페이지 479 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
BUK7575-55,127	NXP	MOSFET N-CH 55V 19.7A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 19.7A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: 500pF @ 25V Vgs (Max): ±16V FET Feature: - Power Dissipation (Max): 61W (Tc) Rds On (Max) @ Id, Vgs: 75 mOhm @ 10A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	패키지: TO-220-3	재고4,368
BZX84-A13/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 13V Tolerance: ±1% Power - Max: 250mW Impedance (Max) (Zzt): 30 Ohms Current - Reverse Leakage @ Vr: 100nA @ 8V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	패키지: TO-236-3, SC-59, SOT-23-3	재고7,584
UBA2070T/N1,518	NXP	IC CCFL DRIVER 16-SOIC Type: CCFL Controller Frequency: 40.5kHz ~ 100kHz Voltage - Supply: 12.4 V ~ 13.6 V Current - Supply: 1.5mA Current - Output Source/Sink: - Dimming: No Operating Temperature: -25°C ~ 80°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고2,800
PCF8577CT/3,112	NXP	IC LCD DRIVER 32/64SEG 40-VSOP Display Type: LCD Configuration: 32 Segment Interface: I2C Digits or Characters: - Current - Supply: - Voltage - Supply: 2.5 V ~ 6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-BSOP (0.295", 7.50mm Width) Supplier Device Package: 40-VSOP	패키지: 40-BSOP (0.295", 7.50mm Width)	재고13,710
74ABT00N,112	NXP	IC GATE NAND 4CH 2-INP 14-DIP Logic Type: NAND Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): 50µA Current - Output High, Low: 15mA, 20mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF Operating Temperature: -40°C ~ 85°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	패키지: 14-DIP (0.300", 7.62mm)	재고5,376
SCC2681TC1A44,512	NXP	IC DUART 44PLCC Features: Configurable GPIO, Internal Oscillator, Timer/Counter Number of Channels: 2, DUART FIFO's: - Protocol: - Data Rate (Max): 1Mbps Voltage - Supply: 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: - Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	패키지: 44-LCC (J-Lead)	재고7,232
PCA9509PGM,125	NXP	IC REDRIVER I2C 1CH 400KHZ 8XQFN Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 1 Delay Time: - Signal Conditioning: - Capacitance - Input: 10pF Voltage - Supply: 2.3 V ~ 5.5 V Current - Supply: 5µA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 8-XFQFN Exposed Pad Supplier Device Package: 8-XQFN (1.6x1.6)	패키지: 8-XFQFN Exposed Pad	재고5,952
TJA1050T/V,118	NXP	IC TXRX CAN HS 5.25V 8-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 70mV Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	패키지: 8-SOIC (0.154", 3.90mm Width)	재고6,480
MPC8544EVTALF	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고3,824
KMPC8358EVRAGDDA	NXP	IC MPU MPC83XX 400MHZ 668BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29x29)	패키지: 668-BBGA Exposed Pad	재고6,448
MCIMX6U5EVM10ABR	NXP	IC MPU I.MX6DL 1.0GHZ 624MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	패키지: 624-LFBGA	재고3,984
PK51X256CLK100	NXP	IC MCU 32BIT 256KB FLASH 80LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 23x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	패키지: 80-LQFP	재고4,048
S9S08SG16E1CTG	NXP	IC MCU 8BIT 16KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	패키지: 16-TSSOP (0.173", 4.40mm Width)	재고5,072
MC9S08PA16AVLD	NXP	IC MCU 8BIT 16KB FLASH 44LQFP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 37 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	패키지: 44-LQFP	재고5,376
MK22FX512AVLL12	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 33x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고3,488
LPC1787FBD208,551	NXP	IC MCU 32BIT 512KB FLASH 208LQFP Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Number of I/O: 165 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 208-LQFP Supplier Device Package: 208-LQFP (28x28)	패키지: 208-LQFP	재고13,242
SPAKDSP321VF240	NXP	IC DSP 24BIT 196-MAPBGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 240MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 576kB Voltage - I/O: 3.30V Voltage - Core: 1.60V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 196-BGA Supplier Device Package: 196-MAPBGA (15x15)	패키지: 196-BGA	재고2,720
PC8144EVT1000	NXP	DSP 1GHZ LOW TEMP 783BGA Type: SC3400 Core Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA Clock Rate: 1GHz Non-Volatile Memory: External On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BFBGA, FCBGA	재고3,152
MC13203FCR2	NXP	IC RF TXRX 802.15.4/ISM 32-VFQFN Type: TxRx Only RF Family/Standard: 802.15.4, General ISM > 1GHz Protocol: Zigbee? Modulation: DSSS, O-QPSK Frequency: 2.4GHz Data Rate (Max): 250kbps Power - Output: 0dBm Sensitivity: -92dBm Memory Size: - Serial Interfaces: SPI GPIO: 7 Voltage - Supply: 2 V ~ 3.4 V Current - Receiving: 37mA Current - Transmitting: 30mA Operating Temperature: -40°C ~ 85°C Package / Case: 32-VFQFN Exposed Pad	패키지: 32-VFQFN Exposed Pad	재고4,464
BGA2874,115	NXP	IC AMP MMIC WIDEBANK SOT363 Frequency: 0Hz ~ 750MHz P1dB: 5dBm Gain: 31dB Noise Figure: 3.1dB RF Type: General Purpose Voltage - Supply: 2.3 V ~ 2.7 V Current - Supply: 16.5mA Test Frequency: 500MHz Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: 6-TSSOP	패키지: 6-TSSOP, SC-88, SOT-363	재고6,642
MC35FS6501CAER2	NXP	FS6500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP Exposed Pad	재고4,320
LPC54628J512ET180E	NXP	32-BIT ARM CORTEX-M4 Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 220MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Number of I/O: 145 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 180-TFBGA Supplier Device Package: 180-TFBGA (12x12)	패키지: 180-TFBGA	재고9,492
SPC5606BK0VLQ6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 121 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 15x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고4,528
SAF4010EL-101SK	NXP	SAF4010EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
LX2162RE82029B	NXP	IC MPU QORIQ LX 2GHZ 1150FBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 16 Core, 64-Bit Speed: 2GHz Co-Processors/DSP: - RAM Controllers: DDR4, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: SATA 6Gbps (4) USB: USB 3.0 (1) Voltage - I/O: - Operating Temperature: 5°C ~ 105°C (TA) Security Features: - Package / Case: 1150-FBGA Supplier Device Package: 1150-FBGA (23x23)	패키지: -	재고174
MC908KX2CDWER-NXP	NXP	MICROCONTROLLER, 8 BIT, HC08/S08 Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	패키지: -	Request a Quote
S9S12ZVL32AMLFR	NXP	S12Z CPU, 32K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Data Converters: A/D 10x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: -	Request a Quote
MC34PF8100CHEPR2	NXP	POWER MANAGEMENT IC, I.MX8, PRE- Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote

BUK7575-55,127

NXP

MOSFET N-CH 55V 19.7A TO220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 55V
Current - Continuous Drain (Id) @ 25°C: 19.7A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: 500pF @ 25V
Vgs (Max): ±16V
FET Feature: -
Power Dissipation (Max): 61W (Tc)
Rds On (Max) @ Id, Vgs: 75 mOhm @ 10A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

패키지: TO-220-3

재고4,368

BZX84-A13/LF1R

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 13V
Tolerance: ±1%
Power - Max: 250mW
Impedance (Max) (Zzt): 30 Ohms
Current - Reverse Leakage @ Vr: 100nA @ 8V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

패키지: TO-236-3, SC-59, SOT-23-3

재고7,584

UBA2070T/N1,518

NXP

IC CCFL DRIVER 16-SOIC

Type: CCFL Controller
Frequency: 40.5kHz ~ 100kHz
Voltage - Supply: 12.4 V ~ 13.6 V
Current - Supply: 1.5mA
Current - Output Source/Sink: -
Dimming: No
Operating Temperature: -25°C ~ 80°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고2,800

PCF8577CT/3,112

NXP

IC LCD DRIVER 32/64SEG 40-VSOP

Display Type: LCD
Configuration: 32 Segment
Interface: I2C
Digits or Characters: -
Current - Supply: -
Voltage - Supply: 2.5 V ~ 6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-BSOP (0.295", 7.50mm Width)
Supplier Device Package: 40-VSOP

패키지: 40-BSOP (0.295", 7.50mm Width)

재고13,710

74ABT00N,112

NXP

IC GATE NAND 4CH 2-INP 14-DIP

Logic Type: NAND Gate
Number of Circuits: 4
Number of Inputs: 2
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): 50µA
Current - Output High, Low: 15mA, 20mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Operating Temperature: -40°C ~ 85°C
Mounting Type: Through Hole
Supplier Device Package: 14-DIP
Package / Case: 14-DIP (0.300", 7.62mm)

패키지: 14-DIP (0.300", 7.62mm)

재고5,376

SCC2681TC1A44,512

NXP

IC DUART 44PLCC

Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Number of Channels: 2, DUART
FIFO's: -
Protocol: -
Data Rate (Max): 1Mbps
Voltage - Supply: 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: -
With False Start Bit Detection: Yes
With Modem Control: -
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

패키지: 44-LCC (J-Lead)

재고7,232

PCA9509PGM,125

NXP

IC REDRIVER I2C 1CH 400KHZ 8XQFN

Type: Buffer, ReDriver
Applications: I2C
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 400kHz
Number of Channels: 1
Delay Time: -
Signal Conditioning: -
Capacitance - Input: 10pF
Voltage - Supply: 2.3 V ~ 5.5 V
Current - Supply: 5µA
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: 8-XFQFN Exposed Pad
Supplier Device Package: 8-XQFN (1.6x1.6)

패키지: 8-XFQFN Exposed Pad

재고5,952

TJA1050T/V,118

NXP

IC TXRX CAN HS 5.25V 8-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 70mV
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

패키지: 8-SOIC (0.154", 3.90mm Width)

재고6,480

MPC8544EVTALF

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고3,824

KMPC8358EVRAGDDA

NXP

IC MPU MPC83XX 400MHZ 668BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 668-BBGA Exposed Pad
Supplier Device Package: 668-PBGA-PGE (29x29)

패키지: 668-BBGA Exposed Pad

재고6,448

MCIMX6U5EVM10ABR

NXP

IC MPU I.MX6DL 1.0GHZ 624MAPBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -20°C ~ 105°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

패키지: 624-LFBGA

재고3,984

PK51X256CLK100

NXP

IC MCU 32BIT 256KB FLASH 80LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 23x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

패키지: 80-LQFP

재고4,048

S9S08SG16E1CTG

NXP

IC MCU 8BIT 16KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 12
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

패키지: 16-TSSOP (0.173", 4.40mm Width)

재고5,072

MC9S08PA16AVLD

NXP

IC MCU 8BIT 16KB FLASH 44LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 37
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

패키지: 44-LQFP

재고5,376

MK22FX512AVLL12

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 66
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 33x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고3,488

LPC1787FBD208,551

NXP

IC MCU 32BIT 512KB FLASH 208LQFP

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CAN, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O: 165
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 8x12b, D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-LQFP (28x28)

패키지: 208-LQFP

재고13,242

SPAKDSP321VF240

NXP

IC DSP 24BIT 196-MAPBGA

Type: Fixed Point
Interface: Host Interface, SSI, SCI
Clock Rate: 240MHz
Non-Volatile Memory: ROM (576 B)
On-Chip RAM: 576kB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-BGA
Supplier Device Package: 196-MAPBGA (15x15)

패키지: 196-BGA

재고2,720

PC8144EVT1000

NXP

DSP 1GHZ LOW TEMP 783BGA

Type: SC3400 Core
Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
Clock Rate: 1GHz
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Operating Temperature: 0°C ~ 90°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BFBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BFBGA, FCBGA

재고3,152

MC13203FCR2

NXP

IC RF TXRX 802.15.4/ISM 32-VFQFN

Type: TxRx Only
RF Family/Standard: 802.15.4, General ISM > 1GHz
Protocol: Zigbee?
Modulation: DSSS, O-QPSK
Frequency: 2.4GHz
Data Rate (Max): 250kbps
Power - Output: 0dBm
Sensitivity: -92dBm
Memory Size: -
Serial Interfaces: SPI
GPIO: 7
Voltage - Supply: 2 V ~ 3.4 V
Current - Receiving: 37mA
Current - Transmitting: 30mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 32-VFQFN Exposed Pad

패키지: 32-VFQFN Exposed Pad

재고4,464

BGA2874,115

NXP

IC AMP MMIC WIDEBANK SOT363

Frequency: 0Hz ~ 750MHz
P1dB: 5dBm
Gain: 31dB
Noise Figure: 3.1dB
RF Type: General Purpose
Voltage - Supply: 2.3 V ~ 2.7 V
Current - Supply: 16.5mA
Test Frequency: 500MHz
Package / Case: 6-TSSOP, SC-88, SOT-363
Supplier Device Package: 6-TSSOP

패키지: 6-TSSOP, SC-88, SOT-363

재고6,642

MC35FS6501CAER2

NXP

FS6500

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP Exposed Pad

재고4,320

LPC54628J512ET180E

NXP

32-BIT ARM CORTEX-M4

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 220MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O: 145
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

패키지: 180-TFBGA

재고9,492

SPC5606BK0VLQ6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 121
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 15x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고4,528

SAF4010EL-101SK

NXP

SAF4010EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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LX2162RE82029B

NXP

IC MPU QORIQ LX 2GHZ 1150FBGA

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 16 Core, 64-Bit
Speed: 2GHz
Co-Processors/DSP: -
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: SATA 6Gbps (4)
USB: USB 3.0 (1)
Voltage - I/O: -
Operating Temperature: 5°C ~ 105°C (TA)
Security Features: -
Package / Case: 1150-FBGA
Supplier Device Package: 1150-FBGA (23x23)

패키지: -

재고174

MC908KX2CDWER-NXP

NXP

MICROCONTROLLER, 8 BIT, HC08/S08

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 2KB (2K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192 x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

패키지: -

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S9S12ZVL32AMLFR

NXP

S12Z CPU, 32K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 10x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: -

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MC34PF8100CHEPR2

NXP

POWER MANAGEMENT IC, I.MX8, PRE-

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote