페이지 445 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
MRFE6VP61K25GNR6	NXP	TRANS RF LDMOS 1250W 50V Transistor Type: LDMOS (Dual) Frequency: 230MHz Gain: 23dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 100mA Power - Output: 1250W Voltage - Rated: 133V Package / Case: OM-1230G-4L Supplier Device Package: OM-1230G-4L	패키지: OM-1230G-4L	재고4,624
PDTD123EK,115	NXP	TRANS PREBIAS NPN 250MW SMT3 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 2.2k Resistor - Emitter Base (R2) (Ohms): 2.2k DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 50mA, 5V Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	패키지: TO-236-3, SC-59, SOT-23-3	재고3,216
MBC13900T1	NXP	IC TRANS NPN RF LOW NOISE SC70-4 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 6.5V Frequency - Transition: 15GHz Noise Figure (dB Typ @ f): 0.8dB ~ 1.1dB @ 900MHz ~ 1.9GHz Gain: 15dB ~ 22dB Power - Max: 188mW DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 2V Current - Collector (Ic) (Max): 20mA Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-82A, SOT-343 Supplier Device Package: SOT-343	패키지: SC-82A, SOT-343	재고5,200
MC07XS3200EKR2	NXP	IC SWITCH DUAL 32SOIC SPDL07 Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:2 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 20 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 26A Rds On (Typ): 7 mOhm Input Type: - Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	패키지: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	재고6,576
74LVCH322245AEC/G,	NXP	IC BUS TRSCVR 3-ST 32BIT 96LFBGA Logic Type: Transceiver, Non-Inverting Number of Elements: 4 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	패키지: 96-LFBGA	재고5,424
74ALVT162244DGG:51	NXP	IC BUFF DVR TRI-ST 16BIT 48TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	패키지: 48-TFSOP (0.240", 6.10mm Width)	재고4,800
TDA9981BHL/15/C1:5	NXP	IC HDMI TX 150MHZ 80-LQFP Type: Transmitter Applications: Recorders, Set-Top Boxes Mounting Type: Surface Mount Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	패키지: 80-LQFP	재고4,976
TDA9898HN/V3,551	NXP	IC IF PROCESSOR HYBRID 48-HVQFN Type: Demodulator Applications: TV Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	패키지: 48-VFQFN Exposed Pad	재고7,424
TDA8511J/N2,112	NXP	IC AMP AUDIO PWR 13W QUAD 17SIL Type: Class B Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 13W x 4 @ 2 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: DBS17P Package / Case: 17-SIP Formed Leads	패키지: 17-SIP Formed Leads	재고2,592
KMPC8347EVVAJDB	NXP	IC MPU MPC83XX 533MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	패키지: 672-LBGA	재고7,088
KMPC860DPVR66D4	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고3,520
MCIMX6Y7DVM09AA	NXP	I.MX 6ULL 900 MHZ CONSUMER WITH Core Processor: ARM? Cortex?-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 900MHz Co-Processors/DSP: Multimedia; NEON? MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14x14)	패키지: 289-LFBGA	재고6,336
S908QY4H0CDWE	NXP	IC MCU 8BIT 4KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.295", 7.50mm Width)	재고6,768
MCHC705B16NVFNE	NXP	IC MCU 8BIT 15KB OTP 52PLCC Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI Peripherals: POR, WDT Number of I/O: 32 Program Memory Size: 15KB (15K x 8) Program Memory Type: OTP EEPROM Size: 256 x 8 RAM Size: 352 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	패키지: 52-LCC (J-Lead)	재고7,968
MCHC908AB32CFUR2	NXP	IC MCU 8BIT 32KB FLASH 64QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: POR, PWM Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	패키지: 64-QFP	재고7,104
LPC4353FET256,551	NXP	IC MCU 32BIT 512KB FLASH 256LBGA Core Processor: ARM? Cortex?-M4/M0 Core Size: 32-Bit Dual-Core Speed: 204MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Number of I/O: 164 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-LBGA (17x17)	패키지: 256-LBGA	재고3,888
LPC18S57JET256E	NXP	IC MCU 32BIT 1MB FLASH 256LBGA Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 164 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-LBGA (17x17)	패키지: 256-LBGA	재고6,576
MC68HC908QT4CPE	NXP	IC MCU 8BIT 4KB FLASH 8DIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	패키지: 8-DIP (0.300", 7.62mm)	재고14,022
MF3ICD8101DUD/05,0	NXP	IC SMART CARD 8K EEPROM FFC Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443, MIFARE Interface: UART Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: Die Supplier Device Package: Die	패키지: Die	재고7,812
MPXY8600DK6T1	NXP	IC PRESSURE SENSOR 32QFN Frequency: 315MHz, 434MHz Applications: TPM (Tire Pressure Monitor) Modulation or Protocol: FSK, OOK Data Rate (Max): - Power - Output: - Current - Transmitting: - Data Interface: PCB, Surface Mount Antenna Connector: PCB, Surface Mount Memory Size: 8kB Flash, 512B SRAM Features: - Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Package / Case: 32-QFN Exposed Pad	패키지: 32-QFN Exposed Pad	재고5,724
MMPF0100FCANESR2	NXP	POWER MANAGEMENT IC I.MX6 NO-P Applications: - Voltage - Input: - Number of Outputs: - Voltage - Output: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고3,616
TDA18280HN/C1Y	NXP	CABLE FST DEMOD Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고7,792
LS2044AXN7TTB	NXP	LS2044A XT 1800 R1.1 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	재고5,680
SPC5744BK1AMMH2	NXP	SINGLE CORE 1.5M FLASH 192K RA Core Processor: e200z4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: - Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	패키지: 100-LBGA	재고4,288
S912XEG256BCALR	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	패키지: 112-LQFP	재고6,816
MCF51AC256ACPUER	NXP	MCF51AC 32-BIT MCU COLDFIRE V1 Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 54 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 20x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고5,968
S9S08RNA8W2MTGR	NXP	8-BIT MCU S08 CORE 16KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	패키지: 16-TSSOP (0.173", 4.40mm Width)	재고5,456
BAS21-MI-215	NXP	BAS21 - HIGH-VOLTAGE SWITCHING D Diode Type: - Voltage - DC Reverse (Vr) (Max): - Current - Average Rectified (Io): - Voltage - Forward (Vf) (Max) @ If: - Speed: - Reverse Recovery Time (trr): - Current - Reverse Leakage @ Vr: - Capacitance @ Vr, F: - Mounting Type: - Package / Case: - Supplier Device Package: - Operating Temperature - Junction: -	패키지: -	Request a Quote

MRFE6VP61K25GNR6

NXP

TRANS RF LDMOS 1250W 50V

Transistor Type: LDMOS (Dual)
Frequency: 230MHz
Gain: 23dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 100mA
Power - Output: 1250W
Voltage - Rated: 133V
Package / Case: OM-1230G-4L
Supplier Device Package: OM-1230G-4L

패키지: OM-1230G-4L

재고4,624

PDTD123EK,115

NXP

TRANS PREBIAS NPN 250MW SMT3

Transistor Type: NPN - Pre-Biased
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 2.2k
Resistor - Emitter Base (R2) (Ohms): 2.2k
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 50mA, 5V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
Frequency - Transition: -
Power - Max: 250mW
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

패키지: TO-236-3, SC-59, SOT-23-3

재고3,216

MBC13900T1

NXP

IC TRANS NPN RF LOW NOISE SC70-4

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 6.5V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.8dB ~ 1.1dB @ 900MHz ~ 1.9GHz
Gain: 15dB ~ 22dB
Power - Max: 188mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 2V
Current - Collector (Ic) (Max): 20mA
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-82A, SOT-343
Supplier Device Package: SOT-343

패키지: SC-82A, SOT-343

재고5,200

MC07XS3200EKR2

NXP

IC SWITCH DUAL 32SOIC SPDL07

Switch Type: General Purpose
Number of Outputs: 2
Ratio - Input:Output: 1:2
Output Configuration: High Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 6 V ~ 20 V
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Current - Output (Max): 26A
Rds On (Typ): 7 mOhm
Input Type: -
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP

패키지: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

재고6,576

74LVCH322245AEC/G,

NXP

IC BUS TRSCVR 3-ST 32BIT 96LFBGA

Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)

패키지: 96-LFBGA

재고5,424

74ALVT162244DGG:51

NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

패키지: 48-TFSOP (0.240", 6.10mm Width)

재고4,800

TDA9981BHL/15/C1:5

NXP

IC HDMI TX 150MHZ 80-LQFP

Type: Transmitter
Applications: Recorders, Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

패키지: 80-LQFP

재고4,976

TDA9898HN/V3,551

NXP

IC IF PROCESSOR HYBRID 48-HVQFN

Type: Demodulator
Applications: TV
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

패키지: 48-VFQFN Exposed Pad

재고7,424

TDA8511J/N2,112

NXP

IC AMP AUDIO PWR 13W QUAD 17SIL

Type: Class B
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 13W x 4 @ 2 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DBS17P
Package / Case: 17-SIP Formed Leads

패키지: 17-SIP Formed Leads

재고2,592

KMPC8347EVVAJDB

NXP

IC MPU MPC83XX 533MHZ 672TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 672-LBGA
Supplier Device Package: 672-TBGA (35x35)

패키지: 672-LBGA

재고7,088

KMPC860DPVR66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고3,520

MCIMX6Y7DVM09AA

NXP

I.MX 6ULL 900 MHZ CONSUMER WITH

Core Processor: ARM? Cortex?-A7
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 900MHz
Co-Processors/DSP: Multimedia; NEON? MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.8V, 3.3V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Package / Case: 289-LFBGA
Supplier Device Package: 289-MAPBGA (14x14)

패키지: 289-LFBGA

재고6,336

S908QY4H0CDWE

NXP

IC MCU 8BIT 4KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.295", 7.50mm Width)

재고6,768

MCHC705B16NVFNE

NXP

IC MCU 8BIT 15KB OTP 52PLCC

Core Processor: HC05
Core Size: 8-Bit
Speed: 2.1MHz
Connectivity: SCI
Peripherals: POR, WDT
Number of I/O: 32
Program Memory Size: 15KB (15K x 8)
Program Memory Type: OTP
EEPROM Size: 256 x 8
RAM Size: 352 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

패키지: 52-LCC (J-Lead)

재고7,968

MCHC908AB32CFUR2

NXP

IC MCU 8BIT 32KB FLASH 64QFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: POR, PWM
Number of I/O: 51
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

패키지: 64-QFP

재고7,104

LPC4353FET256,551

NXP

IC MCU 32BIT 512KB FLASH 256LBGA

Core Processor: ARM? Cortex?-M4/M0
Core Size: 32-Bit Dual-Core
Speed: 204MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O: 164
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 136K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-LBGA (17x17)

패키지: 256-LBGA

재고3,888

LPC18S57JET256E

NXP

IC MCU 32BIT 1MB FLASH 256LBGA

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: 164
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 136K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-LBGA (17x17)

패키지: 256-LBGA

재고6,576

MC68HC908QT4CPE

NXP

IC MCU 8BIT 4KB FLASH 8DIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 5
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

패키지: 8-DIP (0.300", 7.62mm)

재고14,022

MF3ICD8101DUD/05,0

NXP

IC SMART CARD 8K EEPROM FFC

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 14443, MIFARE
Interface: UART
Voltage - Supply: -
Operating Temperature: -25°C ~ 70°C
Package / Case: Die
Supplier Device Package: Die

패키지: Die

재고7,812

MPXY8600DK6T1

NXP

IC PRESSURE SENSOR 32QFN

Frequency: 315MHz, 434MHz
Applications: TPM (Tire Pressure Monitor)
Modulation or Protocol: FSK, OOK
Data Rate (Max): -
Power - Output: -
Current - Transmitting: -
Data Interface: PCB, Surface Mount
Antenna Connector: PCB, Surface Mount
Memory Size: 8kB Flash, 512B SRAM
Features: -
Voltage - Supply: 2.3 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C
Package / Case: 32-QFN Exposed Pad

패키지: 32-QFN Exposed Pad

재고5,724

MMPF0100FCANESR2

NXP

POWER MANAGEMENT IC I.MX6 NO-P

Applications: -
Voltage - Input: -
Number of Outputs: -
Voltage - Output: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고3,616

TDA18280HN/C1Y

NXP

CABLE FST DEMOD

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고7,792

LS2044AXN7TTB

NXP

LS2044A XT 1800 R1.1

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고5,680

SPC5744BK1AMMH2

NXP

SINGLE CORE 1.5M FLASH 192K RA

Core Processor: e200z4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Number of I/O: -
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LBGA
Supplier Device Package: 100-MAPBGA (11x11)

패키지: 100-LBGA

재고4,288

S912XEG256BCALR

NXP

16-BIT MCU S12X CORE 256KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

패키지: 112-LQFP

재고6,816

MCF51AC256ACPUER

NXP

MCF51AC 32-BIT MCU COLDFIRE V1

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, PWM, WDT
Number of I/O: 54
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 20x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고5,968

S9S08RNA8W2MTGR

NXP

8-BIT MCU S08 CORE 16KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 12
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

패키지: 16-TSSOP (0.173", 4.40mm Width)

재고5,456

BAS21-MI-215

NXP

BAS21 - HIGH-VOLTAGE SWITCHING D

Diode Type: -
Voltage - DC Reverse (Vr) (Max): -
Current - Average Rectified (Io): -
Voltage - Forward (Vf) (Max) @ If: -
Speed: -
Reverse Recovery Time (trr): -
Current - Reverse Leakage @ Vr: -
Capacitance @ Vr, F: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -
Operating Temperature - Junction: -

패키지: -

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