페이지 250 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
MRF1550NT1	NXP	FET RF 40V 175MHZ TO272-6 WRAP Transistor Type: LDMOS Frequency: 175MHz Gain: 14.5dB Voltage - Test: 12.5V Current Rating: 12A Noise Figure: - Current - Test: 500mA Power - Output: 50W Voltage - Rated: 40V Package / Case: TO-272AA Supplier Device Package: TO-272-6	패키지: TO-272AA	재고11,844
BZX84-C24/LF1VL	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 24V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 70 Ohms Current - Reverse Leakage @ Vr: 50nA @ 16.8V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	패키지: TO-236-3, SC-59, SOT-23-3	재고5,984
BZX84-C13/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 13V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 30 Ohms Current - Reverse Leakage @ Vr: 100nA @ 8V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	패키지: TO-236-3, SC-59, SOT-23-3	재고2,704
PCF8566T/S480/1,11	NXP	IC LCD DVR UNIV LOW-MUX 40VSOP Display Type: LCD Configuration: 7 Segment + DP, 14 Segment (24 Segment) Interface: I2C Digits or Characters: 6 Characters, 12 Digits, 96 Elements Current - Supply: 30µA Voltage - Supply: 2.5 V ~ 6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-BSOP (0.295", 7.50mm Width) Supplier Device Package: 40-VSO	패키지: 40-BSOP (0.295", 7.50mm Width)	재고4,288
HEF4027BP,652	NXP	IC JK TYPE POS TRG DUAL 16DIP Function: Set(Preset) and Reset Type: JK Type Output Type: Differential Number of Elements: 2 Number of Bits per Element: 1 Clock Frequency: 30MHz Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 3mA, 3mA Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Iq): 16µA Input Capacitance: 7.5pF Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm)	패키지: 16-DIP (0.300", 7.62mm)	재고4,208
N74F243N,602	NXP	IC BUS TRANSCVR 3-ST 4BIT 14DIP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 15mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 14-DIP (0.300", 7.62mm) Supplier Device Package: 14-DIP	패키지: 14-DIP (0.300", 7.62mm)	재고4,048
SC18IS601IPW,112	NXP	IC CONTROLLER SPI/I2C 16TSSOP Protocol: I2C Function: Controller Interface: SPI Standards: - Voltage - Supply: 2.4 V ~ 3.6 V Current - Supply: 11mA Operating Temperature: -40°C ~ 85°C Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	패키지: 16-TSSOP (0.173", 4.40mm Width)	재고5,616
LS101MASE7DFA	NXP	IC PROCESSOR DUAL CORE Core Processor: ARM1136JF-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 650MHz Co-Processors/DSP: - RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 448-FBGA Exposed Pad Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)	패키지: 448-FBGA Exposed Pad	재고7,904
P4080NSN1PNB	NXP	IC MPU Q OR IQ 1.5GHZ 1295FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 8 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 10 Gbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	패키지: 1295-BBGA, FCBGA	재고3,824
MPC8544EVJARJA	NXP	IC MPU MPC85XX 1.067GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고5,632
MC68SEC000AA10	NXP	IC MPU M680X0 10MHZ 64QFP Core Processor: EC000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 10MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V, 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	패키지: 64-QFP	재고6,600
MCF5274LVM166J	NXP	IC MCU 32BIT ROMLESS 196MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 166MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, WDT Number of I/O: 61 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	패키지: 196-LBGA	재고6,032
P89LPC9161FDH,129	NXP	IC MCU 8BIT 2KB FLASH 16TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 4x8b; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	패키지: 16-TSSOP (0.173", 4.40mm Width)	재고3,664
MC68HC705L5FUE	NXP	IC MCU 8BIT 8KB EPROM 80QFP Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SPI Peripherals: LCD, POR, WDT Number of I/O: 16 Program Memory Size: 8KB (8K x 8) Program Memory Type: EPROM, UV EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	패키지: 80-QFP	재고7,856
MPC5554AZP132	NXP	IC MCU 32BIT 2MB FLASH 416BGA Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	패키지: 416-BBGA	재고5,360
SPC5674KF0VMS2R	NXP	IC MCU 32BIT 1.5MB FLASH 473BGA Core Processor: e200z7d Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V Data Converters: A/D 34x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	패키지: 473-LFBGA	재고6,032
MK20DN64VFM5	NXP	IC MCU 32BIT 64KB FLASH 32QFN Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 20 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 6x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN Exposed Pad (5x5)	패키지: 32-VFQFN Exposed Pad	재고4,512
TDA8754HL/21/C1,55	NXP	IC TRPL 8BIT VIDEO ADC 144LQFP Type: ADC, Video Number of Channels: - Resolution (Bits): 8 b Sampling Rate (Per Second): 210M Data Interface: Serial Voltage Supply Source: Analog and Digital Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -10°C ~ 70°C Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고6,688
PCKEL14D,118	NXP	IC CLK BUFFER 2:5 1GHZ 20SO Type: Fanout Buffer (Distribution), Multiplexer Number of Circuits: 1 Ratio - Input:Output: 2:5 Differential - Input:Output: Yes/Yes Input: ECL, PECL Output: PECL Frequency - Max: 1GHz Voltage - Supply: 2.375 V ~ 3.8 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	패키지: 20-SOIC (0.295", 7.50mm Width)	재고6,480
MPXA6115AC6T1	NXP	PRESSURE SENS 16.7PSI MAX 8-SOP Pressure Type: Absolute Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.7 V Accuracy: ±1.5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: Male - 0.13" (3.17mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD, Gull Wing, Top Port Supplier Device Package: -	패키지: 8-SMD, Gull Wing, Top Port	재고6,498
TWR-13237-KIT	NXP	KIT DEVELOPMENT MC13237CHT Type: Transceiver; 802.15.4 (ZigBee?) Frequency: 2.4GHz For Use With/Related Products: MC1323x Supplied Contents: 4 Boards	패키지: -	재고8,964
S912ZVML64AWKH	NXP	S12Z CORE, 64K FLASH, LIN, 64LQF Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 24 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Data Converters: A/D 9x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-HLQFP (10x10)	패키지: -	Request a Quote
LPC4357JBD208K	NXP	IC MCU 32BIT 1MB FLASH 208LQFP Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Speed: 204MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Number of I/O: 142 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 208-LQFP Supplier Device Package: 208-LQFP (28x28)	패키지: -	Request a Quote
MIMXRT1062DVJ6B	NXP	IC MCU 32BIT EXT MEM 196LFBGA Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Speed: 600MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 127 Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 20x12b Oscillator Type: External, Internal Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-LFBGA (12x12)	패키지: -	재고1,158
LPC54016JBD208MP	NXP	LPC54016JBD208 Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, SHA, Temp Sensor, TRNG, WDT Number of I/O: 171 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 360K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 208-LQFP Supplier Device Package: 208-LQFP (28x28)	패키지: -	Request a Quote
A3G26D055NT4	NXP	RF MOSFET GAN 48V 6DFN Transistor Type: GaN Frequency: 100MHz ~ 2.69GHz Gain: 13.9dB Voltage - Test: 48 V Current Rating: - Noise Figure: - Current - Test: 40 mA Power - Output: 8W Voltage - Rated: 125 V Package / Case: 6-LDFN Exposed Pad Supplier Device Package: 6-PDFN (7x6.5)	패키지: -	재고6,675
MC33FS8430G0KSR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	패키지: -	Request a Quote
MFS8631BMDA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	패키지: -	Request a Quote

MRF1550NT1

NXP

FET RF 40V 175MHZ TO272-6 WRAP

Transistor Type: LDMOS
Frequency: 175MHz
Gain: 14.5dB
Voltage - Test: 12.5V
Current Rating: 12A
Noise Figure: -
Current - Test: 500mA
Power - Output: 50W
Voltage - Rated: 40V
Package / Case: TO-272AA
Supplier Device Package: TO-272-6

패키지: TO-272AA

재고11,844

BZX84-C24/LF1VL

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 24V
Tolerance: ±5%
Power - Max: 250mW
Impedance (Max) (Zzt): 70 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 16.8V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

패키지: TO-236-3, SC-59, SOT-23-3

재고5,984

BZX84-C13/LF1R

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 13V
Tolerance: ±5%
Power - Max: 250mW
Impedance (Max) (Zzt): 30 Ohms
Current - Reverse Leakage @ Vr: 100nA @ 8V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

패키지: TO-236-3, SC-59, SOT-23-3

재고2,704

PCF8566T/S480/1,11

NXP

IC LCD DVR UNIV LOW-MUX 40VSOP

Display Type: LCD
Configuration: 7 Segment + DP, 14 Segment (24 Segment)
Interface: I2C
Digits or Characters: 6 Characters, 12 Digits, 96 Elements
Current - Supply: 30µA
Voltage - Supply: 2.5 V ~ 6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-BSOP (0.295", 7.50mm Width)
Supplier Device Package: 40-VSO

패키지: 40-BSOP (0.295", 7.50mm Width)

재고4,288

HEF4027BP,652

NXP

IC JK TYPE POS TRG DUAL 16DIP

Function: Set(Preset) and Reset
Type: JK Type
Output Type: Differential
Number of Elements: 2
Number of Bits per Element: 1
Clock Frequency: 30MHz
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 3mA, 3mA
Voltage - Supply: 3 V ~ 15 V
Current - Quiescent (Iq): 16µA
Input Capacitance: 7.5pF
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)

패키지: 16-DIP (0.300", 7.62mm)

재고4,208

N74F243N,602

NXP

IC BUS TRANSCVR 3-ST 4BIT 14DIP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 15mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Supplier Device Package: 14-DIP

패키지: 14-DIP (0.300", 7.62mm)

재고4,048

SC18IS601IPW,112

NXP

IC CONTROLLER SPI/I2C 16TSSOP

Protocol: I2C
Function: Controller
Interface: SPI
Standards: -
Voltage - Supply: 2.4 V ~ 3.6 V
Current - Supply: 11mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

패키지: 16-TSSOP (0.173", 4.40mm Width)

재고5,616

LS101MASE7DFA

NXP

IC PROCESSOR DUAL CORE

Core Processor: ARM1136JF-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 650MHz
Co-Processors/DSP: -
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 448-FBGA Exposed Pad
Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)

패키지: 448-FBGA Exposed Pad

재고7,904

P4080NSN1PNB

NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 8 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (8), 10 Gbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

패키지: 1295-BBGA, FCBGA

재고3,824

MPC8544EVJARJA

NXP

IC MPU MPC85XX 1.067GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고5,632

MC68SEC000AA10

NXP

IC MPU M680X0 10MHZ 64QFP

Core Processor: EC000
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 10MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V, 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

패키지: 64-QFP

재고6,600

MCF5274LVM166J

NXP

IC MCU 32BIT ROMLESS 196MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 166MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Number of I/O: 61
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

패키지: 196-LBGA

재고6,032

P89LPC9161FDH,129

NXP

IC MCU 8BIT 2KB FLASH 16TSSOP

Core Processor: 8051
Core Size: 8-Bit
Speed: 18MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 2KB (2K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 4x8b; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

패키지: 16-TSSOP (0.173", 4.40mm Width)

재고3,664

MC68HC705L5FUE

NXP

IC MCU 8BIT 8KB EPROM 80QFP

Core Processor: HC05
Core Size: 8-Bit
Speed: 2.1MHz
Connectivity: SPI
Peripherals: LCD, POR, WDT
Number of I/O: 16
Program Memory Size: 8KB (8K x 8)
Program Memory Type: EPROM, UV
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

패키지: 80-QFP

재고7,856

MPC5554AZP132

NXP

IC MCU 32BIT 2MB FLASH 416BGA

Core Processor: e200z6
Core Size: 32-Bit
Speed: 132MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 256
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -55°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

패키지: 416-BBGA

재고5,360

SPC5674KF0VMS2R

NXP

IC MCU 32BIT 1.5MB FLASH 473BGA

Core Processor: e200z7d
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
Data Converters: A/D 34x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

패키지: 473-LFBGA

재고6,032

MK20DN64VFM5

NXP

IC MCU 32BIT 64KB FLASH 32QFN

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 20
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 6x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN Exposed Pad (5x5)

패키지: 32-VFQFN Exposed Pad

재고4,512

TDA8754HL/21/C1,55

NXP

IC TRPL 8BIT VIDEO ADC 144LQFP

Type: ADC, Video
Number of Channels: -
Resolution (Bits): 8 b
Sampling Rate (Per Second): 210M
Data Interface: Serial
Voltage Supply Source: Analog and Digital
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -10°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고6,688

PCKEL14D,118

NXP

IC CLK BUFFER 2:5 1GHZ 20SO

Type: Fanout Buffer (Distribution), Multiplexer
Number of Circuits: 1
Ratio - Input:Output: 2:5
Differential - Input:Output: Yes/Yes
Input: ECL, PECL
Output: PECL
Frequency - Max: 1GHz
Voltage - Supply: 2.375 V ~ 3.8 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

패키지: 20-SOIC (0.295", 7.50mm Width)

재고6,480

MPXA6115AC6T1

NXP

PRESSURE SENS 16.7PSI MAX 8-SOP

Pressure Type: Absolute
Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.7 V
Accuracy: ±1.5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: Male - 0.13" (3.17mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD, Gull Wing, Top Port
Supplier Device Package: -

패키지: 8-SMD, Gull Wing, Top Port

재고6,498

TWR-13237-KIT

NXP

KIT DEVELOPMENT MC13237CHT

Type: Transceiver; 802.15.4 (ZigBee?)
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Supplied Contents: 4 Boards

패키지: -

재고8,964

S912ZVML64AWKH

NXP

S12Z CORE, 64K FLASH, LIN, 64LQF

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 24
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 9x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-HLQFP (10x10)

패키지: -

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LPC4357JBD208K

NXP

IC MCU 32BIT 1MB FLASH 208LQFP

Core Processor: ARM® Cortex®-M4/M0
Core Size: 32-Bit Dual-Core
Speed: 204MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O: 142
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 136K x 8
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Supplier Device Package: 208-LQFP (28x28)

패키지: -

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MIMXRT1062DVJ6B

NXP

IC MCU 32BIT EXT MEM 196LFBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 600MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 127
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 20x12b
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Supplier Device Package: 196-LFBGA (12x12)

패키지: -

재고1,158

LPC54016JBD208MP

NXP

LPC54016JBD208

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, SHA, Temp Sensor, TRNG, WDT
Number of I/O: 171
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 360K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 12x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Supplier Device Package: 208-LQFP (28x28)

패키지: -

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A3G26D055NT4

NXP

RF MOSFET GAN 48V 6DFN

Transistor Type: GaN
Frequency: 100MHz ~ 2.69GHz
Gain: 13.9dB
Voltage - Test: 48 V
Current Rating: -
Noise Figure: -
Current - Test: 40 mA
Power - Output: 8W
Voltage - Rated: 125 V
Package / Case: 6-LDFN Exposed Pad
Supplier Device Package: 6-PDFN (7x6.5)

패키지: -

재고6,675

MC33FS8430G0KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

패키지: -

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MFS8631BMDA0ES

NXP

IC FS86 SYSTEM BASIS CHIP ASIL

Applications: Camera
Current - Supply: -
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

패키지: -

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