이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC TXRX CAN 8DFN
|
패키지: 8-VDFN Exposed Pad |
재고2,944 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX LIN B/DIR 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고6,256 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고6,016 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN W/VREG 8DFN
|
패키지: 8-VDFN Exposed Pad |
재고2,464 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN W/VREG 8DFN
|
패키지: 8-VDFN Exposed Pad |
재고6,304 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN W/VREG 8DFN
|
패키지: 8-VDFN Exposed Pad |
재고3,936 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN W/VREG 8DFN
|
패키지: 8-VDFN Exposed Pad |
재고5,728 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-VDFN Exposed Pad |
재고4,800 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-WFDFN Exposed Pad |
재고7,536 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-VDFN Exposed Pad |
재고5,456 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-VDFN Exposed Pad |
재고2,656 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-WFDFN Exposed Pad |
재고5,408 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-VDFN Exposed Pad |
재고2,000 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-VDFN Exposed Pad |
재고2,880 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-WFDFN Exposed Pad |
재고2,992 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-VDFN Exposed Pad |
재고2,832 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX LIN W/VREG 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고16,728 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN W/VREG 8DIP
|
패키지: 8-DIP (0.300", 7.62mm) |
재고3,568 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX LIN W/VREG 8DIP
|
패키지: 8-DIP (0.300", 7.62mm) |
재고7,632 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX LIN W/VREG 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고4,992 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN W/VREG 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고2,336 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8TDFN
|
패키지: 8-WFDFN Exposed Pad |
재고6,960 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8DFN
|
패키지: 8-VDFN Exposed Pad |
재고5,472 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8TDFN
|
패키지: 8-WFDFN Exposed Pad |
재고3,792 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8DFN
|
패키지: 8-VDFN Exposed Pad |
재고3,824 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고3,072 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고5,680 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고2,736 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |