페이지 416 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
BUK761R7-40E/GFJ	NXP	MOSFET N-CH D2PAK FET Type: - Technology: - Drain to Source Voltage (Vdss): - Current - Continuous Drain (Id) @ 25°C: - Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: - Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: - Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): - Rds On (Max) @ Id, Vgs: - Operating Temperature: - Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	패키지: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	재고3,328
PHP165NQ08T,127	NXP	MOSFET N-CH 75V 75A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 75V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 165nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 8250pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 250W (Tc) Rds On (Max) @ Id, Vgs: 5 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	패키지: TO-220-3	재고3,024
MMRF1021NT1	NXP	FET RF 30V 870MHZ PLD1.5W Transistor Type: LDMOS Frequency: 870MHz Gain: 15.2dB Voltage - Test: 7.5V Current Rating: - Noise Figure: - Current - Test: 100mA Power - Output: 7.3W Voltage - Rated: 30V Package / Case: PLD-1.5W-2 Supplier Device Package: PLD-1.5W-2	패키지: PLD-1.5W-2	재고7,856
BF861C,215	NXP	JFET N-CH 25V 25MA SOT23 Transistor Type: N-Channel JFET Frequency: - Gain: - Voltage - Test: - Current Rating: 25mA Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: 25V Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	패키지: TO-236-3, SC-59, SOT-23-3	재고95,280
BFT93,215	NXP	TRANS PNP 12V 5GHZ SOT-23 Transistor Type: PNP Voltage - Collector Emitter Breakdown (Max): 12V Frequency - Transition: 5GHz Noise Figure (dB Typ @ f): 2.4dB @ 500MHz Gain: - Power - Max: 300mW DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 30mA, 5V Current - Collector (Ic) (Max): 35mA Operating Temperature: 175°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	패키지: TO-236-3, SC-59, SOT-23-3	재고58,962
PZM3.9NB1,115	NXP	DIODE ZENER 3.9V 300MW SMT3 Voltage - Zener (Nom) (Vz): 3.9V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 90 Ohms Current - Reverse Leakage @ Vr: 3µA @ 1V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	패키지: TO-236-3, SC-59, SOT-23-3	재고2,064
TDA19998HL/C1,557	NXP	IC DVI/HDMI SWITCH 100LQFP Type: HDMI 1.4 Applications: HD Displays, DVI/HDMI Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고4,144
BGY883,112	NXP	IC AMP PUSH-PULL SOT115J Applications: CATV Output Type: Push-Pull Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 235mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): - Mounting Type: - Package / Case: SOT-115J Supplier Device Package: SOT115J	패키지: SOT-115J	재고2,896
PCF8575CTS/1,118	NXP	IC I/O EXPANDER I2C 16B 24SSOP Number of I/O: 16 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 25mA Clock Frequency: 400kHz Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	패키지: 24-SSOP (0.209", 5.30mm Width)	재고3,088
T2080NSN7TTB	NXP	IC SOC 64BIT 8X1.8GHZ 896FCBGA Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 896-FBGA, FCBGA Supplier Device Package: 896-FCPBGA (25x25)	패키지: 896-FBGA, FCBGA	재고6,944
LS101MASN7DFA	NXP	IC PROCESSOR DUAL CORE Core Processor: ARM1136JF-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 650MHz Co-Processors/DSP: - RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 448-FBGA Exposed Pad Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)	패키지: 448-FBGA Exposed Pad	재고5,136
MPC8572CLVTAULD	NXP	IC MPU MPC85XX 1.333GHZ 1023BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	패키지: 1023-BFBGA, FCBGA	재고6,192
XPC850DEZT50BT	NXP	IC MPU MPC8XX 50MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23)	패키지: 256-BGA	재고18,372
MC68340AG25E	NXP	IC MPU M683XX 25MHZ 144LQFP Core Processor: CPU32 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: - RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고16,416
MCIMX515CJM6C	NXP	IC MPU I.MX51 600MHZ 529BGA Core Processor: ARM? Cortex?-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -40°C ~ 95°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case: 529-LFBGA Supplier Device Package: 529-BGA Case 2017 (19x19)	패키지: 529-LFBGA	재고6,816
MPC8247VRTIEA	NXP	IC MPU MPC82XX 400MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	패키지: 516-BBGA	재고6,900
S912ZVML64F1MKH	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	패키지: 64-LQFP Exposed Pad	재고4,112
MC56F84550VLFR	NXP	IC MCU 32BIT 96KB FLASH 48LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 80MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고5,200
MKL25Z32VFM4	NXP	IC MCU 32BIT 32KB FLASH 32QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 23 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 7x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	패키지: 32-VFQFN Exposed Pad	재고4,016
MKE02Z16VFM4	NXP	IC MCU 32BIT 16KB FLASH 32QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 40MHz Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 28 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	패키지: 32-VFQFN Exposed Pad	재고3,904
SX5212P1KWT1	NXP	ACCELEROMETER Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고8,622
OM15015Z	NXP	DEMO BOARD MCU WIRELESS Type: - Frequency: - For Use With/Related Products: - Supplied Contents: -	패키지: -	재고5,562
S912XHY128F0CLLR	NXP	16-BIT MCU S12 CORE 128KB FLAS Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 76 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 8K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고3,920
MCIMX6G1AVM07ABR	NXP	I.MX 32-BIT MPU, ARM CORTEX-A7 C Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 696MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: LVDS Ethernet: 10/100Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14x14)	패키지: -	Request a Quote
LPC43S20FET180K	NXP	IC MCU 32BIT ROMLESS 180TFBGA Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Speed: 204MHz Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 118 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b;D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 180-TFBGA Supplier Device Package: 180-TFBGA (12x12)	패키지: -	Request a Quote
FC32K116LAT0MLFR	NXP	S32K116 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
SAF7758HV-N207WK	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
S9S12ZVL16F0WLF	NXP	IC MCU 16BIT 16KB FLASH 48LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: -	Request a Quote

BUK761R7-40E/GFJ

NXP

MOSFET N-CH D2PAK

FET Type: -
Technology: -
Drain to Source Voltage (Vdss): -
Current - Continuous Drain (Id) @ 25°C: -
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: -
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: -
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): -
Rds On (Max) @ Id, Vgs: -
Operating Temperature: -
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

패키지: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

재고3,328

PHP165NQ08T,127

NXP

MOSFET N-CH 75V 75A TO220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 75V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 165nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 8250pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 250W (Tc)
Rds On (Max) @ Id, Vgs: 5 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

패키지: TO-220-3

재고3,024

MMRF1021NT1

NXP

FET RF 30V 870MHZ PLD1.5W

Transistor Type: LDMOS
Frequency: 870MHz
Gain: 15.2dB
Voltage - Test: 7.5V
Current Rating: -
Noise Figure: -
Current - Test: 100mA
Power - Output: 7.3W
Voltage - Rated: 30V
Package / Case: PLD-1.5W-2
Supplier Device Package: PLD-1.5W-2

패키지: PLD-1.5W-2

재고7,856

BF861C,215

NXP

JFET N-CH 25V 25MA SOT23

Transistor Type: N-Channel JFET
Frequency: -
Gain: -
Voltage - Test: -
Current Rating: 25mA
Noise Figure: -
Current - Test: -
Power - Output: -
Voltage - Rated: 25V
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

패키지: TO-236-3, SC-59, SOT-23-3

재고95,280

BFT93,215

NXP

TRANS PNP 12V 5GHZ SOT-23

Transistor Type: PNP
Voltage - Collector Emitter Breakdown (Max): 12V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 2.4dB @ 500MHz
Gain: -
Power - Max: 300mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 30mA, 5V
Current - Collector (Ic) (Max): 35mA
Operating Temperature: 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

패키지: TO-236-3, SC-59, SOT-23-3

재고58,962

PZM3.9NB1,115

NXP

DIODE ZENER 3.9V 300MW SMT3

Voltage - Zener (Nom) (Vz): 3.9V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 90 Ohms
Current - Reverse Leakage @ Vr: 3µA @ 1V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

패키지: TO-236-3, SC-59, SOT-23-3

재고2,064

TDA19998HL/C1,557

NXP

IC DVI/HDMI SWITCH 100LQFP

Type: HDMI 1.4
Applications: HD Displays, DVI/HDMI
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고4,144

BGY883,112

NXP

IC AMP PUSH-PULL SOT115J

Applications: CATV
Output Type: Push-Pull
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 235mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): -
Mounting Type: -
Package / Case: SOT-115J
Supplier Device Package: SOT115J

패키지: SOT-115J

재고2,896

PCF8575CTS/1,118

NXP

IC I/O EXPANDER I2C 16B 24SSOP

Number of I/O: 16
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 25mA
Clock Frequency: 400kHz
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 24-SSOP

패키지: 24-SSOP (0.209", 5.30mm Width)

재고3,088

T2080NSN7TTB

NXP

IC SOC 64BIT 8X1.8GHZ 896FCBGA

Core Processor: PowerPC e6500
Number of Cores/Bus Width: 4 Core, 64-Bit
Speed: 1.8GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 896-FBGA, FCBGA
Supplier Device Package: 896-FCPBGA (25x25)

패키지: 896-FBGA, FCBGA

재고6,944

LS101MASN7DFA

NXP

IC PROCESSOR DUAL CORE

Core Processor: ARM1136JF-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 650MHz
Co-Processors/DSP: -
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 448-FBGA Exposed Pad
Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)

패키지: 448-FBGA Exposed Pad

재고5,136

MPC8572CLVTAULD

NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BFBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

패키지: 1023-BFBGA, FCBGA

재고6,192

XPC850DEZT50BT

NXP

IC MPU MPC8XX 50MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BGA
Supplier Device Package: 256-PBGA (23x23)

패키지: 256-BGA

재고18,372

MC68340AG25E

NXP

IC MPU M683XX 25MHZ 144LQFP

Core Processor: CPU32
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: -
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고16,416

MCIMX515CJM6C

NXP

IC MPU I.MX51 600MHZ 529BGA

Core Processor: ARM? Cortex?-A8
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature: -40°C ~ 95°C (TC)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Package / Case: 529-LFBGA
Supplier Device Package: 529-BGA Case 2017 (19x19)

패키지: 529-LFBGA

재고6,816

MPC8247VRTIEA

NXP

IC MPU MPC82XX 400MHZ 516BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

패키지: 516-BBGA

재고6,900

S912ZVML64F1MKH

NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

패키지: 64-LQFP Exposed Pad

재고4,112

MC56F84550VLFR

NXP

IC MCU 32BIT 96KB FLASH 48LQFP

Core Processor: 56800EX
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x12b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고5,200

MKL25Z32VFM4

NXP

IC MCU 32BIT 32KB FLASH 32QFN

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 23
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 7x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

패키지: 32-VFQFN Exposed Pad

재고4,016

MKE02Z16VFM4

NXP

IC MCU 32BIT 16KB FLASH 32QFN

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 40MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Number of I/O: 28
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 2x6b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

패키지: 32-VFQFN Exposed Pad

재고3,904

SX5212P1KWT1

NXP

ACCELEROMETER

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고8,622

OM15015Z

NXP

DEMO BOARD MCU WIRELESS

Type: -
Frequency: -
For Use With/Related Products: -
Supplied Contents: -

패키지: -

재고5,562

S912XHY128F0CLLR

NXP

16-BIT MCU S12 CORE 128KB FLAS

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 40MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Number of I/O: 76
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 8K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고3,920

MCIMX6G1AVM07ABR

NXP

I.MX 32-BIT MPU, ARM CORTEX-A7 C

Core Processor: ARM® Cortex®-A7
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 696MHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Ethernet: 10/100Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: 289-LFBGA
Supplier Device Package: 289-MAPBGA (14x14)

패키지: -

Request a Quote

LPC43S20FET180K

NXP

IC MCU 32BIT ROMLESS 180TFBGA

Core Processor: ARM® Cortex®-M4/M0
Core Size: 32-Bit Dual-Core
Speed: 204MHz
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 118
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Data Converters: A/D 8x10b;D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

패키지: -

Request a Quote

FC32K116LAT0MLFR

NXP

S32K116 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

SAF7758HV-N207WK

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

S9S12ZVL16F0WLF

NXP

IC MCU 16BIT 16KB FLASH 48LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: -

Request a Quote