페이지 434 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
74AHCT259D,112	NXP	IC 8BIT ADDRESSBL LATCH 16-SOIC Logic Type: D-Type, Addressable Circuit: 1:8 Output Type: Standard Voltage - Supply: 4.5 V ~ 5.5 V Independent Circuits: 1 Delay Time - Propagation: 4.1ns Current - Output High, Low: 8mA, 8mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고7,248
74HCT27N,652	NXP	IC GATE NOR 3CH 3-INP 14-DIP Logic Type: NOR Gate Number of Circuits: 3 Number of Inputs: 3 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): 2µA Current - Output High, Low: 4mA, 4mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	패키지: 14-DIP (0.300", 7.62mm)	재고5,888
74LV86BQ,115	NXP	IC GATE XOR 4CH 2-INP 14-DHVQFN Logic Type: XOR (Exclusive OR) Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Max): 40µA Current - Output High, Low: 12mA, 12mA Logic Level - Low: 0.3 V ~ 0.8 V Logic Level - High: 0.9 V ~ 2 V Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-DHVQFN (2.5x3) Package / Case: 14-VFQFN Exposed Pad	패키지: 14-VFQFN Exposed Pad	재고6,112
74LVT2952DB,118	NXP	IC TRANSCVR 8BIT N-INV 24SSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	패키지: 24-SSOP (0.209", 5.30mm Width)	재고3,280
TDA18252HN/C1,557	NXP	IC DGTL CABLE SIL TUNER 48HVQFN Type: Silicon Tuner Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	패키지: 48-VFQFN Exposed Pad	재고7,712
NCX2200GM,115	NXP	IC COMPARATOR RRIO SINGLE 6-XSON Type: General Purpose Number of Elements: 1 Output Type: Rail-to-Rail Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V Current - Output (Typ): - Current - Quiescent (Max): 6µA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Propagation Delay (Max): 800ns Hysteresis: 20mV Operating Temperature: -40°C ~ 85°C Package / Case: 6-XFDFN Mounting Type: Surface Mount Supplier Device Package: 6-XSON, SOT886 (1.45x1)	패키지: 6-XFDFN	재고6,320
MPC8536ECVJAVLA	NXP	IC MPU MPC85XX 1.5GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고3,936
MPC8547EVJAQGD	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BFBGA, FCBGA	재고7,152
MCIMX7D3DVK10SC	NXP	NO EPDC, 2 ETH, NO CAN, 2 OTG 1 Core Processor: ARM? Cortex?-A7, ARM? Cortex?-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Package / Case: 488-TFBGA Supplier Device Package: 488-FBGA (12x12)	패키지: 488-TFBGA	재고7,808
MPC8308ZQAFDA	NXP	IC MPU MPC83XX 333MHZ 473MAPBGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: - RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	패키지: 473-LFBGA	재고7,152
MCIMX502CVM8B	NXP	IC MPU I.MX50 800MHZ 400MAPBGA Core Processor: ARM? Cortex?-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	패키지: 400-LFBGA	재고5,232
P87C51RD2FBD/01,15	NXP	IC MCU 8BIT 64KB OTP 44LQFP Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: EBI/EMI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 64KB (64K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	패키지: 44-LQFP	재고2,864
PCF51AC128CCFUE	NXP	IC MCU 32BIT 128KB FLASH 64QFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 20x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	패키지: 64-QFP	재고3,216
MC908KX8VPE	NXP	IC MCU 8BIT 8KB FLASH 16DIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	패키지: 16-DIP (0.300", 7.62mm)	재고7,472
P80C31SBAA,512	NXP	IC MCU 8BIT ROMLESS 44PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 16MHz Connectivity: UART/USART Peripherals: POR Number of I/O: 32 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	패키지: 44-LCC (J-Lead)	재고7,040
LPC54608J512ET180E	NXP	IC MCU 32BIT 512KB FLASH 180BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 145 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 180-TFBGA Supplier Device Package: 180-TFBGA (12x12)	패키지: 180-TFBGA	재고9,000
MK26FN2M0VMI18	NXP	IC MCU 32BIT 2MB FLASH 169MAPBGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 116 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 2x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 169-LFBGA Supplier Device Package: 169-MAPBGA (9x9)	패키지: 169-LFBGA	재고21,072
PN5120A0HN/C2,518	NXP	IC TRANSMISSION MOD 40-HVQFN Type: RFID Reader/Transponder Frequency: 13.56MHz Standards: FeliCa, ISO 14443, MIFARE, NFC Interface: I2C, SPI, UART Voltage - Supply: 2.5 V ~ 3.6 V Operating Temperature: -40°C ~ 90°C Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	패키지: 40-VFQFN Exposed Pad	재고2,088
PN5180A0ET/C1,151	NXP	TFBGA64 Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443, ISO 15693, ISO 18000-3 Interface: SPI, UART Voltage - Supply: 2.7 V ~ 5.5 V Operating Temperature: -30°C ~ 85°C Package / Case: 64-TFBGA Supplier Device Package: 64-TFBGA (5.5x5.5)	패키지: 64-TFBGA	재고6,840
MF1PLUS6001DUD/03,	NXP	IC SMART CARD 2KB EEPROM FFC Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443 Interface: - Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: MOA4, Smart Card Module Supplier Device Package: PLLMC	패키지: MOA4, Smart Card Module	재고6,912
JN5169/001Z	NXP	IC RF TXRX+MCU 802.15.4 40-VFQFN Type: TxRx + MCU RF Family/Standard: 802.15.4 Protocol: Zigbee? Modulation: O-QPSK Frequency: 2.4GHz Data Rate (Max): 400kbps Power - Output: 10dBm Sensitivity: -96.5dBm Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM Serial Interfaces: I2C, JTAG, SPI, UART GPIO: 20 Voltage - Supply: 2 V ~ 3.6 V Current - Receiving: 13mA ~ 15mA Current - Transmitting: 14mA ~ 23.3mA Operating Temperature: -40°C ~ 125°C Package / Case: 40-VFQFN Exposed Pad	패키지: 40-VFQFN Exposed Pad	재고6,246
TEF6635HW/V103,518	NXP	IC DGTL CHIP AUTO RADIO 100HTQFP Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: - Applications: - Current - Receiving: - Data Interface: - Memory Size: - Antenna Connector: - Features: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	패키지: -	재고2,214
MD7IC2250NR1	NXP	IC AMP PWR RF 2100MHZ TO270-14 Frequency: 2GHz ~ 2.2GHz P1dB: - Gain: 31dB Noise Figure: - RF Type: W-CDMA Voltage - Supply: 32V Current - Supply: - Test Frequency: 2.17GHz Package / Case: TO-270-14 Variant, Flat Leads Supplier Device Package: TO-270 WB-14	패키지: TO-270-14 Variant, Flat Leads	재고5,490
SPC5604BK0CLQ6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 123 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 36x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고2,064
FS32K144HAT0MLLR	NXP	S32K144 32-BIT MCU, ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고5,760
SPC5744CFK1ACMH6	NXP	IC MCU 32B 1.5MB FLASH 100MAPBGA Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Number of I/O: 65 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	패키지: -	Request a Quote
FS32K144HFT0MMHT	NXP	IC MCU 32B 512KB FLASH 100MAPBGA Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 89 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	패키지: -	Request a Quote
MC35FS6518NAER2	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	패키지: -	Request a Quote

74AHCT259D,112

NXP

IC 8BIT ADDRESSBL LATCH 16-SOIC

Logic Type: D-Type, Addressable
Circuit: 1:8
Output Type: Standard
Voltage - Supply: 4.5 V ~ 5.5 V
Independent Circuits: 1
Delay Time - Propagation: 4.1ns
Current - Output High, Low: 8mA, 8mA
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고7,248

74HCT27N,652

NXP

IC GATE NOR 3CH 3-INP 14-DIP

Logic Type: NOR Gate
Number of Circuits: 3
Number of Inputs: 3
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): 2µA
Current - Output High, Low: 4mA, 4mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Supplier Device Package: 14-DIP
Package / Case: 14-DIP (0.300", 7.62mm)

패키지: 14-DIP (0.300", 7.62mm)

재고5,888

74LV86BQ,115

NXP

IC GATE XOR 4CH 2-INP 14-DHVQFN

Logic Type: XOR (Exclusive OR)
Number of Circuits: 4
Number of Inputs: 2
Features: -
Voltage - Supply: 1 V ~ 5.5 V
Current - Quiescent (Max): 40µA
Current - Output High, Low: 12mA, 12mA
Logic Level - Low: 0.3 V ~ 0.8 V
Logic Level - High: 0.9 V ~ 2 V
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Supplier Device Package: 14-DHVQFN (2.5x3)
Package / Case: 14-VFQFN Exposed Pad

패키지: 14-VFQFN Exposed Pad

재고6,112

74LVT2952DB,118

NXP

IC TRANSCVR 8BIT N-INV 24SSOP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 24-SSOP

패키지: 24-SSOP (0.209", 5.30mm Width)

재고3,280

TDA18252HN/C1,557

NXP

IC DGTL CABLE SIL TUNER 48HVQFN

Type: Silicon Tuner
Applications: Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

패키지: 48-VFQFN Exposed Pad

재고7,712

NCX2200GM,115

NXP

IC COMPARATOR RRIO SINGLE 6-XSON

Type: General Purpose
Number of Elements: 1
Output Type: Rail-to-Rail
Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): -
Current - Quiescent (Max): 6µA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Propagation Delay (Max): 800ns
Hysteresis: 20mV
Operating Temperature: -40°C ~ 85°C
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Supplier Device Package: 6-XSON, SOT886 (1.45x1)

패키지: 6-XFDFN

재고6,320

MPC8536ECVJAVLA

NXP

IC MPU MPC85XX 1.5GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고3,936

MPC8547EVJAQGD

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BFBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BFBGA, FCBGA

재고7,152

MCIMX7D3DVK10SC

NXP

NO EPDC, 2 ETH, NO CAN, 2 OTG 1

Core Processor: ARM? Cortex?-A7, ARM? Cortex?-M4
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON? MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Package / Case: 488-TFBGA
Supplier Device Package: 488-FBGA (12x12)

패키지: 488-TFBGA

재고7,808

MPC8308ZQAFDA

NXP

IC MPU MPC83XX 333MHZ 473MAPBGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 333MHz
Co-Processors/DSP: -
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

패키지: 473-LFBGA

재고7,152

MCIMX502CVM8B

NXP

IC MPU I.MX50 800MHZ 400MAPBGA

Core Processor: ARM? Cortex?-A8
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: Boot Security, Cryptography, Secure JTAG
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

패키지: 400-LFBGA

재고5,232

P87C51RD2FBD/01,15

NXP

IC MCU 8BIT 64KB OTP 44LQFP

Core Processor: 8051
Core Size: 8-Bit
Speed: 33MHz
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 32
Program Memory Size: 64KB (64K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

패키지: 44-LQFP

재고2,864

PCF51AC128CCFUE

NXP

IC MCU 32BIT 128KB FLASH 64QFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 20x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

패키지: 64-QFP

재고3,216

MC908KX8VPE

NXP

IC MCU 8BIT 8KB FLASH 16DIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

패키지: 16-DIP (0.300", 7.62mm)

재고7,472

P80C31SBAA,512

NXP

IC MCU 8BIT ROMLESS 44PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 16MHz
Connectivity: UART/USART
Peripherals: POR
Number of I/O: 32
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

패키지: 44-LCC (J-Lead)

재고7,040

LPC54608J512ET180E

NXP

IC MCU 32BIT 512KB FLASH 180BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: 145
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

패키지: 180-TFBGA

재고9,000

MK26FN2M0VMI18

NXP

IC MCU 32BIT 2MB FLASH 169MAPBGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 116
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 2x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 169-LFBGA
Supplier Device Package: 169-MAPBGA (9x9)

패키지: 169-LFBGA

재고21,072

PN5120A0HN/C2,518

NXP

IC TRANSMISSION MOD 40-HVQFN

Type: RFID Reader/Transponder
Frequency: 13.56MHz
Standards: FeliCa, ISO 14443, MIFARE, NFC
Interface: I2C, SPI, UART
Voltage - Supply: 2.5 V ~ 3.6 V
Operating Temperature: -40°C ~ 90°C
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

패키지: 40-VFQFN Exposed Pad

재고2,088

PN5180A0ET/C1,151

NXP

TFBGA64

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 14443, ISO 15693, ISO 18000-3
Interface: SPI, UART
Voltage - Supply: 2.7 V ~ 5.5 V
Operating Temperature: -30°C ~ 85°C
Package / Case: 64-TFBGA
Supplier Device Package: 64-TFBGA (5.5x5.5)

패키지: 64-TFBGA

재고6,840

MF1PLUS6001DUD/03,

NXP

IC SMART CARD 2KB EEPROM FFC

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 14443
Interface: -
Voltage - Supply: -
Operating Temperature: -25°C ~ 70°C
Package / Case: MOA4, Smart Card Module
Supplier Device Package: PLLMC

패키지: MOA4, Smart Card Module

재고6,912

JN5169/001Z

NXP

IC RF TXRX+MCU 802.15.4 40-VFQFN

Type: TxRx + MCU
RF Family/Standard: 802.15.4
Protocol: Zigbee?
Modulation: O-QPSK
Frequency: 2.4GHz
Data Rate (Max): 400kbps
Power - Output: 10dBm
Sensitivity: -96.5dBm
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Serial Interfaces: I2C, JTAG, SPI, UART
GPIO: 20
Voltage - Supply: 2 V ~ 3.6 V
Current - Receiving: 13mA ~ 15mA
Current - Transmitting: 14mA ~ 23.3mA
Operating Temperature: -40°C ~ 125°C
Package / Case: 40-VFQFN Exposed Pad

패키지: 40-VFQFN Exposed Pad

재고6,246

TEF6635HW/V103,518

NXP

IC DGTL CHIP AUTO RADIO 100HTQFP

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: -
Applications: -
Current - Receiving: -
Data Interface: -
Memory Size: -
Antenna Connector: -
Features: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고2,214

MD7IC2250NR1

NXP

IC AMP PWR RF 2100MHZ TO270-14

Frequency: 2GHz ~ 2.2GHz
P1dB: -
Gain: 31dB
Noise Figure: -
RF Type: W-CDMA
Voltage - Supply: 32V
Current - Supply: -
Test Frequency: 2.17GHz
Package / Case: TO-270-14 Variant, Flat Leads
Supplier Device Package: TO-270 WB-14

패키지: TO-270-14 Variant, Flat Leads

재고5,490

SPC5604BK0CLQ6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 123
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 36x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고2,064

FS32K144HAT0MLLR

NXP

S32K144 32-BIT MCU, ARM

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고5,760

SPC5744CFK1ACMH6

NXP

IC MCU 32B 1.5MB FLASH 100MAPBGA

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz, 160MHz
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Number of I/O: 65
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

패키지: -

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FS32K144HFT0MMHT

NXP

IC MCU 32B 512KB FLASH 100MAPBGA

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 89
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

패키지: -

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MC35FS6518NAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

패키지: -

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