페이지 304 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
BC547,116	NXP	TRANS NPN 45V 0.1A TO-92 Transistor Type: NPN Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V Power - Max: 500mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	재고6,416
BB179B,135	NXP	DIODE UHF VAR CAP 32V SOD523 Capacitance @ Vr, F: 2.25pF @ 28V, 1MHz Capacitance Ratio: 10 Capacitance Ratio Condition: C1/C28 Voltage - Peak Reverse (Max): 32V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	패키지: SC-79, SOD-523	재고3,232
LD6806F/12P,115	NXP	IC REG LINEAR 1.2V 200MA 6-XSON Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.2V Voltage - Output (Max): - Voltage Dropout (Max): 0.13V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT886 (1.45x1)	패키지: 6-XFDFN	재고4,896
TLVH431QDBZR,215	NXP	IC VREF SHUNT ADJ SOT23-3 Reference Type: Shunt Output Type: Adjustable Voltage - Output (Min/Fixed): 1.24V Voltage - Output (Max): 18V Current - Output: 70mA Tolerance: ±1.5% Temperature Coefficient: - Noise - 0.1Hz to 10Hz: - Noise - 10Hz to 10kHz: - Voltage - Input: - Current - Supply: - Current - Cathode: 80µA Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	패키지: TO-236-3, SC-59, SOT-23-3	재고7,024
MC32PF3000A1EP	NXP	IC POWER MANAGEMENT 48QFN Applications: Processor Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	패키지: 48-VFQFN Exposed Pad	재고14,160
UJA1079ATW/5V0,112	NXP	IC SBC LIN 5.0V 32HTSSOP Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	재고4,896
MCZ33889BEGR2	NXP	IC SYSTEM BASIS W/CAN 28-SOIC Applications: System Basis Chip Interface: CAN, SPI Voltage - Supply: 5.5 V ~ 18 V Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC Mounting Type: Surface Mount	패키지: 28-SOIC (0.295", 7.50mm Width)	재고5,680
TJA1055T/C,512	NXP	IC CAN TXRX FAULT-TOL 14-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	패키지: 14-SOIC (0.154", 3.90mm Width)	재고33,390
MC8641DVU1000NC	NXP	IC MPU MPC86XX 1.0GHZ 1023FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	패키지: 1023-BCBGA, FCCBGA	재고4,608
BSC9132NSE7KNKB	NXP	IC MPU Q OR IQ 1.333GHZ 780FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator Package / Case: 780-BFBGA, FCBGA Supplier Device Package: 780-FCBGA (23x23)	패키지: 780-BFBGA, FCBGA	재고2,880
MPC8378ECVRANGA	NXP	IC MPU MPC83XX 800MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고5,040
MPC859TVR133A	NXP	IC MPU MPC8XX 133MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고3,856
PK60N256VLL100	NXP	IC MCU 32BIT 256KB FLASH 100LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 19x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고6,784
MC9S12GC32VFAE	NXP	IC MCU 16BIT 32KB FLASH 48LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 31 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고4,416
MC68HC16Z1CPV25	NXP	IC MCU 16BIT ROMLESS 144LQFP Core Processor: CPU16 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 16 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고3,360
MCF54453CVR200	NXP	IC MCU 32BIT ROMLESS 360PBGA Core Processor: Coldfire V4 Core Size: 32-Bit Speed: 200MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 360-BBGA Supplier Device Package: 360-PBGA (23x23)	패키지: 360-BBGA	재고4,432
S912ZVLA96F0CLCR	NXP	IC MCU 16BIT 96KB FLASH 32LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고3,728
MSC8152TVT1000B	NXP	IC PROCESSOR DUAL DGTL 783FCBGA Type: SC3850 Dual Core Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고3,552
OM15023Z	NXP	DEMO BOARD MCU WIRELESS Type: - Frequency: - For Use With/Related Products: - Supplied Contents: -	패키지: -	재고6,498
BGA2869,115	NXP	MMIC AMPLIFIER SOT363 Frequency: 0Hz ~ 2.2GHz P1dB: 9dBm Gain: 32.2dB Noise Figure: 3.2dB RF Type: General Purpose Voltage - Supply: 4.5 V ~ 5.5 V Current - Supply: 24mA Test Frequency: 2.15GHz Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: 6-TSSOP	패키지: 6-TSSOP, SC-88, SOT-363	재고3,492
S9S12VR48F2CLFR	NXP	MAGNIV 16-BIT MCU S12 CORE 48K Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고4,912
SPC5777CAK3MMO3	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	패키지: 516-BGA	재고5,328
SP5746CHK1AMKU6R	NXP	32 BITDUAL CORE3M FLASH512K R Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	패키지: 176-LQFP Exposed Pad	재고2,304
S9S08AW32E5VFGER	NXP	AUTO 9S08AW32 Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	패키지: 44-LQFP	재고3,648
S9S08RNA60W1MLH	NXP	8-BIT MCU S08 CORE 60KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 55 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고4,976
MCIMX7D5EVK10SD	NXP	IC MPU I.MX7D 1GHZ 488TFBGA Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Package / Case: 488-TFBGA Supplier Device Package: 488-TFBGA (12x12)	패키지: -	Request a Quote
S9S12G128J0VLLR	NXP	IC MCU 16BIT 128KB FLASH 100LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 86 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: -	Request a Quote
MVR5510AVMA0EP	NXP	IC PMIC VR5510 QM Applications: - Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	패키지: -	Request a Quote

BC547,116

NXP

TRANS NPN 45V 0.1A TO-92

Transistor Type: NPN
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V
Power - Max: 500mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

재고6,416

BB179B,135

NXP

DIODE UHF VAR CAP 32V SOD523

Capacitance @ Vr, F: 2.25pF @ 28V, 1MHz
Capacitance Ratio: 10
Capacitance Ratio Condition: C1/C28
Voltage - Peak Reverse (Max): 32V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Supplier Device Package: SOD-523

패키지: SC-79, SOD-523

재고3,232

LD6806F/12P,115

NXP

IC REG LINEAR 1.2V 200MA 6-XSON

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.2V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.13V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT886 (1.45x1)

패키지: 6-XFDFN

재고4,896

TLVH431QDBZR,215

NXP

IC VREF SHUNT ADJ SOT23-3

Reference Type: Shunt
Output Type: Adjustable
Voltage - Output (Min/Fixed): 1.24V
Voltage - Output (Max): 18V
Current - Output: 70mA
Tolerance: ±1.5%
Temperature Coefficient: -
Noise - 0.1Hz to 10Hz: -
Noise - 10Hz to 10kHz: -
Voltage - Input: -
Current - Supply: -
Current - Cathode: 80µA
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

패키지: TO-236-3, SC-59, SOT-23-3

재고7,024

MC32PF3000A1EP

NXP

IC POWER MANAGEMENT 48QFN

Applications: Processor
Current - Supply: -
Voltage - Supply: 2.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

패키지: 48-VFQFN Exposed Pad

재고14,160

UJA1079ATW/5V0,112

NXP

IC SBC LIN 5.0V 32HTSSOP

Applications: Automotive
Interface: SPI Serial
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

재고4,896

MCZ33889BEGR2

NXP

IC SYSTEM BASIS W/CAN 28-SOIC

Applications: System Basis Chip
Interface: CAN, SPI
Voltage - Supply: 5.5 V ~ 18 V
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC
Mounting Type: Surface Mount

패키지: 28-SOIC (0.295", 7.50mm Width)

재고5,680

TJA1055T/C,512

NXP

IC CAN TXRX FAULT-TOL 14-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

패키지: 14-SOIC (0.154", 3.90mm Width)

재고33,390

MC8641DVU1000NC

NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BCBGA, FCCBGA
Supplier Device Package: 1023-FCCBGA (33x33)

패키지: 1023-BCBGA, FCCBGA

재고4,608

BSC9132NSE7KNKB

NXP

IC MPU Q OR IQ 1.333GHZ 780FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Random Number Generator
Package / Case: 780-BFBGA, FCBGA
Supplier Device Package: 780-FCBGA (23x23)

패키지: 780-BFBGA, FCBGA

재고2,880

MPC8378ECVRANGA

NXP

IC MPU MPC83XX 800MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고5,040

MPC859TVR133A

NXP

IC MPU MPC8XX 133MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 133MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고3,856

PK60N256VLL100

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 66
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 19x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고6,784

MC9S12GC32VFAE

NXP

IC MCU 16BIT 32KB FLASH 48LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고4,416

MC68HC16Z1CPV25

NXP

IC MCU 16BIT ROMLESS 144LQFP

Core Processor: CPU16
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 16
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고3,360

MCF54453CVR200

NXP

IC MCU 32BIT ROMLESS 360PBGA

Core Processor: Coldfire V4
Core Size: 32-Bit
Speed: 200MHz
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 132
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 360-BBGA
Supplier Device Package: 360-PBGA (23x23)

패키지: 360-BBGA

재고4,432

S912ZVLA96F0CLCR

NXP

IC MCU 16BIT 96KB FLASH 32LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 19
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고3,728

MSC8152TVT1000B

NXP

IC PROCESSOR DUAL DGTL 783FCBGA

Type: SC3850 Dual Core
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Clock Rate: 1GHz
Non-Volatile Memory: ROM (96 kB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고3,552

OM15023Z

NXP

DEMO BOARD MCU WIRELESS

Type: -
Frequency: -
For Use With/Related Products: -
Supplied Contents: -

패키지: -

재고6,498

BGA2869,115

NXP

MMIC AMPLIFIER SOT363

Frequency: 0Hz ~ 2.2GHz
P1dB: 9dBm
Gain: 32.2dB
Noise Figure: 3.2dB
RF Type: General Purpose
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Supply: 24mA
Test Frequency: 2.15GHz
Package / Case: 6-TSSOP, SC-88, SOT-363
Supplier Device Package: 6-TSSOP

패키지: 6-TSSOP, SC-88, SOT-363

재고3,492

S9S12VR48F2CLFR

NXP

MAGNIV 16-BIT MCU S12 CORE 48K

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고4,912

SPC5777CAK3MMO3

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

패키지: 516-BGA

재고5,328

SP5746CHK1AMKU6R

NXP

32 BITDUAL CORE3M FLASH512K R

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

패키지: 176-LQFP Exposed Pad

재고2,304

S9S08AW32E5VFGER

NXP

AUTO 9S08AW32

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

패키지: 44-LQFP

재고3,648

S9S08RNA60W1MLH

NXP

8-BIT MCU S08 CORE 60KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 55
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고4,976

MCIMX7D5EVK10SD

NXP

IC MPU I.MX7D 1GHZ 488TFBGA

Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1GHz
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Ethernet: 10/100/1000Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -20°C ~ 105°C (TJ)
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Package / Case: 488-TFBGA
Supplier Device Package: 488-TFBGA (12x12)

패키지: -

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S9S12G128J0VLLR

NXP

IC MCU 16BIT 128KB FLASH 100LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 86
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: -

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MVR5510AVMA0EP

NXP

IC PMIC VR5510 QM

Applications: -
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

패키지: -

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