페이지 328 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
MRF6V2010NBR1	NXP	FET RF 110V 220MHZ TO272-2 Transistor Type: LDMOS Frequency: 220MHz Gain: 23.9dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 30mA Power - Output: 10W Voltage - Rated: 110V Package / Case: TO-272BC Supplier Device Package: TO-272-2	패키지: TO-272BC	재고6,640
MRF5S9070NR1	NXP	FET RF 68V 880MHZ TO-270-2 Transistor Type: LDMOS Frequency: 880MHz Gain: 17.8dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 600mA Power - Output: 14W Voltage - Rated: 68V Package / Case: TO-270AA Supplier Device Package: TO-270-2	패키지: TO-270AA	재고14,664
TLVH431ACDBZR,215	NXP	IC VREF SHUNT ADJ SOT23-3 Reference Type: Shunt Output Type: Adjustable Voltage - Output (Min/Fixed): 1.24V Voltage - Output (Max): 18V Current - Output: 70mA Tolerance: ±1% Temperature Coefficient: - Noise - 0.1Hz to 10Hz: - Noise - 10Hz to 10kHz: - Voltage - Input: - Current - Supply: - Current - Cathode: 80µA Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	패키지: TO-236-3, SC-59, SOT-23-3	재고4,432
MCZ33099EGR2	NXP	IC VREG ALTERNATOR ADAPT 16-SOIC Applications: Automotive Current - Supply: 6.5mA Voltage - Supply: 7 V ~ 18 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.295", 7.50mm Width)	재고5,216
N74F521N,602	NXP	IC COMPARATOR IDENTITY 8B 20DIP Type: Identity Comparator Number of Bits: 8 Output: Active Low Output Function: A=B Voltage - Supply: 4.5 V ~ 5.5 V Current - Output High, Low: 1mA, 20mA Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF Current - Quiescent (Iq): - Operating Temperature: 0°C ~ 70°C Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole	패키지: 20-DIP (0.300", 7.62mm)	재고4,064
74AHC244PW/AUJ	NXP	IC BUFF/DVR TRI-ST DUAL 20TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 8mA, 8mA Voltage - Supply: 2 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	패키지: 20-TSSOP (0.173", 4.40mm Width)	재고4,256
N74F242D,602	NXP	IC BUS TXRX TRI-ST 4BIT 14SOIC Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 15mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	패키지: 14-SOIC (0.154", 3.90mm Width)	재고7,616
SC68C752BIB48,157	NXP	IC UART DUAL 48LQFP Features: - Number of Channels: 2, DUART FIFO's: 64 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고3,232
PCA9701D,112	NXP	IC SPI GPI 16-BIT 24-SOIC Number of I/O: 16 (Input Only) Interface: SPI Serial Interrupt Output: Yes Features: - Output Type: Push-Pull Current - Output Source/Sink: - Clock Frequency: 5MHz Voltage - Supply: 2.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	패키지: 24-SOIC (0.295", 7.50mm Width)	재고2,544
NX5DV330PW,112	NXP	IC VIDEO MUX/DEMUX 1X2 16TSSOP Applications: Video Multiplexer/Demultiplexer Circuit: 2:1 Switch Circuit: - Number of Channels: 4 On-State Resistance (Max): 10 Ohm Voltage - Supply, Single (V+): 4 V ~ 5.5 V Voltage - Supply, Dual (V±): - -3db Bandwidth: 300MHz Features: - Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	패키지: 16-TSSOP (0.173", 4.40mm Width)	재고27,780
P1010NSE5HHA	NXP	IC MPU Q OR IQ 1.0GHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	패키지: 425-FBGA	재고4,080
XPC850DSLCVR50BU	NXP	IC MPU MPC8XX 50MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	패키지: 256-BBGA	재고7,744
MPC8548EVJAUJD	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고5,184
MCF51MM256VMB	NXP	IC MCU 32BIT 256KB FLASH 81BGA Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Number of I/O: 48 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x16b, D/A 1x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 81-LBGA Supplier Device Package: 81-MAPBGA (10x10)	패키지: 81-LBGA	재고2,192
S912XEP768J5CAGR	NXP	IC MCU 16BIT 768KB FLASH 144LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고7,136
MC9RS08KA2CPC	NXP	IC MCU 8BIT 2KB FLASH 8DIP Core Processor: RS08 Core Size: 8-Bit Speed: 10MHz Connectivity: - Peripherals: LVD, POR, WDT Number of I/O: 4 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 63 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	패키지: 8-DIP (0.300", 7.62mm)	재고22,140
MCF5282CVM66	NXP	IC MCU 32BIT 512KB FLASH 256BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 150 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	패키지: 256-LBGA	재고5,952
MPXH6400AC6T1	NXP	SENSOR ABS PRESS 58PSI MAX Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 58.02 PSI (20 kPa ~ 400 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.8 V Accuracy: ±1.5% Voltage - Supply: 4.64 V ~ 5.36 V Port Size: Male - 0.13" (3.3mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 232.06 PSI (1600 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SSOP (0.335", 8.50mm Width), Top Port Supplier Device Package: 8-SSOP	패키지: 8-SSOP (0.335", 8.50mm Width), Top Port	재고5,418
MPX2300DT1	NXP	PRESSURE SENSE MED 4SIP CHIP PAK Pressure Type: Differential Operating Pressure: 5.8 PSI (40 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 3.006 mV (6V) Accuracy: ±1.5% Voltage - Supply: 6 V ~ 10 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 125 PSI (861.84 kPa) Operating Temperature: 15°C ~ 40°C Package / Case: 4-SIP Module Supplier Device Package: -	패키지: 4-SIP Module	재고14,256
MMA2612IKWR2	NXP	ACCELEROMETER DSI2.5 16QFN Type: Digital Axis: X Acceleration Range: ±125g Sensitivity (LSB/g): 4.096 Sensitivity (mV/g): - Bandwidth: - Output Type: PCM Voltage - Supply: 6.3 V ~ 30 V Features: Selectable Low Pass Filter Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN-EP (6x6)	패키지: 16-QFN Exposed Pad	재고8,784
SX1534KVWT1	NXP	ACCELEROMETER Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고3,528
TDA8035HN/C2/S1EL	NXP	HIGH INTEGRATED AND LOW POWER SM Applications: - Interface: Analog Voltage - Supply: 2.7 V ~ 5.5 V Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5) Mounting Type: Surface Mount	패키지: 32-VFQFN Exposed Pad	재고4,400
MC33772BTA2AE	NXP	BCC6 Function: Battery Cell Controller Battery Chemistry: Lithium-Ion Number of Cells: 3 ~ 6 Fault Protection: Over/Under Voltage Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Package / Case: - Supplier Device Package: -	패키지: -	재고7,520
SPC5644CF0MLT1R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 177 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 208-LQFP Supplier Device Package: 208-TQFP (28x28)	패키지: 208-LQFP	재고2,960
KC9S08AW60CFUE	NXP	NO DESCRIPTION Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
MCXN546VNLT	NXP	IC MCX N54 150MHZ DUAL CORE NPU Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
A5000R2HQ1-Z016UZ	NXP	IC EDGE LOCK SEC AUTH 20HX2QFN Type: Edge Lock Secure Authenticator Applications: - Mounting Type: Surface Mount Package / Case: 20-XFQFN Exposed Pad Supplier Device Package: 20-HX2QFN (3x3)	패키지: -	재고9,000
MIMX8DX6CVLFZAC	NXP	MIMX8DX6CVLFZAC Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote

MRF6V2010NBR1

NXP

FET RF 110V 220MHZ TO272-2

Transistor Type: LDMOS
Frequency: 220MHz
Gain: 23.9dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 30mA
Power - Output: 10W
Voltage - Rated: 110V
Package / Case: TO-272BC
Supplier Device Package: TO-272-2

패키지: TO-272BC

재고6,640

MRF5S9070NR1

NXP

FET RF 68V 880MHZ TO-270-2

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 17.8dB
Voltage - Test: 26V
Current Rating: -
Noise Figure: -
Current - Test: 600mA
Power - Output: 14W
Voltage - Rated: 68V
Package / Case: TO-270AA
Supplier Device Package: TO-270-2

패키지: TO-270AA

재고14,664

TLVH431ACDBZR,215

NXP

IC VREF SHUNT ADJ SOT23-3

Reference Type: Shunt
Output Type: Adjustable
Voltage - Output (Min/Fixed): 1.24V
Voltage - Output (Max): 18V
Current - Output: 70mA
Tolerance: ±1%
Temperature Coefficient: -
Noise - 0.1Hz to 10Hz: -
Noise - 10Hz to 10kHz: -
Voltage - Input: -
Current - Supply: -
Current - Cathode: 80µA
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

패키지: TO-236-3, SC-59, SOT-23-3

재고4,432

MCZ33099EGR2

NXP

IC VREG ALTERNATOR ADAPT 16-SOIC

Applications: Automotive
Current - Supply: 6.5mA
Voltage - Supply: 7 V ~ 18 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.295", 7.50mm Width)

재고5,216

N74F521N,602

NXP

IC COMPARATOR IDENTITY 8B 20DIP

Type: Identity Comparator
Number of Bits: 8
Output: Active Low
Output Function: A=B
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Output High, Low: 1mA, 20mA
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Current - Quiescent (Iq): -
Operating Temperature: 0°C ~ 70°C
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole

패키지: 20-DIP (0.300", 7.62mm)

재고4,064

74AHC244PW/AUJ

NXP

IC BUFF/DVR TRI-ST DUAL 20TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 2 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

패키지: 20-TSSOP (0.173", 4.40mm Width)

재고4,256

N74F242D,602

NXP

IC BUS TXRX TRI-ST 4BIT 14SOIC

Logic Type: Transceiver, Inverting
Number of Elements: 1
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 15mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

패키지: 14-SOIC (0.154", 3.90mm Width)

재고7,616

SC68C752BIB48,157

NXP

IC UART DUAL 48LQFP

Features: -
Number of Channels: 2, DUART
FIFO's: 64 Byte
Protocol: -
Data Rate (Max): 5Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고3,232

PCA9701D,112

NXP

IC SPI GPI 16-BIT 24-SOIC

Number of I/O: 16 (Input Only)
Interface: SPI Serial
Interrupt Output: Yes
Features: -
Output Type: Push-Pull
Current - Output Source/Sink: -
Clock Frequency: 5MHz
Voltage - Supply: 2.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

패키지: 24-SOIC (0.295", 7.50mm Width)

재고2,544

NX5DV330PW,112

NXP

IC VIDEO MUX/DEMUX 1X2 16TSSOP

Applications: Video
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: -
Number of Channels: 4
On-State Resistance (Max): 10 Ohm
Voltage - Supply, Single (V+): 4 V ~ 5.5 V
Voltage - Supply, Dual (V±): -
-3db Bandwidth: 300MHz
Features: -
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

패키지: 16-TSSOP (0.173", 4.40mm Width)

재고27,780

P1010NSE5HHA

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA I (19x19)

패키지: 425-FBGA

재고4,080

XPC850DSLCVR50BU

NXP

IC MPU MPC8XX 50MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

패키지: 256-BBGA

재고7,744

MPC8548EVJAUJD

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고5,184

MCF51MM256VMB

NXP

IC MCU 32BIT 256KB FLASH 81BGA

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Number of I/O: 48
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x16b, D/A 1x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 81-LBGA
Supplier Device Package: 81-MAPBGA (10x10)

패키지: 81-LBGA

재고2,192

S912XEP768J5CAGR

NXP

IC MCU 16BIT 768KB FLASH 144LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고7,136

MC9RS08KA2CPC

NXP

IC MCU 8BIT 2KB FLASH 8DIP

Core Processor: RS08
Core Size: 8-Bit
Speed: 10MHz
Connectivity: -
Peripherals: LVD, POR, WDT
Number of I/O: 4
Program Memory Size: 2KB (2K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 63 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

패키지: 8-DIP (0.300", 7.62mm)

재고22,140

MCF5282CVM66

NXP

IC MCU 32BIT 512KB FLASH 256BGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 150
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

패키지: 256-LBGA

재고5,952

MPXH6400AC6T1

NXP

SENSOR ABS PRESS 58PSI MAX

Pressure Type: Absolute
Operating Pressure: 2.9 PSI ~ 58.02 PSI (20 kPa ~ 400 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.8 V
Accuracy: ±1.5%
Voltage - Supply: 4.64 V ~ 5.36 V
Port Size: Male - 0.13" (3.3mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 232.06 PSI (1600 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SSOP (0.335", 8.50mm Width), Top Port
Supplier Device Package: 8-SSOP

패키지: 8-SSOP (0.335", 8.50mm Width), Top Port

재고5,418

MPX2300DT1

NXP

PRESSURE SENSE MED 4SIP CHIP PAK

Pressure Type: Differential
Operating Pressure: 5.8 PSI (40 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 3.006 mV (6V)
Accuracy: ±1.5%
Voltage - Supply: 6 V ~ 10 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 125 PSI (861.84 kPa)
Operating Temperature: 15°C ~ 40°C
Package / Case: 4-SIP Module
Supplier Device Package: -

패키지: 4-SIP Module

재고14,256

MMA2612IKWR2

NXP

ACCELEROMETER DSI2.5 16QFN

Type: Digital
Axis: X
Acceleration Range: ±125g
Sensitivity (LSB/g): 4.096
Sensitivity (mV/g): -
Bandwidth: -
Output Type: PCM
Voltage - Supply: 6.3 V ~ 30 V
Features: Selectable Low Pass Filter
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN-EP (6x6)

패키지: 16-QFN Exposed Pad

재고8,784

SX1534KVWT1

NXP

ACCELEROMETER

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고3,528

TDA8035HN/C2/S1EL

NXP

HIGH INTEGRATED AND LOW POWER SM

Applications: -
Interface: Analog
Voltage - Supply: 2.7 V ~ 5.5 V
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)
Mounting Type: Surface Mount

패키지: 32-VFQFN Exposed Pad

재고4,400

MC33772BTA2AE

NXP

BCC6

Function: Battery Cell Controller
Battery Chemistry: Lithium-Ion
Number of Cells: 3 ~ 6
Fault Protection: Over/Under Voltage
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: -
Supplier Device Package: -

패키지: -

재고7,520

SPC5644CF0MLT1R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 177
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-TQFP (28x28)

패키지: 208-LQFP

재고2,960

KC9S08AW60CFUE

NXP

NO DESCRIPTION

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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MCXN546VNLT

NXP

IC MCX N54 150MHZ DUAL CORE NPU

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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A5000R2HQ1-Z016UZ

NXP

IC EDGE LOCK SEC AUTH 20HX2QFN

Type: Edge Lock Secure Authenticator
Applications: -
Mounting Type: Surface Mount
Package / Case: 20-XFQFN Exposed Pad
Supplier Device Package: 20-HX2QFN (3x3)

패키지: -

재고9,000

MIMX8DX6CVLFZAC

NXP

MIMX8DX6CVLFZAC

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote