페이지 512 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
MRF6S23100HSR3	NXP	FET RF 68V 2.4GHZ NI-780S Transistor Type: LDMOS Frequency: 2.4GHz Gain: 15.4dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1A Power - Output: 20W Voltage - Rated: 68V Package / Case: NI-780S Supplier Device Package: NI-780S	패키지: NI-780S	재고4,464
MRF7S19170HSR3	NXP	FET RF 65V 1.99GHZ NI-880S Transistor Type: LDMOS Frequency: 1.99GHz Gain: 17.2dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.4A Power - Output: 50W Voltage - Rated: 65V Package / Case: NI-880S Supplier Device Package: NI-880S	패키지: NI-880S	재고22,836
PDTC123EE,115	NXP	TRANS PREBIAS NPN 150MW SC75 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 2.2k Resistor - Emitter Base (R2) (Ohms): 2.2k DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 150mW Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	패키지: SC-75, SOT-416	재고3,520
BB181,335	NXP	DIODE VHF VAR CAP 30V SOD523 Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz Capacitance Ratio: 16 Capacitance Ratio Condition: C0.5/C28 Voltage - Peak Reverse (Max): 30V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	패키지: SC-79, SOD-523	재고4,944
PCA85132U/2DB/Q1,0	NXP	IC LCD DRIVER 32 UNCASED Display Type: LCD Configuration: Multiple Interface: I2C Digits or Characters: Any Digit Type Current - Supply: 60µA Voltage - Supply: 1.8 V ~ 5.5 V Operating Temperature: -40°C ~ 95°C Mounting Type: - Package / Case: Die Supplier Device Package: Die	패키지: Die	재고2,912
MC34674BEPR2	NXP	IC BATT CHARGER SGL 850MA 8-UDFN Battery Chemistry: Lithium-Ion/Polymer Number of Cells: 1 Current - Charging: Constant - Programmable Programmable Features: Timer Fault Protection: Over Voltage Charge Current - Max: 850mA Battery Pack Voltage: 4.2V Voltage - Supply (Max): 10V Interface: - Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 8-UFDFN Exposed Pad Supplier Device Package: 8-UDFN-EP (2x3)	패키지: 8-UFDFN Exposed Pad	재고7,424
74LV4060N,112	NXP	IC 14ST BINARY RIPPLE 16-DIP Logic Type: Binary Counter Direction: Up Number of Elements: 1 Number of Bits per Element: 14 Reset: Asynchronous Timing: - Count Rate: 90MHz Trigger Type: Negative Edge Voltage - Supply: 1 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	패키지: 16-DIP (0.300", 7.62mm)	재고3,184
74LVC162244ADGG:51	NXP	IC BUFFER/LINE DRIVER 3ST 48TSSO Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	패키지: 48-TFSOP (0.240", 6.10mm Width)	재고4,608
TDF8530TH/N2,112	NXP	IC AMP AUDIO CLASS D 44HSOP Type: Class D Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 100W x 4 @ 2 Ohm Voltage - Supply: 6 V ~ 24 V Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 44-HSOP Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad	패키지: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad	재고5,024
PCA9538PW,118	NXP	IC I/O EXPANDER I2C 8B 16TSSOP Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	패키지: 16-TSSOP (0.173", 4.40mm Width)	재고5,776
TJA1028TK/5V0/10:1	NXP	IC TXRX LIN SAE J2602 8HVSON Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 200mV Data Rate: - Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	패키지: 8-VDFN Exposed Pad	재고4,240
SC16IS750IPW,128	NXP	IC UART I2C/SPI 24-TSSOP Protocol: RS232, RS485 Function: Controller Interface: I2C, SPI, UART Standards: - Voltage - Supply: 2.5V, 3.3V Current - Supply: 6mA Operating Temperature: -40°C ~ 95°C Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	패키지: 24-TSSOP (0.173", 4.40mm Width)	재고22,182
MC14LC5480EN	NXP	IC CODEC-FILTER PCM 5V 20-SSOP Type: PCM, Filter Data Interface: PCM Audio Interface Resolution (Bits): 13 b Number of ADCs / DACs: 1 / 1 Sigma Delta: No S/N Ratio, ADCs / DACs (db) Typ: - Dynamic Range, ADCs / DACs (db) Typ: - Voltage - Supply, Analog: - Voltage - Supply, Digital: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Supplier Device Package: 20-SSOP	패키지: 20-SSOP (0.209", 5.30mm Width)	재고5,616
P1013NSE2EFB	NXP	IC MPU Q OR IQ 1.055GHZ 689TBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.055GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고2,560
MCIMX356AJM5BR2	NXP	IC MPU I.MX35 532MHZ 400MAPBGA Core Processor: ARM1136JF-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 532MHz Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Secure Fusebox, Secure JTAG Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	패키지: 400-LFBGA	재고7,792
MCIMX281AVM4B	NXP	IC MPU I.MX28 454MHZ 289MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Hardware ID Package / Case: 289-LFBGA Supplier Device Package: -	패키지: 289-LFBGA	재고3,296
PK51N256CLQ100	NXP	IC MCU 32BIT 256KB FLASH 144LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Number of I/O: 94 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 25x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고3,200
MC9S12XDT512CAAR	NXP	IC MCU 16BIT 512KB FLASH 80QFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 20K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 24x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	패키지: 80-QFP	재고2,848
MF3DH8200DA6/00J	NXP	MIFARE DESFIRE EV2 PLLMC Type: RFID Reader Frequency: 13.56MHz Standards: ISO 14443 Interface: - Voltage - Supply: - Operating Temperature: -25°C ~ 75°C Package / Case: MOB6, Smart Card Module Supplier Device Package: PLLMC	패키지: MOB6, Smart Card Module	재고3,996
MHT1002NR3	NXP	IC TRANS RF LDMOS 915MHZ 780-4 Frequency: 915MHz P1dB: 55.9dBm Gain: 20.7dB Noise Figure: - RF Type: - Voltage - Supply: 48V Current - Supply: - Test Frequency: 915MHz Package / Case: OM780-4 Supplier Device Package: OM780-4	패키지: OM780-4	재고7,326
TFF11115HN/N1,111	NXP	IC FREQUENCY GEN VSAT 24HVQFN PLL: Yes Main Purpose: Ku band VSAT applications Input: Clock Output: Clock Number of Circuits: 1 Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/No Frequency - Max: 11.8GHz Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	패키지: 24-VFQFN Exposed Pad	재고3,936
MC33FS4502LAER2	NXP	SYSTEM BASIS CHIP LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP Exposed Pad	재고5,280
MC33PF3001A7ES	NXP	POWER MANAGEMENT IC I.MX7 PRE- Applications: Processor Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	패키지: 48-VFQFN Exposed Pad	재고5,104
SPC5604BAMLL4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고5,840
FS32K144HFT0MLHT	NXP	S32K144 32-BIT MCU ARM CORTEX-M Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고2,576
MIMX8MM6DVTLZAA	NXP	IC MPU I.MX 8M MINI QUAD BGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.8GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Ethernet: GbE SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-FCBGA (14x14)	패키지: 486-LFBGA, FCBGA	재고16,584
S32G399ASBK1VUCT	NXP	8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2 Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 1.1GHz, 400MHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 2.5Gbps (3) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	패키지: -	Request a Quote
LPC1765FBD100K	NXP	IC MCU 32BIT 256KB FLASH 100LQFP Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Speed: 100MHz Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: -	재고6

MRF6S23100HSR3

NXP

FET RF 68V 2.4GHZ NI-780S

Transistor Type: LDMOS
Frequency: 2.4GHz
Gain: 15.4dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1A
Power - Output: 20W
Voltage - Rated: 68V
Package / Case: NI-780S
Supplier Device Package: NI-780S

패키지: NI-780S

재고4,464

MRF7S19170HSR3

NXP

FET RF 65V 1.99GHZ NI-880S

Transistor Type: LDMOS
Frequency: 1.99GHz
Gain: 17.2dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.4A
Power - Output: 50W
Voltage - Rated: 65V
Package / Case: NI-880S
Supplier Device Package: NI-880S

패키지: NI-880S

재고22,836

PDTC123EE,115

NXP

TRANS PREBIAS NPN 150MW SC75

Transistor Type: NPN - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 2.2k
Resistor - Emitter Base (R2) (Ohms): 2.2k
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 150mW
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

패키지: SC-75, SOT-416

재고3,520

BB181,335

NXP

DIODE VHF VAR CAP 30V SOD523

Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Capacitance Ratio: 16
Capacitance Ratio Condition: C0.5/C28
Voltage - Peak Reverse (Max): 30V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Supplier Device Package: SOD-523

패키지: SC-79, SOD-523

재고4,944

PCA85132U/2DB/Q1,0

NXP

IC LCD DRIVER 32 UNCASED

Display Type: LCD
Configuration: Multiple
Interface: I2C
Digits or Characters: Any Digit Type
Current - Supply: 60µA
Voltage - Supply: 1.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 95°C
Mounting Type: -
Package / Case: Die
Supplier Device Package: Die

패키지: Die

재고2,912

MC34674BEPR2

NXP

IC BATT CHARGER SGL 850MA 8-UDFN

Battery Chemistry: Lithium-Ion/Polymer
Number of Cells: 1
Current - Charging: Constant - Programmable
Programmable Features: Timer
Fault Protection: Over Voltage
Charge Current - Max: 850mA
Battery Pack Voltage: 4.2V
Voltage - Supply (Max): 10V
Interface: -
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 8-UFDFN Exposed Pad
Supplier Device Package: 8-UDFN-EP (2x3)

패키지: 8-UFDFN Exposed Pad

재고7,424

74LV4060N,112

NXP

IC 14ST BINARY RIPPLE 16-DIP

Logic Type: Binary Counter
Direction: Up
Number of Elements: 1
Number of Bits per Element: 14
Reset: Asynchronous
Timing: -
Count Rate: 90MHz
Trigger Type: Negative Edge
Voltage - Supply: 1 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

패키지: 16-DIP (0.300", 7.62mm)

재고3,184

74LVC162244ADGG:51

NXP

IC BUFFER/LINE DRIVER 3ST 48TSSO

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

패키지: 48-TFSOP (0.240", 6.10mm Width)

재고4,608

TDF8530TH/N2,112

NXP

IC AMP AUDIO CLASS D 44HSOP

Type: Class D
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 100W x 4 @ 2 Ohm
Voltage - Supply: 6 V ~ 24 V
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 44-HSOP
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad

패키지: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad

재고5,024

PCA9538PW,118

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

패키지: 16-TSSOP (0.173", 4.40mm Width)

재고5,776

TJA1028TK/5V0/10:1

NXP

IC TXRX LIN SAE J2602 8HVSON

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: 200mV
Data Rate: -
Voltage - Supply: 5.5 V ~ 28 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Supplier Device Package: 8-HVSON (3x3)

패키지: 8-VDFN Exposed Pad

재고4,240

SC16IS750IPW,128

NXP

IC UART I2C/SPI 24-TSSOP

Protocol: RS232, RS485
Function: Controller
Interface: I2C, SPI, UART
Standards: -
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Operating Temperature: -40°C ~ 95°C
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

패키지: 24-TSSOP (0.173", 4.40mm Width)

재고22,182

MC14LC5480EN

NXP

IC CODEC-FILTER PCM 5V 20-SSOP

Type: PCM, Filter
Data Interface: PCM Audio Interface
Resolution (Bits): 13 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
S/N Ratio, ADCs / DACs (db) Typ: -
Dynamic Range, ADCs / DACs (db) Typ: -
Voltage - Supply, Analog: -
Voltage - Supply, Digital: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 20-SSOP

패키지: 20-SSOP (0.209", 5.30mm Width)

재고5,616

P1013NSE2EFB

NXP

IC MPU Q OR IQ 1.055GHZ 689TBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.055GHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고2,560

MCIMX356AJM5BR2

NXP

IC MPU I.MX35 532MHZ 400MAPBGA

Core Processor: ARM1136JF-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 532MHz
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: Secure Fusebox, Secure JTAG
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

패키지: 400-LFBGA

재고7,792

MCIMX281AVM4B

NXP

IC MPU I.MX28 454MHZ 289MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 454MHz
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: Boot Security, Cryptography, Hardware ID
Package / Case: 289-LFBGA
Supplier Device Package: -

패키지: 289-LFBGA

재고3,296

PK51N256CLQ100

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O: 94
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 25x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고3,200

MC9S12XDT512CAAR

NXP

IC MCU 16BIT 512KB FLASH 80QFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 20K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 24x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

패키지: 80-QFP

재고2,848

MF3DH8200DA6/00J

NXP

MIFARE DESFIRE EV2 PLLMC

Type: RFID Reader
Frequency: 13.56MHz
Standards: ISO 14443
Interface: -
Voltage - Supply: -
Operating Temperature: -25°C ~ 75°C
Package / Case: MOB6, Smart Card Module
Supplier Device Package: PLLMC

패키지: MOB6, Smart Card Module

재고3,996

MHT1002NR3

NXP

IC TRANS RF LDMOS 915MHZ 780-4

Frequency: 915MHz
P1dB: 55.9dBm
Gain: 20.7dB
Noise Figure: -
RF Type: -
Voltage - Supply: 48V
Current - Supply: -
Test Frequency: 915MHz
Package / Case: OM780-4
Supplier Device Package: OM780-4

패키지: OM780-4

재고7,326

TFF11115HN/N1,111

NXP

IC FREQUENCY GEN VSAT 24HVQFN

PLL: Yes
Main Purpose: Ku band VSAT applications
Input: Clock
Output: Clock
Number of Circuits: 1
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Frequency - Max: 11.8GHz
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (4x4)

패키지: 24-VFQFN Exposed Pad

재고3,936

MC33FS4502LAER2

NXP

SYSTEM BASIS CHIP LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP Exposed Pad

재고5,280

MC33PF3001A7ES

NXP

POWER MANAGEMENT IC I.MX7 PRE-

Applications: Processor
Current - Supply: -
Voltage - Supply: 2.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

패키지: 48-VFQFN Exposed Pad

재고5,104

SPC5604BAMLL4

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고5,840

FS32K144HFT0MLHT

NXP

S32K144 32-BIT MCU ARM CORTEX-M

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고2,576

MIMX8MM6DVTLZAA

NXP

IC MPU I.MX 8M MINI QUAD BGA

Core Processor: ARM® Cortex®-A53
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.8GHz
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Ethernet: GbE
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Package / Case: 486-LFBGA, FCBGA
Supplier Device Package: 486-FCBGA (14x14)

패키지: 486-LFBGA, FCBGA

재고16,584

S32G399ASBK1VUCT

NXP

8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Speed: 1.1GHz, 400MHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 2.5Gbps (3)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

패키지: -

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LPC1765FBD100K

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit Single-Core
Speed: 100MHz
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 70
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Data Converters: A/D 8x12b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: -

재고6