페이지 582 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
BC369,112	NXP	TRANS PNP 20V 1A TO-92 Transistor Type: PNP Current - Collector (Ic) (Max): 1A Voltage - Collector Emitter Breakdown (Max): 20V Vce Saturation (Max) @ Ib, Ic: 500mV @ 100mA, 1A Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 500mA, 1V Power - Max: 830mW Frequency - Transition: 140MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	패키지: TO-226-3, TO-92-3 (TO-226AA)	재고5,088
BAP51-04W,115	NXP	DIODE PIN GP 50V 50MA SOT323 Diode Type: PIN - 1 Pair Series Connection Voltage - Peak Reverse (Max): 50V Current - Max: 50mA Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz Power Dissipation (Max): 240mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3	패키지: SC-70, SOT-323	재고4,240
N74F153D,623	NXP	IC MULTIPLEXER DUAL 4IN 16SOIC Type: Multiplexer Circuit: 2 x 4:1 Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고3,648
74HCT2G126DC,125	NXP	IC BUFF DVR TRI-ST DL 8VSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 1 Input Type: - Output Type: Push-Pull Current - Output High, Low: 6mA, 6mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 8-VFSOP (0.091", 2.30mm Width) Supplier Device Package: 8-VSSOP, US8	패키지: 8-VFSOP (0.091", 2.30mm Width)	재고5,040
SC16C850IBS/Q900,5	NXP	IC UART SGL UNIV ASYNC 32HVQFN Features: - Number of Channels: 1, UART FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 5Mbps Voltage - Supply: 2.5 V ~ 3.3 V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	패키지: 32-VFQFN Exposed Pad	재고3,840
MC33978AEK	NXP	IC INTERFACE SW DETECT 32-SOIC Applications: Multiple Switch Detection Interface: SPI Voltage - Supply: 3 V ~ 5.25 V Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	패키지: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	재고15,096
PCA9516AD,112	NXP	IC REDRIVER I2C 5CH 400KHZ 16SO Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 5 Delay Time: - Signal Conditioning: - Capacitance - Input: 6pF Voltage - Supply: 3 V ~ 3.6 V Current - Supply: 5mA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고18,504
SC18IS600IBS,151	NXP	IC SPI TO I2C BUS 24-HVQFN Protocol: I2C Function: Controller Interface: SPI Standards: - Voltage - Supply: 2.4 V ~ 3.6 V Current - Supply: 11mA Operating Temperature: -40°C ~ 85°C Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	패키지: 24-VFQFN Exposed Pad	재고18,102
MPC563CVR40	NXP	IC MCU 32BIT 512KB FLASH 388BGA Core Processor: PowerPC Core Size: 32-Bit Speed: 40MHz Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 32x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	패키지: 388-BBGA	재고2,672
MC9S08PT60AVLF	NXP	IC MCU 8BIT 60KB FLASH 48LQFP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 41 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고3,856
MC9S08AW32CFGER	NXP	IC MCU 8BIT 32KB FLASH 44LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	패키지: 44-LQFP	재고4,736
LPC1102UK,118	NXP	IC MCU 32BIT 32KB FLASH 16WLCSP Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 11 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 5x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-UFBGA, WLCSP Supplier Device Package: -	패키지: 16-UFBGA, WLCSP	재고6,912
ADC1004S040TS/C1:1	NXP	IC ADC 10BIT PAR 40MHZ 28-SSOP Number of Bits: 10 Sampling Rate (Per Second): 40M Number of Inputs: 1 Input Type: Single Ended Data Interface: Parallel Configuration: ADC Ratio - S/H:ADC: - Number of A/D Converters: 1 Architecture: - Reference Type: External Voltage - Supply, Analog: 5V Voltage - Supply, Digital: 5V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 28-SSOP (0.209", 5.30mm Width) Supplier Device Package: 28-SSOP Mounting Type: -	패키지: 28-SSOP (0.209", 5.30mm Width)	재고5,520
BZA868AL,115	NXP	TVS DIODE 6.8VWM 5TSSOP Type: Zener Unidirectional Channels: 4 Bidirectional Channels: - Voltage - Reverse Standoff (Typ): 6.8V Voltage - Breakdown (Min): - Voltage - Clamping (Max) @ Ipp: - Current - Peak Pulse (10/1000µs): - Power - Peak Pulse: 14W Power Line Protection: No Applications: General Purpose Capacitance @ Frequency: 180pF @ 1MHz Operating Temperature: - Mounting Type: Surface Mount Package / Case: 5-TSSOP, SC-70-5, SOT-353 Supplier Device Package: 5-TSSOP	패키지: 5-TSSOP, SC-70-5, SOT-353	재고3,472
MPXHZ6116A6T1	NXP	IC SENSOR IPS ABSOLUTE 8SSOP Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 16.68 PSI (20 kPa ~ 115 kPa) Output Type: Analog Voltage Output: 0.399 V ~ 4.645 V Accuracy: ±1.5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SOIC (0.295", 7.50mm Width) Supplier Device Package: 8-SSOP	패키지: 8-SOIC (0.295", 7.50mm Width)	재고8,874
MMA1211EG	NXP	ACCELEROMETER 169G ANALOG 16SOIC Type: Analog Axis: Z Acceleration Range: ±169g Sensitivity (LSB/g): - Sensitivity (mV/g): 13.33 Bandwidth: 400Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.295", 7.50mm Width)	재고3,456
MPXV8500DK016T1	NXP	IC PRESSURE SENSOR Frequency: 315MHz, 434MHz Applications: TPM (Tire Pressure Monitor) Modulation or Protocol: FSK, OOK Data Rate (Max): - Power - Output: - Current - Transmitting: - Data Interface: PCB, Surface Mount Antenna Connector: PCB, Surface Mount Memory Size: 8kB Flash, 512B SRAM Features: - Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Package / Case: 32-QFN Exposed Pad	패키지: 32-QFN Exposed Pad	재고6,354
MCIMX6U1AVM08AD	NXP	I.MX6 DL ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	패키지: 624-LFBGA	재고6,384
SPC5673FK0MVY2R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 200MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	패키지: 516-BBGA	재고4,560
SP5745BBK1AMMH2R	NXP	32 BIT SINGLE CORE 2M FLASH 1 Core Processor: e200z4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	패키지: 100-LBGA	재고4,432
MC56F8023VLCR	NXP	16-BIT DSC 56800E CORE 32KB FL Core Processor: 56800E Core Size: 16-Bit Speed: 32MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 26 Program Memory Size: 32KB (16K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 6x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고6,944
S9S08DV96F2CLFR	NXP	8-BIT MCU S08 CORE 96KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고2,928
MC9S08SE4MWL	NXP	IC MCU 8BIT 4KB FLASH 28SOIC Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SCI Peripherals: LVD, POR, PWM Number of I/O: 24 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	패키지: 28-SOIC (0.295", 7.50mm Width)	재고6,096
K32L3A60VPJ1AT	NXP	IC MCU 32B 1.25MB FLASH 176VFBGA Core Processor: ARM® Cortex®-M4/M0+ Core Size: 32-Bit Dual-Core Speed: 72MHz Connectivity: FlexIO, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: AC'97, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 104 Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH EEPROM Size: 48K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 176-VFBGA Supplier Device Package: 176-VFBGA (9x9)	패키지: -	Request a Quote
MC33FS8510A3ESR2	NXP	SYSTEM BASIS CHIP FS8510 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
MC33771CTP2AE	NXP	BATTERY CELL CONTROLLER, PREMIUM Function: Battery Cell Controller Battery Chemistry: Lithium Ion Number of Cells: 7 ~ 14 Fault Protection: Over/Under Voltage Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	패키지: -	Request a Quote
SPC5746BSK1AVKU2	NXP	IC MCU 32BIT 3MB FLASH 176LQFP Core Processor: e200z4 Core Size: 32-Bit Single-Core Speed: 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	패키지: -	Request a Quote
MIMX8ML8DVNLZCB	NXP	IC Architecture: DSP, MCU, MPU Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP Flash Size: - RAM Size: 868KB Peripherals: DMA, PWM, WDT Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART Speed: 1.8GHz, 800MHz Primary Attributes: - Operating Temperature: 0°C ~ 95°C (TJ) Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote

BC369,112

NXP

TRANS PNP 20V 1A TO-92

Transistor Type: PNP
Current - Collector (Ic) (Max): 1A
Voltage - Collector Emitter Breakdown (Max): 20V
Vce Saturation (Max) @ Ib, Ic: 500mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 500mA, 1V
Power - Max: 830mW
Frequency - Transition: 140MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

패키지: TO-226-3, TO-92-3 (TO-226AA)

재고5,088

BAP51-04W,115

NXP

DIODE PIN GP 50V 50MA SOT323

Diode Type: PIN - 1 Pair Series Connection
Voltage - Peak Reverse (Max): 50V
Current - Max: 50mA
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz
Power Dissipation (Max): 240mW
Operating Temperature: -65°C ~ 150°C (TJ)
Package / Case: SC-70, SOT-323
Supplier Device Package: SOT-323-3

패키지: SC-70, SOT-323

재고4,240

N74F153D,623

NXP

IC MULTIPLEXER DUAL 4IN 16SOIC

Type: Multiplexer
Circuit: 2 x 4:1
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고3,648

74HCT2G126DC,125

NXP

IC BUFF DVR TRI-ST DL 8VSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 1
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 6mA, 6mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Supplier Device Package: 8-VSSOP, US8

패키지: 8-VFSOP (0.091", 2.30mm Width)

재고5,040

SC16C850IBS/Q900,5

NXP

IC UART SGL UNIV ASYNC 32HVQFN

Features: -
Number of Channels: 1, UART
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Voltage - Supply: 2.5 V ~ 3.3 V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

패키지: 32-VFQFN Exposed Pad

재고3,840

MC33978AEK

NXP

IC INTERFACE SW DETECT 32-SOIC

Applications: Multiple Switch Detection
Interface: SPI
Voltage - Supply: 3 V ~ 5.25 V
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

패키지: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

재고15,096

PCA9516AD,112

NXP

IC REDRIVER I2C 5CH 400KHZ 16SO

Type: Buffer, ReDriver
Applications: I2C
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 400kHz
Number of Channels: 5
Delay Time: -
Signal Conditioning: -
Capacitance - Input: 6pF
Voltage - Supply: 3 V ~ 3.6 V
Current - Supply: 5mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고18,504

SC18IS600IBS,151

NXP

IC SPI TO I2C BUS 24-HVQFN

Protocol: I2C
Function: Controller
Interface: SPI
Standards: -
Voltage - Supply: 2.4 V ~ 3.6 V
Current - Supply: 11mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (4x4)

패키지: 24-VFQFN Exposed Pad

재고18,102

MPC563CVR40

NXP

IC MCU 32BIT 512KB FLASH 388BGA

Core Processor: PowerPC
Core Size: 32-Bit
Speed: 40MHz
Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
Data Converters: A/D 32x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 388-BBGA
Supplier Device Package: 388-PBGA (27x27)

패키지: 388-BBGA

재고2,672

MC9S08PT60AVLF

NXP

IC MCU 8BIT 60KB FLASH 48LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 41
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고3,856

MC9S08AW32CFGER

NXP

IC MCU 8BIT 32KB FLASH 44LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

패키지: 44-LQFP

재고4,736

LPC1102UK,118

NXP

IC MCU 32BIT 32KB FLASH 16WLCSP

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 11
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 5x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-UFBGA, WLCSP
Supplier Device Package: -

패키지: 16-UFBGA, WLCSP

재고6,912

ADC1004S040TS/C1:1

NXP

IC ADC 10BIT PAR 40MHZ 28-SSOP

Number of Bits: 10
Sampling Rate (Per Second): 40M
Number of Inputs: 1
Input Type: Single Ended
Data Interface: Parallel
Configuration: ADC
Ratio - S/H:ADC: -
Number of A/D Converters: 1
Architecture: -
Reference Type: External
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Features: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 28-SSOP
Mounting Type: -

패키지: 28-SSOP (0.209", 5.30mm Width)

재고5,520

BZA868AL,115

NXP

TVS DIODE 6.8VWM 5TSSOP

Type: Zener
Unidirectional Channels: 4
Bidirectional Channels: -
Voltage - Reverse Standoff (Typ): 6.8V
Voltage - Breakdown (Min): -
Voltage - Clamping (Max) @ Ipp: -
Current - Peak Pulse (10/1000µs): -
Power - Peak Pulse: 14W
Power Line Protection: No
Applications: General Purpose
Capacitance @ Frequency: 180pF @ 1MHz
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Supplier Device Package: 5-TSSOP

패키지: 5-TSSOP, SC-70-5, SOT-353

재고3,472

MPXHZ6116A6T1

NXP

IC SENSOR IPS ABSOLUTE 8SSOP

Pressure Type: Absolute
Operating Pressure: 2.9 PSI ~ 16.68 PSI (20 kPa ~ 115 kPa)
Output Type: Analog Voltage
Output: 0.399 V ~ 4.645 V
Accuracy: ±1.5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 8-SSOP

패키지: 8-SOIC (0.295", 7.50mm Width)

재고8,874

MMA1211EG

NXP

ACCELEROMETER 169G ANALOG 16SOIC

Type: Analog
Axis: Z
Acceleration Range: ±169g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 13.33
Bandwidth: 400Hz
Output Type: Analog Voltage
Voltage - Supply: 4.75 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.295", 7.50mm Width)

재고3,456

MPXV8500DK016T1

NXP

IC PRESSURE SENSOR

Frequency: 315MHz, 434MHz
Applications: TPM (Tire Pressure Monitor)
Modulation or Protocol: FSK, OOK
Data Rate (Max): -
Power - Output: -
Current - Transmitting: -
Data Interface: PCB, Surface Mount
Antenna Connector: PCB, Surface Mount
Memory Size: 8kB Flash, 512B SRAM
Features: -
Voltage - Supply: 2.3 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C
Package / Case: 32-QFN Exposed Pad

패키지: 32-QFN Exposed Pad

재고6,354

MCIMX6U1AVM08AD

NXP

I.MX6 DL ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

패키지: 624-LFBGA

재고6,384

SPC5673FK0MVY2R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z7
Core Size: 32-Bit
Speed: 200MHz
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Number of I/O: 32
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
Data Converters: A/D 64x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

패키지: 516-BBGA

재고4,560

SP5745BBK1AMMH2R

NXP

32 BIT SINGLE CORE 2M FLASH 1

Core Processor: e200z4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LBGA
Supplier Device Package: 100-MAPBGA (11x11)

패키지: 100-LBGA

재고4,432

MC56F8023VLCR

NXP

16-BIT DSC 56800E CORE 32KB FL

Core Processor: 56800E
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 32KB (16K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 16
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 6x12b; D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고6,944

S9S08DV96F2CLFR

NXP

8-BIT MCU S08 CORE 96KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고2,928

MC9S08SE4MWL

NXP

IC MCU 8BIT 4KB FLASH 28SOIC

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Number of I/O: 24
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

패키지: 28-SOIC (0.295", 7.50mm Width)

재고6,096

K32L3A60VPJ1AT

NXP

IC MCU 32B 1.25MB FLASH 176VFBGA

Core Processor: ARM® Cortex®-M4/M0+
Core Size: 32-Bit Dual-Core
Speed: 72MHz
Connectivity: FlexIO, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: AC'97, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: 104
Program Memory Size: 1.25MB (1.25M x 8)
Program Memory Type: FLASH
EEPROM Size: 48K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-VFBGA
Supplier Device Package: 176-VFBGA (9x9)

패키지: -

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MC33FS8510A3ESR2

NXP

SYSTEM BASIS CHIP FS8510

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

MC33771CTP2AE

NXP

BATTERY CELL CONTROLLER, PREMIUM

Function: Battery Cell Controller
Battery Chemistry: Lithium Ion
Number of Cells: 7 ~ 14
Fault Protection: Over/Under Voltage
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

패키지: -

Request a Quote

SPC5746BSK1AVKU2

NXP

IC MCU 32BIT 3MB FLASH 176LQFP

Core Processor: e200z4
Core Size: 32-Bit Single-Core
Speed: 160MHz
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

패키지: -

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MIMX8ML8DVNLZCB

NXP

IC

Architecture: DSP, MCU, MPU
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Flash Size: -
RAM Size: 868KB
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Speed: 1.8GHz, 800MHz
Primary Attributes: -
Operating Temperature: 0°C ~ 95°C (TJ)
Package / Case: -
Supplier Device Package: -

패키지: -

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