA4K2F35I2LN

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 43983872
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

패키지: 1152-BBGA, FCBGA

재고5,056

5SGSMD4K2F40C2L

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 135840
Number of Logic Elements/Cells: 360000
Total RAM Bits: 23946240
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

패키지: 1517-BBGA, FCBGA

재고3,200

10AX057K1F40E1HG

Intel

IC FPGA 696 I/O 1517FCBGA

Number of LABs/CLBs: 217080
Number of Logic Elements/Cells: 570000
Total RAM Bits: 42082304
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

패키지: 1517-BBGA, FCBGA

재고5,728

EP2SGX90FF1508C3N

Intel

IC FPGA 650 I/O 1508FBGA

Number of LABs/CLBs: 4548
Number of Logic Elements/Cells: 90960
Total RAM Bits: 4520448
Number of I/O: 650
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1508-BBGA, FCBGA
Supplier Device Package: 1508-FBGA (30x30)

패키지: 1508-BBGA, FCBGA

재고3,712

5SGXMA7K2F40C2

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

패키지: 1517-BBGA, FCBGA

재고4,464

5CEFA2U19I7N

Intel

IC FPGA 224 I/O 484UBGA

Number of LABs/CLBs: 9434
Number of Logic Elements/Cells: 25000
Total RAM Bits: 2002944
Number of I/O: 224
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

패키지: 484-FBGA

재고21,168

AGFA006R16A2E3V

Intel

IC FPGA AGILEX-F 1546FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 573K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

AGIB022R29A1I1V

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2957-BFBGA Exposed Pad
Supplier Device Package: 2957-BGA (56x45)

패키지: -

Request a Quote

AGFB027R24C2E2VR2

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

5SGXEABN3F46C2LN

Intel

IC FPGA STRATIX V GX FLIP CHIP

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 54525952
Number of I/O: -
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: -
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

MQ80960MC25

Intel

IC MPU 25MHZ 164CQFP

Core Processor: Intel® 80960XA
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5V
Operating Temperature: 0°C ~ 85°C (TC)
Security Features: -
Package / Case: 164-BCQFP Exposed Pad
Supplier Device Package: 164-CQFP (28.71x28.71)

패키지: -

Request a Quote

AGFB019R31C2E4X

Intel

IC FPGA AGILEX-F 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

패키지: -

Request a Quote

RK80532PE056512

Intel

IC MPU 2 2.4GHZ 478FCPGA

Core Processor: Intel® Pentium® 4 Processor
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 2.4GHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.35V, 1.525V
Operating Temperature: 71°C (TC)
Security Features: -
Package / Case: 478-BFCPGA
Supplier Device Package: 478-FCPGA (35x35)

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AGFC019R25A2E2V

Intel

IC FPGA AGILEX-F 2581FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

패키지: -

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AGFB022R24C2E3V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

패키지: -

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AGIB027R29A2E2VR0

Intel

IC FPGA AGILEX-I 2957FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

패키지: -

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AGFD023R25A3E4X

Intel

IC FPGA AGILEX-F 2581FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

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EPMF256I5NAB

Intel

IC MAX IIZ CPLD BGA

Programmable Type: -
Delay Time tpd(1) Max: -
Voltage Supply - Internal: -
Number of Logic Elements/Blocks: -
Number of Macrocells: -
Number of Gates: -
Number of I/O: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

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AGFB022R31C2E2V

Intel

IC FPGA AGILEX-F 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

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EP3SE110F1152C2G

Intel

IC FPGA 744 I/O 1152FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

패키지: -

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