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NXP 제품

기록 26,590
페이지  531/950
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BFS17W,135
NXP

TRANS NPN 15V 50MA 1GHZ SOT323

  • Transistor Type: NPN
  • Voltage - Collector Emitter Breakdown (Max): 15V
  • Frequency - Transition: 1.6GHz
  • Noise Figure (dB Typ @ f): 4.5dB @ 500MHz
  • Gain: -
  • Power - Max: 300mW
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 2mA, 1V
  • Current - Collector (Ic) (Max): 50mA
  • Operating Temperature: 175°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: SC-70, SOT-323
  • Supplier Device Package: SOT-323-3
패키지: SC-70, SOT-323
재고6,080
PZM4.7NB2,115
NXP

DIODE ZENER 4.7V 300MW SMT3

  • Voltage - Zener (Nom) (Vz): 4.7V
  • Tolerance: ±2%
  • Power - Max: 300mW
  • Impedance (Max) (Zzt): 80 Ohms
  • Current - Reverse Leakage @ Vr: 3µA @ 1V
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
패키지: TO-236-3, SC-59, SOT-23-3
재고3,168
MMPF0100NPANESR2
NXP

IC PWR MGMT I.MX6 56QFN

  • Applications: Converter, i.MX6
  • Voltage - Input: 2.8 V ~ 4.5 V
  • Number of Outputs: 12
  • Voltage - Output: Multiple
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN (8x8)
패키지: 56-VFQFN Exposed Pad
재고2,592
LD6816CX4/14P,315
NXP

IC REG LINEAR 1.4V 150MA 4WLCSP

  • Output Configuration: Positive
  • Output Type: Fixed
  • Number of Regulators: 1
  • Voltage - Input (Max): 5.5V
  • Voltage - Output (Min/Fixed): 1.4V
  • Voltage - Output (Max): -
  • Voltage Dropout (Max): 0.075V @ 150mA
  • Current - Output: 150mA
  • Current - Quiescent (Iq): -
  • Current - Supply (Max): 100µA ~ 250µA
  • PSRR: 55dB (1kHz)
  • Control Features: Enable
  • Protection Features: Over Current, Over Temperature, Transient Voltage
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 4-XFBGA, WLCSP
  • Supplier Device Package: 4-WLCSP (0.76x0.76)
패키지: 4-XFBGA, WLCSP
재고6,704
PCA9952TW/Q900,118
NXP

IC LED DRIVER LIN DIM 28HTSSOP

  • Type: Linear
  • Topology: -
  • Internal Switch(s): Yes
  • Number of Outputs: 16
  • Voltage - Supply (Min): 3V
  • Voltage - Supply (Max): 5.5V
  • Voltage - Output: 40V
  • Current - Output / Channel: 57mA
  • Frequency: -
  • Dimming: PWM
  • Applications: Backlight
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
  • Supplier Device Package: 28-HTSSOP
패키지: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
재고3,328
74CBTLVD3245DS,118
NXP

IC BUS SWITCH 8BIT 20SSOP

  • Type: Bus Switch
  • Circuit: 8 x 1:1
  • Independent Circuits: 1
  • Current - Output High, Low: -
  • Voltage Supply Source: Single Supply
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 20-SSOP (0.154", 3.90mm Width)
  • Supplier Device Package: 20-SSOP
패키지: 20-SSOP (0.154", 3.90mm Width)
재고5,712
CX24123-11,557
NXP

IC DEMODULATOR/DECODER 64TQFP

  • Type: Demodulator
  • Applications: Satellite
  • Mounting Type: Surface Mount
  • Package / Case: 64-TQFP
  • Supplier Device Package: 64-TQFP (10x10)
패키지: 64-TQFP
재고6,032
TDA1308AUK,027
NXP

IC AMP AUDIO .08W STER AB 8WLCSP

  • Type: Class AB
  • Output Type: Headphones, 2-Channel (Stereo)
  • Max Output Power x Channels @ Load: 80mW x 2 @ 32 Ohm
  • Voltage - Supply: 2.4 V ~ 7 V, ±1.2 V ~ 3.5 V
  • Features: Depop, Short-Circuit Protection
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Supplier Device Package: 8-WLCSP
  • Package / Case: 8-XFBGA, WLCSP
패키지: 8-XFBGA, WLCSP
재고6,832
SC16C2550BIBS,157
NXP

IC UART DUAL W/FIFO 32-HVQFN

  • Features: -
  • Number of Channels: 2, DUART
  • FIFO's: 16 Byte
  • Protocol: -
  • Data Rate (Max): 5Mbps
  • Voltage - Supply: 2.5V, 3.3V, 5V
  • With Auto Flow Control: Yes
  • With IrDA Encoder/Decoder: -
  • With False Start Bit Detection: Yes
  • With Modem Control: Yes
  • Mounting Type: Surface Mount
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
패키지: 32-VFQFN Exposed Pad
재고7,136
MC33662JEFR2
NXP

IC LIN INTERFACE W/WAKE 8SOIC

  • Type: Transceiver
  • Protocol: LIN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: 175mV
  • Data Rate: 10kbps
  • Voltage - Supply: 7 V ~ 18 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
패키지: 8-SOIC (0.154", 3.90mm Width)
재고2,832
hot PCA9665PW,118
NXP

IC CNTRLR PARALLEL/I2C 20TSSOP

  • Protocol: I2C
  • Function: Controller
  • Interface: Parallel
  • Standards: -
  • Voltage - Supply: 2.3 V ~ 3.6 V
  • Current - Supply: 100µA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
패키지: 20-TSSOP (0.173", 4.40mm Width)
재고27,600
hot XPC8260VVIHBC
NXP

IC MPU MPC82XX 200MHZ 408TBGA

  • Core Processor: PowerPC G2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 200MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 480-LBGA
  • Supplier Device Package: 408-TBGA (37.5x37.5)
패키지: 480-LBGA
재고6,752
LPC2103FHN48H/6,51
NXP

IC MCU 32BIT 32KB FLASH 48HVQFN

  • Core Processor: ARM7?
  • Core Size: 16/32-Bit
  • Speed: 70MHz
  • Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 32
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (6x6)
패키지: 48-VFQFN Exposed Pad
재고3,696
MCF5234CVM150J
NXP

IC MCU 32BIT ROMLESS 256MAPBGA

  • Core Processor: Coldfire V2
  • Core Size: 32-Bit
  • Speed: 150MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Peripherals: DMA, WDT
  • Number of I/O: 97
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPBGA
패키지: 256-LBGA
재고3,872
P89LV51RC2FBC,557
NXP

IC MCU 8BIT 32KB FLASH 44TQFP

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 33MHz
  • Connectivity: SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O: 32
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-TQFP (10x10)
패키지: 44-TQFP
재고6,912
hot MPC555LFCZP40
NXP

IC MCU 32BIT 448KB FLASH 272BGA

  • Core Processor: PowerPC
  • Core Size: 32-Bit
  • Speed: 40MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 101
  • Program Memory Size: 448KB (448K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 26K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 32x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 272-BBGA
  • Supplier Device Package: 272-PBGA (27x27)
패키지: 272-BBGA
재고7,312
MMA7331LR1
NXP

ACCELEROMETER 4-9G ANALOG 14LGA

  • Type: Analog
  • Axis: X, Y, Z
  • Acceleration Range: ±4g, 9g
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
  • Bandwidth: 400Hz (X,Y), 300Hz (Z)
  • Output Type: Analog Voltage
  • Voltage - Supply: 2.2 V ~ 3.6 V
  • Features: Selectable Scale
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 14-VFLGA
  • Supplier Device Package: 14-LGA (3x5)
패키지: 14-VFLGA
재고7,488
LS1012AXE7EKB
NXP

LS1012A XT WE 600MHZ RV2

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고7,980
S9S08RN32W1CLC
NXP

8-BIT MCU S08 CORE 32KB FLASH

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I²C, LINbus, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 26
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
패키지: 32-LQFP
재고2,416
S9S12GN16F1VTJR
NXP

16-BIT MCU S12 CORE 16KB FLASH

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 14
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
패키지: 20-TSSOP (0.173", 4.40mm Width)
재고2,032
MF3DH8201DUF-01V
NXP

IC MIFARE DESFIRE EV2 FFC

  • Applications: -
  • Core Processor: -
  • Program Memory Type: -
  • Controller Series: -
  • RAM Size: -
  • Interface: -
  • Number of I/O: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
MVR5510AMBAHESR2
NXP

IC PMIC VR5510 ASIL-B

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 2.7V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
패키지: -
Request a Quote
MFS2601AMBA0ADR2
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
패키지: -
Request a Quote
MGD3160AM335EKR2
NXP

EV INVERTER CONTROL; IGBT & SIC

  • Output Configuration: Half Bridge
  • Applications: DC-DC Converters
  • Interface: PWM, SPI
  • Load Type: Inductive, Capacitive, Resistive
  • Technology: Power MOSFET, IGBT
  • Rds On (Typ): 500mOhm LS, 500mOhm HS
  • Current - Output / Channel: 15A
  • Current - Peak Output: 15A
  • Voltage - Supply: 4.5V ~ 40V
  • Voltage - Load: 4.5V ~ 40V
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Features: -
  • Fault Protection: Over Temperature, Short Circuit
  • Mounting Type: Surface Mount
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width)
  • Supplier Device Package: 32-SOIC
패키지: -
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PMV62XN-215
NXP

MOSFET N-CH SOT-23

  • FET Type: -
  • Technology: -
  • Drain to Source Voltage (Vdss): -
  • Current - Continuous Drain (Id) @ 25°C: -
  • Drive Voltage (Max Rds On, Min Rds On): -
  • Vgs(th) (Max) @ Id: -
  • Gate Charge (Qg) (Max) @ Vgs: -
  • Input Capacitance (Ciss) (Max) @ Vds: -
  • Vgs (Max): -
  • FET Feature: -
  • Power Dissipation (Max): -
  • Rds On (Max) @ Id, Vgs: -
  • Operating Temperature: -
  • Mounting Type: -
  • Supplier Device Package: -
  • Package / Case: -
패키지: -
Request a Quote
MC33PF8200DFESR2
NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
패키지: -
Request a Quote
FH32K116BRT0VFMR
NXP

S32K116, M0+, FLASH 128K, RAM 17

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote
S32K324EHT1VMMSR
NXP

S32K324 ARM CORTEX-M7, 160 MHZ,

  • Core Processor: ARM® Cortex®-M7
  • Core Size: 32-Bit Dual-Core
  • Speed: 160MHz
  • Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
  • Peripherals: DMA, I2S, Serial Audio, WDT
  • Number of I/O: 218
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 24x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-LFBGA (14x14)
패키지: -
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