이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
패키지: 561-FBGA |
재고5,424 |
|
1 Core, 32-Bit | 667MHz | Communications; QUICC Engine | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | - | 561-FBGA | 561-TEPBGA1 (23x23) |
||
NXP |
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
패키지: 624-FBGA, FCBGA |
재고3,104 |
|
2 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
패키지: 624-FBGA, FCBGA |
재고4,032 |
|
2 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU MPC52XX 400MHZ 272BGA
|
패키지: 272-BBGA |
재고7,488 |
|
1 Core, 32-Bit | 400MHz | - | DDR, SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | 2.5V, 3.3V | -40°C ~ 85°C (TA) | - | 272-BBGA | 272-PBGA (27x27) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
패키지: 620-BBGA Exposed Pad |
재고3,984 |
|
1 Core, 32-Bit | 400MHz | Security; SEC | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
패키지: 620-BBGA Exposed Pad |
재고6,432 |
|
1 Core, 32-Bit | 400MHz | Security; SEC | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
패키지: 689-BBGA Exposed Pad |
재고6,208 |
|
2 Core, 32-Bit | 800MHz | Communications; QUICC Engine | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
패키지: 689-BBGA Exposed Pad |
재고5,520 |
|
1 Core, 32-Bit | 1.055GHz | - | DDR2, DDR3 | No | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 400MHZ 740TBGA
|
패키지: 740-LBGA |
재고3,072 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC SOC 2CORE 1200MHZ SW 780FCBGA
|
패키지: 780-FBGA, FCBGA |
재고6,800 |
|
2 Core, 64-Bit | 1.4GHz | - | DDR3L/4 | No | - | 1 Gbps (12) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | - | 780-FBGA, FCBGA | 780-FCPBGA (23x23) |
||
NXP |
IC SOC 2CORE 1200MHZ 780FCBGA
|
패키지: 780-FBGA, FCBGA |
재고2,112 |
|
2 Core, 64-Bit | 1.4GHz | - | DDR3L/4 | No | - | 1 Gbps (5) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | 780-FBGA, FCBGA | 780-FCPBGA (23x23) |
||
NXP |
IC MPU MPC83XX 400MHZ 689TEBGA
|
패키지: 689-BBGA Exposed Pad |
재고2,112 |
|
1 Core, 32-Bit | 400MHz | Security; SEC 3.0 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 400MHZ 668BGA
|
패키지: 668-BBGA Exposed Pad |
재고2,704 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine, Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 668-BBGA Exposed Pad | 668-PBGA-PGE (29x29) |
||
NXP |
IC MPU MPC8XX 80MHZ 256BGA
|
패키지: 256-BBGA |
재고16,584 |
|
1 Core, 32-Bit | 80MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | 0°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC83XX 400MHZ 672TBGA
|
패키지: 672-LBGA |
재고4,672 |
|
1 Core, 32-Bit | 400MHz | Security; SEC | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
패키지: 689-BBGA Exposed Pad |
재고4,832 |
|
2 Core, 32-Bit | 1.055GHz | - | DDR2, DDR3 | No | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU I.MX6Q 852MHZ 624FCBGA
|
패키지: 624-FBGA, FCBGA |
재고8,052 |
|
4 Core, 32-Bit | 852MHZ | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
패키지: 689-BBGA Exposed Pad |
재고4,912 |
|
1 Core, 32-Bit | 667MHz | Security; SEC 3.0 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
패키지: 689-BBGA Exposed Pad |
재고7,808 |
|
2 Core, 32-Bit | 800MHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU M683XX 20MHZ 132QFP
|
패키지: 132-BQFP Bumpered |
재고7,600 |
|
1 Core, 8/16-Bit | 20MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 5.0V | -40°C ~ 85°C (TA) | - | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) |
||
NXP |
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
패키지: 689-BBGA Exposed Pad |
재고7,456 |
|
1 Core, 32-Bit | 1.055GHz | - | DDR2, DDR3 | No | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU M683XX 16MHZ 144LQFP
|
패키지: 144-LQFP |
재고5,664 |
|
1 Core, 8/16-Bit | 16MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 3.3V | -40°C ~ 85°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
패키지: 624-FBGA, FCBGA |
재고3,296 |
|
4 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU M683XX 25MHZ 144LQFP
|
패키지: 144-LQFP |
재고7,280 |
|
1 Core, 32-Bit | 25MHz | - | DRAM | No | - | - | - | - | 5.0V | -40°C ~ 85°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
IC MPU MPC8XX 133MHZ 357BGA
|
패키지: 357-BBGA |
재고3,856 |
|
1 Core, 32-Bit | 133MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 133MHZ 357BGA
|
패키지: 357-BBGA |
재고3,936 |
|
1 Core, 32-Bit | 133MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU I.MX6Q 852MHZ 624FCBGA
|
패키지: 624-FBGA, FCBGA |
재고5,200 |
|
4 Core, 32-Bit | 852MHZ | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC SOC 2CORE 1200MHZ 780FCBGA
|
패키지: 780-FBGA, FCBGA |
재고7,328 |
|
2 Core, 64-Bit | 1.4GHz | - | DDR3L/4 | No | - | 1 Gbps (5) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | - | 780-FBGA, FCBGA | 780-FCPBGA (23x23) |