페이지 424 - NXP 제품 | Heisener Electronics
고객 문의
SalesDept@heisener.com +86-755-83210559 ext. 887
Language Translation

* Please refer to the English Version as our Official Version.

NXP 제품

기록 26,590
페이지  424/950
이미지
부품 번호
제조업체
설명
패키지
재고
수량
TEA1532AT/N1,118
NXP

IC PFC CONTROLLER CCM 8SOIC

  • Mode: Continuous Conduction (CCM)
  • Frequency - Switching: 50kHz ~ 75kHz
  • Current - Startup: 1.2mA
  • Voltage - Supply: 8.7 V ~ 20 V
  • Operating Temperature: -25°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
패키지: 8-SOIC (0.154", 3.90mm Width)
재고4,896
74LVC841APW,112
NXP

IC 10BIT TRANSP LATCH 24TSSOP

  • Logic Type: D-Type Transparent Latch
  • Circuit: 10:10
  • Output Type: Tri-State
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Independent Circuits: 1
  • Delay Time - Propagation: 1.5ns
  • Current - Output High, Low: 24mA, 24mA
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
패키지: 24-TSSOP (0.173", 4.40mm Width)
재고5,696
74LVC38ABQ,115
NXP

IC GATE NAND 4CH 2-INP 14-DHVQFN

  • Logic Type: NAND Gate
  • Number of Circuits: 4
  • Number of Inputs: 2
  • Features: Open Drain
  • Voltage - Supply: 1.2 V ~ 5.5 V
  • Current - Quiescent (Max): 40µA
  • Current - Output High, Low: -, 32mA
  • Logic Level - Low: 0.7 V ~ 0.8 V
  • Logic Level - High: 1.7 V ~ 2 V
  • Max Propagation Delay @ V, Max CL: 2.3ns @ 3.3V, 50pF
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Supplier Device Package: 14-DHVQFN (2.5x3)
  • Package / Case: 14-VFQFN Exposed Pad
패키지: 14-VFQFN Exposed Pad
재고4,944
74HC14N,652
NXP

IC HEX INVERTER SCHM TRIG 14DIP

  • Logic Type: Inverter
  • Number of Circuits: 6
  • Number of Inputs: 6
  • Features: Schmitt Trigger
  • Voltage - Supply: 2 V ~ 6 V
  • Current - Quiescent (Max): 2µA
  • Current - Output High, Low: 5.2mA, 5.2mA
  • Logic Level - Low: 0.3 V ~ 1.2 V
  • Logic Level - High: 1.5 V ~ 4.2 V
  • Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Through Hole
  • Supplier Device Package: 14-DIP
  • Package / Case: 14-DIP (0.300", 7.62mm)
패키지: 14-DIP (0.300", 7.62mm)
재고6,272
CGY887B,112
NXP

IC PUSH-PULL AMP 860MHZ SOT115J

  • Applications: CATV
  • Output Type: -
  • Number of Circuits: 1
  • -3db Bandwidth: -
  • Slew Rate: -
  • Current - Supply: 310mA
  • Current - Output / Channel: -
  • Voltage - Supply, Single/Dual (±): -
  • Mounting Type: -
  • Package / Case: SOT-115J
  • Supplier Device Package: SOT115J
패키지: SOT-115J
재고7,680
NE5232D/01,112
NXP

IC OPAMP GP 2.5MHZ RRO 8SO

  • Amplifier Type: General Purpose
  • Number of Circuits: 2
  • Output Type: Rail-to-Rail
  • Slew Rate: 0.8 V/µs
  • Gain Bandwidth Product: -
  • -3db Bandwidth: 2.5MHz
  • Current - Input Bias: 90nA
  • Voltage - Input Offset: 200µV
  • Current - Supply: 1.4mA
  • Current - Output / Channel: 12mA
  • Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
패키지: 8-SOIC (0.154", 3.90mm Width)
재고3,920
SC18IS602IPW,112
NXP

IC BRIDGE SPI/I2C 16-TSSOP

  • Protocol: I2C
  • Function: Controller
  • Interface: SPI
  • Standards: -
  • Voltage - Supply: 2.4 V ~ 3.6 V
  • Current - Supply: 11mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
패키지: 16-TSSOP (0.173", 4.40mm Width)
재고7,568
MPC8379VRAJF
NXP

IC MPU MPC83XX 533MHZ 689TEBGA

  • Core Processor: PowerPC e300c4s
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (4)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 125°C (TA)
  • Security Features: -
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
패키지: 689-BBGA Exposed Pad
재고7,568
MPC8323EVRADDCA
NXP

IC MPU MPC83XX 266MHZ 516BGA

  • Core Processor: PowerPC e300c2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
패키지: 516-BBGA
재고4,032
hot MVF60NS151CMK40
NXP

IC MCU 32BIT ROMLESS 364MAPBGA

  • Core Processor: ARM? Cortex?-A5 + Cortex?-M4
  • Core Size: 32-Bit Dual-Core
  • Speed: 400MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
  • Peripherals: DMA, LVD, WDT
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 1.5MB
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D Dual x 12b, D/A Dual x 12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 364-LFBGA
  • Supplier Device Package: 364-MAPBGA (17x17)
패키지: 364-LFBGA
재고7,648
MCF5234CVM100J
NXP

IC MCU 32BIT ROMLESS 256MAPBGA

  • Core Processor: Coldfire V2
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Peripherals: DMA, WDT
  • Number of I/O: 97
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPBGA
패키지: 256-LBGA
재고4,800
MC908QC8VDSE
NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI, SPI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 16
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 384 x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 10x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
패키지: 20-TSSOP (0.173", 4.40mm Width)
재고3,600
LPC1837JET256,551
NXP

IC MCU 32BIT 1MB FLASH 256LBGA

  • Core Processor: ARM? Cortex?-M3
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 164
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 16K x 8
  • RAM Size: 136K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
  • Data Converters: A/D 8x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-LBGA (17x17)
패키지: 256-LBGA
재고5,136
MC9S08DZ96CLL
NXP

IC MCU 8BIT 96KB FLASH 100LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 87
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 6K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
패키지: 100-LQFP
재고4,448
hot MC9S12XDT256CAL
NXP

IC MCU 16BIT 256KB FLASH 112LQFP

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 80MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 91
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
패키지: 112-LQFP
재고28,800
hot XC56309VL100A
NXP

IC DSP 24BIT 100MHZ 196-MAPBGA

  • Type: Fixed Point
  • Interface: Host Interface, SSI, SCI
  • Clock Rate: 100MHz
  • Non-Volatile Memory: ROM (576 B)
  • On-Chip RAM: 24kB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 3.30V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 196-LBGA
  • Supplier Device Package: 196-MAPBGA (15x15)
패키지: 196-LBGA
재고4,560
MPC962305D-1
NXP

IC CLOCK BUFFER 1:5 8-SOIC

  • Type: Fanout Distribution, Spread Spectrum Clock Generator, Zero Delay Buffer
  • PLL: Yes
  • Input: LVCMOS
  • Output: LVCMOS
  • Number of Circuits: 1
  • Ratio - Input:Output: 1:5
  • Differential - Input:Output: No/No
  • Frequency - Max: 133.33MHz
  • Divider/Multiplier: No/No
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
패키지: 8-SOIC (0.154", 3.90mm Width)
재고4,336
PESD5V0L1USF-H250,
NXP

TVS DIODE 5VWM 10.5VC SOD962

  • Type: Zener
  • Unidirectional Channels: 1
  • Bidirectional Channels: -
  • Voltage - Reverse Standoff (Typ): 5V (Max)
  • Voltage - Breakdown (Min): 6V
  • Voltage - Clamping (Max) @ Ipp: 10.5V
  • Current - Peak Pulse (10/1000µs): 1.2A (8/20µs)
  • Power - Peak Pulse: 11W
  • Power Line Protection: No
  • Applications: General Purpose
  • Capacitance @ Frequency: 12pF @ 1MHz
  • Operating Temperature: -55°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 2-XFDFN
  • Supplier Device Package: 2-DSN (0.60x0.30)
패키지: 2-XFDFN
재고7,776
PRTR5V0U1T,215
NXP

TVS DIODE 5.5VWM SOT23

  • Type: Steering (Rail to Rail)
  • Unidirectional Channels: 1
  • Bidirectional Channels: -
  • Voltage - Reverse Standoff (Typ): 5.5V (Max)
  • Voltage - Breakdown (Min): 6V
  • Voltage - Clamping (Max) @ Ipp: -
  • Current - Peak Pulse (10/1000µs): -
  • Power - Peak Pulse: -
  • Power Line Protection: Yes
  • Applications: General Purpose
  • Capacitance @ Frequency: 1pF @ 1MHz
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SOT-23 (TO-236AB)
패키지: TO-236-3, SC-59, SOT-23-3
재고8,856
MMA5124LVWR2
NXP

ACCELEROMETER PSI5 16QFN

  • Type: -
  • Axis: -
  • Acceleration Range: -
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): -
  • Bandwidth: -
  • Output Type: -
  • Voltage - Supply: -
  • Features: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고2,664
OM7921,598
NXP

RF EVAL AMP VGA FOR BGA7210

  • Type: Amplifier
  • Frequency: -
  • For Use With/Related Products: BGA7120
  • Supplied Contents: 2 Boards, Cables, Samples, Software, Documentation
패키지: -
재고4,770
MIMXRT1061CVL5A
NXP

I.MXRT1061 MPU 196MAPBGA

  • Core Processor: ARM® Cortex®-M7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 528MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 OTG + PHY (2)
  • Voltage - I/O: 1.8V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Security Features: BEE, DCP, HAB, SJC, SNVS, TRNG
  • Package / Case: 196-LFBGA
  • Supplier Device Package: 196-MAPBGA (10x10)
패키지: 196-LFBGA
재고7,856
S9S08RNA60W1VLH
NXP

8-BIT MCU S08 CORE 60KB FLASH

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I²C, LINbus, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 55
  • Program Memory Size: 60KB (60K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
패키지: 64-LQFP
재고7,264
MC33PF8100CFEP
NXP

IC POWER MANAGEMENT I.MX8QXP

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
패키지: 56-VFQFN Exposed Pad
재고6,256
MIMXRT1024CAG4B
NXP

IC MCU 32BIT 4MB FLASH 144LQFP

  • Core Processor: ARM® Cortex®-M7
  • Core Size: 32-Bit
  • Speed: 396MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
  • Number of I/O: 90
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
  • Data Converters: A/D 19x12b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
패키지: -
Request a Quote
LPC1112FHN33-102K
NXP

IC MCU 32BIT 16KB FLASH 32HVQFN

  • Core Processor: ARM® Cortex®-M0
  • Core Size: 32-Bit Single-Core
  • Speed: 50MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 28
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 8x10b SAR
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 32-VQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (7x7)
패키지: -
재고3,900
S32G398AACK1VUCR
NXP

8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1

  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
  • Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
  • Speed: 400MHz, 1.3GHz
  • Co-Processors/DSP: Multimedia; NEON
  • RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 2.5Gbps (3)
  • SATA: -
  • USB: USB 2.0 OTG (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
  • Package / Case: 525-FBGA, FCBGA
  • Supplier Device Package: 525-FCPBGA (19x19)
패키지: -
Request a Quote
A3G26H502W17SR3
NXP

RF MOSFET GAN 48V NI780

  • Transistor Type: GaN
  • Frequency: 2.496GHz ~ 2.69GHz
  • Gain: 13.1dB
  • Voltage - Test: 48 V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 370 mA
  • Power - Output: 80W
  • Voltage - Rated: 125 V
  • Package / Case: NI-780-4S2S
  • Supplier Device Package: NI-780-4S2S
패키지: -
Request a Quote