이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
패키지: 516-BBGA |
재고7,356 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
패키지: 516-BBGA |
재고3,616 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
패키지: 561-FBGA |
재고4,784 |
|
2 Core, 32-Bit | 667MHz | - | DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | - | 561-FBGA | 561-TEPBGA1 (23x23) |
||
NXP |
IC MPU Q OR IQ 500MHZ 457TEBGA
|
패키지: 457-LFBGA |
재고5,808 |
|
1 Core, 32-Bit | 500MHz | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 457-LFBGA | 457-TEPBGA-1 (19x19) |
||
NXP |
IC MPU M683XX 16MHZ 144LQFP
|
패키지: 144-LQFP |
재고6,840 |
|
1 Core, 8/16-Bit | 16MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
패키지: 357-BBGA |
재고47,088 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
패키지: 357-BBGA |
재고4,880 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
패키지: 624-FBGA, FCBGA |
재고7,008 |
|
4 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU I.MX6D 852MHZ 624FCBGA
|
패키지: 624-FBGA, FCBGA |
재고7,408 |
|
2 Core, 32-Bit | 852MHZ | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU M683XX 25MHZ 144QFP
|
패키지: 144-BQFP |
재고4,512 |
|
1 Core, 32-Bit | 25MHz | - | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 144-BQFP | 144-QFP (28x28) |
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
패키지: 516-BBGA |
재고2,864 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
패키지: 256-BBGA |
재고5,568 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | -40°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
패키지: 256-BBGA |
재고7,024 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | -40°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC83XX 400MHZ 668BGA
|
패키지: 668-BBGA Exposed Pad |
재고7,632 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 668-BBGA Exposed Pad | 668-PBGA-PGE (29x29) |
||
NXP |
IC MPU MPC83XX 400MHZ 668BGA
|
패키지: 668-BBGA Exposed Pad |
재고7,904 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 668-BBGA Exposed Pad | 668-PBGA-PGE (29x29) |
||
NXP |
IC MPU MPC8XX 133MHZ 357BGA
|
패키지: 357-BBGA |
재고6,016 |
|
1 Core, 32-Bit | 133MHz | Communications; CPM, Security; SEC | DRAM | No | - | 10 Mbps (3), 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 95°C (TA) | Cryptography | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC83XX 533MHZ 689TEBGA
|
패키지: 689-BBGA Exposed Pad |
재고7,920 |
|
1 Core, 32-Bit | 533MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 400MHZ 689TEBGA
|
패키지: 689-BBGA Exposed Pad |
재고3,872 |
|
1 Core, 32-Bit | 400MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 533MHZ 689TEBGA
|
패키지: 689-BBGA Exposed Pad |
재고16,992 |
|
1 Core, 32-Bit | 533MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 400MHZ 689TEBGA
|
패키지: 689-BBGA Exposed Pad |
재고5,888 |
|
1 Core, 32-Bit | 400MHz | Security; SEC 3.0 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 266MHZ 620BGA
|
패키지: 620-BBGA Exposed Pad |
재고3,184 |
|
1 Core, 32-Bit | 266MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
패키지: 620-BBGA Exposed Pad |
재고7,168 |
|
1 Core, 32-Bit | 400MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
패키지: 620-BBGA Exposed Pad |
재고11,904 |
|
1 Core, 32-Bit | 400MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC52XX 400MHZ 272BGA
|
패키지: 272-BBGA |
재고11,316 |
|
1 Core, 32-Bit | 400MHz | - | DDR, SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | 2.5V, 3.3V | -40°C ~ 85°C (TA) | - | 272-BBGA | 272-PBGA (27x27) |
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
패키지: 516-BBGA |
재고5,808 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
패키지: 561-FBGA |
재고6,080 |
|
1 Core, 32-Bit | 667MHz | Communications; QUICC Engine, Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | 0°C ~ 125°C (TA) | Cryptography, Random Number Generator | 561-FBGA | 561-TEPBGA1 (23x23) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
패키지: 689-BBGA Exposed Pad |
재고22,140 |
|
1 Core, 32-Bit | 800MHz | Communications; QUICC Engine, Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | 0°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU Q OR IQ 800MHZ 457TEBGA
|
패키지: 457-LFBGA |
재고3,360 |
|
1 Core, 32-Bit | 800MHz | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 457-LFBGA | 457-TEPBGA-1 (19x19) |