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제조업체 |
설명 |
패키지 |
재고 |
수량 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
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Molex, LLC |
CONN FFC VERT 11POS 0.50MM SMD
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패키지: - |
재고8,892 |
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Surface Mount | Contacts, Vertical, 1 Sided | 11 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 11POS 0.50MM SMD
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패키지: - |
재고3,418 |
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Surface Mount | Contacts, Vertical, 1 Sided | 11 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC 19POS 0.30MM R/A
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패키지: - |
재고2,142 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 19 | 0.012" (0.30mm) | Solder | 0.30mm | 0.039" (1.00mm) | - | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 15POS 0.50MM R/A
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패키지: - |
재고4,446 |
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Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 26
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패키지: - |
재고6,462 |
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Surface Mount, Right Angle | Contacts, Bottom | 26 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 29POS 1.25MM R/A
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패키지: - |
재고3,888 |
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Through Hole, Right Angle | Contacts, Top | 29 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 34POS 1.25MM R/A
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패키지: - |
재고7,056 |
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Through Hole, Right Angle | Contacts, Top | 34 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 13POS 0.50MM R/A
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패키지: - |
재고6,876 |
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Surface Mount, Right Angle | Contacts, Bottom | 13 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 4POS 0.50MM R/A
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패키지: - |
재고7,596 |
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Surface Mount, Right Angle | Contacts, Bottom | 4 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC VERT 5POS 1.00MM PCB
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패키지: - |
재고3,240 |
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Through Hole | Contacts, Vertical, 1 Sided | 5 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.205" (5.20mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA66), Nylon 6/6 | Polyester | Zero Insertion Force (ZIF) | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FPC BOTTOM 5POS 0.50MM R/A
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패키지: - |
재고2,502 |
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Surface Mount, Right Angle | Contacts, Bottom | 5 | 0.020" (0.50mm) | Solder | 0.12mm | 0.031" (0.80mm) | Flip Lock, Backlock | Notched | Phosphor Bronze | Gold | Polyamide (PA), Nylon, Glass Filled | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 HB |
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Molex, LLC |
CONN FFC VERT 34POS 1.25MM PCB
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패키지: - |
재고7,434 |
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Through Hole | Contacts, Vertical, 1 Sided | 34 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.315" (8.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 10POS 0.50MM R/A
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패키지: - |
재고2,016 |
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Surface Mount, Right Angle | Contacts, Bottom | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -30°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN CIC FFC PLUG 3POS 2.54MM
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패키지: - |
재고6,840 |
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Free Hanging (In-Line) | Plug | 3 | 0.100" (2.54mm) | IDC | 0.005-0.11mm, 0.36mm | - | Latch Lock | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT) | - | - | 250V | -40°C ~ 105°C | UL94 V-0 |
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Molex, LLC |
CONN CIC FFC RCPT 3POS 2.54MM
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패키지: - |
재고7,848 |
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Free Hanging (In-Line) | Receptacle | 3 | 0.100" (2.54mm) | IDC | 0.13-0.28mm, 0.30mm | - | - | Straight | Phosphor Bronze | Tin | Polyester, Glass Filled | - | - | 250V | -40°C ~ 105°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 6POS 0.5MM R/A
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패키지: - |
재고2,556 |
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Surface Mount, Right Angle | Contacts, Bottom | 6 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 32POS 1.25MM R/A
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패키지: - |
재고6,408 |
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Through Hole, Right Angle | Contacts, Top | 32 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 10POS 0.50MM SMD
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패키지: - |
재고2,664 |
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Surface Mount | Contacts, Vertical, 1 Sided | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 10POS 0.50MM SMD
|
패키지: - |
재고8,766 |
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Surface Mount | Contacts, Vertical, 1 Sided | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC TOP 13POS 1.00MM R/A
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패키지: - |
재고8,532 |
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Surface Mount, Right Angle | Contacts, Top | 13 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC 23POS .3MM SMD R/A
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패키지: - |
재고7,704 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 23 | 0.012" (0.30mm) | Solder | 0.20mm | 0.037" (0.95mm) | Flip Lock, Backlock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 8POS 0.50MM R/A
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패키지: - |
재고8,676 |
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Surface Mount, Right Angle | Contacts, Bottom | 8 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 33POS 1.25MM PCB
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패키지: - |
재고3,600 |
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Through Hole | Contacts, Vertical, 1 Sided | 33 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.315" (8.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC TOP 11POS 1.00MM R/A
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패키지: - |
재고7,218 |
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Surface Mount, Right Angle | Contacts, Top | 11 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 24
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패키지: - |
재고5,076 |
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Surface Mount, Right Angle | Contacts, Bottom | 24 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC/FPC 30POS .5MM SMD R/A
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패키지: - |
재고6,894 |
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Surface Mount, Right Angle | Contacts, Bottom | 30 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 125°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 11POS 0.50MM R/A
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패키지: - |
재고7,272 |
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Surface Mount, Right Angle | Contacts, Bottom | 11 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 8POS 0.50MM R/A
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패키지: - |
재고8,730 |
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Surface Mount, Right Angle | Contacts, Bottom | 8 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -25°C ~ 85°C | UL94 V-0 |