페이지 459 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
PMV37EN,215	NXP	MOSFET N-CH 30V 3.1A SOT-23 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2.5V @ 250µA Gate Charge (Qg) (Max) @ Vgs: 10nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 330pF @ 10V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 380mW (Ta) Rds On (Max) @ Id, Vgs: 36 mOhm @ 3.1A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: TO-236AB (SOT23) Package / Case: TO-236-3, SC-59, SOT-23-3	패키지: TO-236-3, SC-59, SOT-23-3	재고2,544
MRF7S19100NBR1	NXP	FET RF 65V 1.99GHZ TO272-4 Transistor Type: LDMOS Frequency: 1.93GHz ~ 1.99GHz Gain: 17.5dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1A Power - Output: 29W Voltage - Rated: 65V Package / Case: TO-272BB Supplier Device Package: TO-272 WB-4	패키지: TO-272BB	재고15,888
LD6836TD/25P,125	NXP	IC REG LINEAR 2.5V 300MA 5TSOP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.5V Voltage - Output (Max): - Voltage Dropout (Max): 0.2V @ 300mA Current - Output: 300mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP	패키지: SC-74A, SOT-753	재고6,016
MC13892VKR2	NXP	IC PMU I.MX51/37/35/27 139MAPBGA Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Current - Supply: - Voltage - Supply: - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 139-TFBGA Supplier Device Package: 139-PBGA (7x7)	패키지: 139-TFBGA	재고7,824
MC33663BJEF	NXP	TXRX DUAL LINCELL 14SOIC Type: - Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고4,272
PCA9665APW,118	NXP	IC CNTRLR PARALLEL/I2C 20TSSOP Protocol: I2C Function: Controller Interface: I2C Standards: - Voltage - Supply: 2.3 V ~ 3.6 V Current - Supply: 100µA Operating Temperature: -40°C ~ 85°C Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	패키지: 20-TSSOP (0.173", 4.40mm Width)	재고25,104
T2081NSE7MQB	NXP	IC SOC 64BIT 8X1.2GHZ 780FCBGA Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Volatile key Storage Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23x23)	패키지: 780-FBGA, FCBGA	재고2,608
MC8641DHX1000GB	NXP	IC MPU MPC86XX 1.0GHZ 1023FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	패키지: 1023-BCBGA, FCCBGA	재고4,688
P1021NSN2DFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고6,208
MCIMX6G2DVK05AA	NXP	IC MPU I.MC6UL 528MHZ 272BGA Core Processor: ARM? Cortex?-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 272-LFBGA Supplier Device Package: 272-MAPBGA (9x9)	패키지: 272-LFBGA	재고7,044
MC9S12DJ64MPVE	NXP	IC MCU 16BIT 64KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	패키지: 112-LQFP	재고5,600
MCHC705KJ1CPE	NXP	IC MCU 8BIT 1.2KB OTP 16DIP Core Processor: HC05 Core Size: 8-Bit Speed: 4MHz Connectivity: - Peripherals: POR, WDT Number of I/O: 10 Program Memory Size: 1.2KB (1.2K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 64 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	패키지: 16-DIP (0.300", 7.62mm)	재고9,912
MSC8144TVT1000B	NXP	ENCRYPTION PACSUN R2.1 783FCBGA Type: SC3400 Core Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA Clock Rate: 1GHz Non-Volatile Memory: External On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고3,520
MPXA4100A6T1	NXP	PRESSURE SENS 16.7PSI MAX 8-SOP Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 15.23 PSI (20 kPa ~ 105 kPa) Output Type: Analog Voltage Output: 0.3 V ~ 49 V Accuracy: ±1.8% Voltage - Supply: 4.85 V ~ 5.35 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD Module Supplier Device Package: -	패키지: 8-SMD Module	재고7,704
SL2FCS1101DV/DH,11	NXP	IC I.CODE UID FCP Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	패키지: -	재고2,970
UJA1132HW/FD/3V/0Y	NXP	BUCK/BOOST HS-CAN/DUAL LIN SYSTE Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고4,848
LS1046ASE8T1A	NXP	PROTO: QORIQ LS 4XA72 64BIT ARM- Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	재고4,512
SPC5646CCAVMJ1	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 199 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	패키지: 256-LBGA	재고3,232
SPC5644CAVLU8	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 27x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	패키지: 176-LQFP	재고7,696
SPC5605BF1MLL4R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 77 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 7x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고7,328
S912XEG384J3CALR	NXP	16-BIT MCU S12X CORE 384KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	패키지: 112-LQFP	재고3,664
S9S08DZ60F2VLCR	NXP	8-BIT MCU S08 CORE 60KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고2,016
TEA19051BAGTK-1J	NXP	SMARTCHARG PROTOC CONTR QC4 Protocol: USB Function: Controller Interface: USB Standards: USB 2.0, USB 3.0 Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 16-VDFN Exposed Pad Supplier Device Package: 16-HVSON (3.5x5.5)	패키지: -	Request a Quote
S9S12G64J0CLHR	NXP	S12 CORE,64K FLASH Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: -	Request a Quote
A2V07H400-04NR3	NXP	RF MOSFET LDMOS 48V OM780G-4 Transistor Type: LDMOS Frequency: 595MHz ~ 851MHz Gain: 19.9dB Voltage - Test: 48 V Current Rating: 10µA Noise Figure: - Current - Test: 700 mA Power - Output: 267W Voltage - Rated: 105 V Package / Case: OM-780G-4L Supplier Device Package: OM-780G-4L	패키지: -	Request a Quote
BAP64LX-Z-315	NXP	DIODE PIN 60V 150MW DFN1006D-2 Diode Type: PIN - Single Voltage - Peak Reverse (Max): 60V Current - Max: 100 mA Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz Power Dissipation (Max): 150 mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: 2-XDFN Supplier Device Package: DFN1006D-2	패키지: -	Request a Quote
MPC859DSLVR66A-NXP	NXP	POWERQUICC 32 BIT POWER ARCHITEC Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10Mbps (1), 10/100Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: -	Request a Quote
MC56F83763MLH	NXP	IC MCU 32BIT 128MB FLASH 64LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 100MHz Connectivity: CANbus, I2C, SPI Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b; D/A 2x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: -	Request a Quote

PMV37EN,215

NXP

MOSFET N-CH 30V 3.1A SOT-23

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs: 10nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 330pF @ 10V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 380mW (Ta)
Rds On (Max) @ Id, Vgs: 36 mOhm @ 3.1A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: TO-236AB (SOT23)
Package / Case: TO-236-3, SC-59, SOT-23-3

패키지: TO-236-3, SC-59, SOT-23-3

재고2,544

MRF7S19100NBR1

NXP

FET RF 65V 1.99GHZ TO272-4

Transistor Type: LDMOS
Frequency: 1.93GHz ~ 1.99GHz
Gain: 17.5dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1A
Power - Output: 29W
Voltage - Rated: 65V
Package / Case: TO-272BB
Supplier Device Package: TO-272 WB-4

패키지: TO-272BB

재고15,888

LD6836TD/25P,125

NXP

IC REG LINEAR 2.5V 300MA 5TSOP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.5V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.2V @ 300mA
Current - Output: 300mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Supplier Device Package: 5-TSOP

패키지: SC-74A, SOT-753

재고6,016

MC13892VKR2

NXP

IC PMU I.MX51/37/35/27 139MAPBGA

Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 139-TFBGA
Supplier Device Package: 139-PBGA (7x7)

패키지: 139-TFBGA

재고7,824

MC33663BJEF

NXP

TXRX DUAL LINCELL 14SOIC

Type: -
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고4,272

PCA9665APW,118

NXP

IC CNTRLR PARALLEL/I2C 20TSSOP

Protocol: I2C
Function: Controller
Interface: I2C
Standards: -
Voltage - Supply: 2.3 V ~ 3.6 V
Current - Supply: 100µA
Operating Temperature: -40°C ~ 85°C
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

패키지: 20-TSSOP (0.173", 4.40mm Width)

재고25,104

T2081NSE7MQB

NXP

IC SOC 64BIT 8X1.2GHZ 780FCBGA

Core Processor: PowerPC e6500
Number of Cores/Bus Width: 4 Core, 64-Bit
Speed: 1.8GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Volatile key Storage
Package / Case: 780-FBGA, FCBGA
Supplier Device Package: 780-FCPBGA (23x23)

패키지: 780-FBGA, FCBGA

재고2,608

MC8641DHX1000GB

NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BCBGA, FCCBGA
Supplier Device Package: 1023-FCCBGA (33x33)

패키지: 1023-BCBGA, FCCBGA

재고4,688

P1021NSN2DFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고6,208

MCIMX6G2DVK05AA

NXP

IC MPU I.MC6UL 528MHZ 272BGA

Core Processor: ARM? Cortex?-A7
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 528MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: 272-LFBGA
Supplier Device Package: 272-MAPBGA (9x9)

패키지: 272-LFBGA

재고7,044

MC9S12DJ64MPVE

NXP

IC MCU 16BIT 64KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 91
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

패키지: 112-LQFP

재고5,600

MCHC705KJ1CPE

NXP

IC MCU 8BIT 1.2KB OTP 16DIP

Core Processor: HC05
Core Size: 8-Bit
Speed: 4MHz
Connectivity: -
Peripherals: POR, WDT
Number of I/O: 10
Program Memory Size: 1.2KB (1.2K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 64 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

패키지: 16-DIP (0.300", 7.62mm)

재고9,912

MSC8144TVT1000B

NXP

ENCRYPTION PACSUN R2.1 783FCBGA

Type: SC3400 Core
Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
Clock Rate: 1GHz
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고3,520

MPXA4100A6T1

NXP

PRESSURE SENS 16.7PSI MAX 8-SOP

Pressure Type: Absolute
Operating Pressure: 2.9 PSI ~ 15.23 PSI (20 kPa ~ 105 kPa)
Output Type: Analog Voltage
Output: 0.3 V ~ 49 V
Accuracy: ±1.8%
Voltage - Supply: 4.85 V ~ 5.35 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD Module
Supplier Device Package: -

패키지: 8-SMD Module

재고7,704

SL2FCS1101DV/DH,11

NXP

IC I.CODE UID FCP

Type: -
Frequency: -
Standards: -
Interface: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고2,970

UJA1132HW/FD/3V/0Y

NXP

BUCK/BOOST HS-CAN/DUAL LIN SYSTE

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고4,848

LS1046ASE8T1A

NXP

PROTO: QORIQ LS 4XA72 64BIT ARM-

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고4,512

SPC5646CCAVMJ1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 199
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

패키지: 256-LBGA

재고3,232

SPC5644CAVLU8

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 147
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 27x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

패키지: 176-LQFP

재고7,696

SPC5605BF1MLL4R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 77
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 7x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고7,328

S912XEG384J3CALR

NXP

16-BIT MCU S12X CORE 384KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

패키지: 112-LQFP

재고3,664

S9S08DZ60F2VLCR

NXP

8-BIT MCU S08 CORE 60KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고2,016

TEA19051BAGTK-1J

NXP

SMARTCHARG PROTOC CONTR QC4

Protocol: USB
Function: Controller
Interface: USB
Standards: USB 2.0, USB 3.0
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 16-VDFN Exposed Pad
Supplier Device Package: 16-HVSON (3.5x5.5)

패키지: -

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S9S12G64J0CLHR

NXP

S12 CORE,64K FLASH

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: -

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A2V07H400-04NR3

NXP

RF MOSFET LDMOS 48V OM780G-4

Transistor Type: LDMOS
Frequency: 595MHz ~ 851MHz
Gain: 19.9dB
Voltage - Test: 48 V
Current Rating: 10µA
Noise Figure: -
Current - Test: 700 mA
Power - Output: 267W
Voltage - Rated: 105 V
Package / Case: OM-780G-4L
Supplier Device Package: OM-780G-4L

패키지: -

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BAP64LX-Z-315

NXP

DIODE PIN 60V 150MW DFN1006D-2

Diode Type: PIN - Single
Voltage - Peak Reverse (Max): 60V
Current - Max: 100 mA
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Power Dissipation (Max): 150 mW
Operating Temperature: -65°C ~ 150°C (TJ)
Package / Case: 2-XDFN
Supplier Device Package: DFN1006D-2

패키지: -

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MPC859DSLVR66A-NXP

NXP

POWERQUICC 32 BIT POWER ARCHITEC

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10Mbps (1), 10/100Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: -

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MC56F83763MLH

NXP

IC MCU 32BIT 128MB FLASH 64LQFP

Core Processor: 56800EX
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CANbus, I2C, SPI
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Data Converters: A/D 20x12b; D/A 2x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: -

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