페이지 621 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
PDTD123YS,126	NXP	TRANS PREBIAS NPN 500MW TO92-3 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 2.2k Resistor - Emitter Base (R2) (Ohms): 10k DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA Frequency - Transition: - Power - Max: 500mW Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	재고7,888
PDTB123TK,115	NXP	TRANS PREBIAS PNP 250MW SMT3 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 2.2k Resistor - Emitter Base (R2) (Ohms): - DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	패키지: TO-236-3, SC-59, SOT-23-3	재고4,816
BZX284-B11,115	NXP	DIODE ZENER 11V 400MW SOD2 Voltage - Zener (Nom) (Vz): 11V Tolerance: ±2% Power - Max: 400mW Impedance (Max) (Zzt): 10 Ohms Current - Reverse Leakage @ Vr: 100nA @ 8V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	패키지: SOD-110	재고5,776
N74F158AD,602	NXP	IC DATA SELECTOR/MUX 2IN 16SOIC Type: Multiplexer Circuit: 4 x 2:1 Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고6,112
N74F02N,602	NXP	IC GATE NOR 4CH 2-INP 14-DIP Logic Type: NOR Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): - Current - Output High, Low: 1mA, 20mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF Operating Temperature: 0°C ~ 70°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	패키지: 14-DIP (0.300", 7.62mm)	재고2,016
HEF40374BP,652	NXP	IC D-TYPE POS TRG SNGL 20DIP Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 17MHz Max Propagation Delay @ V, Max CL: 80ns @ 15V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 50mA, 62mA Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Iq): - Input Capacitance: - Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm)	패키지: 20-DIP (0.300", 7.62mm)	재고3,968
TDA9995HL/C1,518	NXP	HDMI SW 3:1 EQUALIZER 100LQFP Type: HDMI 1.3 Smart Switch Applications: TV Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고4,064
SC16C750BIA44,518	NXP	IC UART SINGLE W/FIFO 44-PLCC Features: - Number of Channels: 1, UART FIFO's: 64 Byte Protocol: - Data Rate (Max): 3Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	패키지: 44-LCC (J-Lead)	재고2,512
SC16C654BIBM,128	NXP	IC QUAD UART 64BYTE 64LQFP Features: - Number of Channels: 4, QUART FIFO's: 64 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (7x7)	패키지: 64-LQFP	재고2,832
MPC8313VRAFFB	NXP	IC MPU MPC83XX 333MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	패키지: 516-BBGA Exposed Pad	재고15,168
MC7448HX1000NC	NXP	IC MPU MPC74XX 1.0GHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	패키지: 360-BCBGA, FCCBGA	재고5,952
MPC8323VRADDCA	NXP	IC MPU MPC83XX 266MHZ 516BGA Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	패키지: 516-BBGA	재고2,112
PK60N512VLL100	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 19x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고7,936
MCF5282CVM80J	NXP	IC MCU 32BIT 512KB FLASH 256BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 150 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	패키지: 256-LBGA	재고4,800
MC56F8247MLH	NXP	IC MCU 16BIT 48KB FLASH 64LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 60MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 48KB (24K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 16x12b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고7,824
MC9S08SL8CTL	NXP	IC MCU 8BIT 8KB FLASH 28TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	패키지: 28-TSSOP (0.173", 4.40mm Width)	재고5,616
MKL13Z64VLH4	NXP	IC MCU 32BIT 64KB FLASH 64LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART Peripherals: DMA, PWM, WDT Number of I/O: 54 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 20x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고7,392
MC9RS08KA8CPG	NXP	IC MCU 8BIT 8KB FLASH 16DIP Core Processor: RS08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 254 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	패키지: 16-DIP (0.300", 7.62mm)	재고4,608
PCT2075TP,147	NXP	SENSOR TEMP I2C/SMBUS 8HWSON Sensor Type: Digital, Local Sensing Temperature - Local: -55°C ~ 125°C Sensing Temperature - Remote: - Output Type: I2C/SMBus Voltage - Supply: 2.7 V ~ 5.5 V Resolution: 10 b Features: Output Switch, Programmable Limit Accuracy - Highest (Lowest): ±1°C (±2°C) Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-WFDFN Exposed Pad Supplier Device Package: 8-HWSON (2x3)	패키지: 8-WFDFN Exposed Pad	재고91,482
NCF2971ETT/T0E080J	NXP	IC REMOTE KEYLESS ENTRY 38TSSOP Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	패키지: -	재고4,122
SPC5603BK0CLL4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 28K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고7,344
S9S12GA128AMLF	NXP	12-BIT ADC SPE TST SCREE Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고5,760
S9S12ZVL8F0CLF	NXP	MAGNIV 16-BIT MCU S12Z CORE 8K Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고5,040
SAF7755HV/N205K	NXP	DSP AUDIO MULTI-TUNER Type: Audio, Car Signal Processor Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24x24)	패키지: 176-LQFP Exposed Pad	재고7,968
TJR1462BTK-0Z	NXP	IC 8HVSON Type: - Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	패키지: -	Request a Quote
SAF4000EL-101Z43AK	NXP	SAF4000EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
FS32V234CON2VUBR	NXP	IC MPU FS32V23 1GHZ 621FCPBGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE SATA: - USB: - Voltage - I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17x17)	패키지: -	Request a Quote
MC33GD3100B3EK	NXP	GATE DRIVERS HV ISOLATED GATE DR Driven Configuration: Half-Bridge Channel Type: Single Number of Drivers: 1 Gate Type: IGBT, N-Channel MOSFET Voltage - Supply: 3.3V Logic Voltage - VIL, VIH: - Current - Peak Output (Source, Sink): 15A, 15A Input Type: - High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	패키지: -	재고126

PDTD123YS,126

NXP

TRANS PREBIAS NPN 500MW TO92-3

Transistor Type: NPN - Pre-Biased
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 2.2k
Resistor - Emitter Base (R2) (Ohms): 10k
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
Frequency - Transition: -
Power - Max: 500mW
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

재고7,888

PDTB123TK,115

NXP

TRANS PREBIAS PNP 250MW SMT3

Transistor Type: PNP - Pre-Biased
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 2.2k
Resistor - Emitter Base (R2) (Ohms): -
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
Frequency - Transition: -
Power - Max: 250mW
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

패키지: TO-236-3, SC-59, SOT-23-3

재고4,816

BZX284-B11,115

NXP

DIODE ZENER 11V 400MW SOD2

Voltage - Zener (Nom) (Vz): 11V
Tolerance: ±2%
Power - Max: 400mW
Impedance (Max) (Zzt): 10 Ohms
Current - Reverse Leakage @ Vr: 100nA @ 8V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

패키지: SOD-110

재고5,776

N74F158AD,602

NXP

IC DATA SELECTOR/MUX 2IN 16SOIC

Type: Multiplexer
Circuit: 4 x 2:1
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고6,112

N74F02N,602

NXP

IC GATE NOR 4CH 2-INP 14-DIP

Logic Type: NOR Gate
Number of Circuits: 4
Number of Inputs: 2
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): -
Current - Output High, Low: 1mA, 20mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
Operating Temperature: 0°C ~ 70°C
Mounting Type: Through Hole
Supplier Device Package: 14-DIP
Package / Case: 14-DIP (0.300", 7.62mm)

패키지: 14-DIP (0.300", 7.62mm)

재고2,016

HEF40374BP,652

NXP

IC D-TYPE POS TRG SNGL 20DIP

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 1
Number of Bits per Element: 8
Clock Frequency: 17MHz
Max Propagation Delay @ V, Max CL: 80ns @ 15V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 50mA, 62mA
Voltage - Supply: 3 V ~ 15 V
Current - Quiescent (Iq): -
Input Capacitance: -
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)

패키지: 20-DIP (0.300", 7.62mm)

재고3,968

TDA9995HL/C1,518

NXP

HDMI SW 3:1 EQUALIZER 100LQFP

Type: HDMI 1.3 Smart Switch
Applications: TV
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고4,064

SC16C750BIA44,518

NXP

IC UART SINGLE W/FIFO 44-PLCC

Features: -
Number of Channels: 1, UART
FIFO's: 64 Byte
Protocol: -
Data Rate (Max): 3Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: -
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

패키지: 44-LCC (J-Lead)

재고2,512

SC16C654BIBM,128

NXP

IC QUAD UART 64BYTE 64LQFP

Features: -
Number of Channels: 4, QUART
FIFO's: 64 Byte
Protocol: -
Data Rate (Max): 5Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (7x7)

패키지: 64-LQFP

재고2,832

MPC8313VRAFFB

NXP

IC MPU MPC83XX 333MHZ 516BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 333MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

패키지: 516-BBGA Exposed Pad

재고15,168

MC7448HX1000NC

NXP

IC MPU MPC74XX 1.0GHZ 360FCCBGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-BCBGA, FCCBGA
Supplier Device Package: 360-FCCBGA (25x25)

패키지: 360-BCBGA, FCCBGA

재고5,952

MPC8323VRADDCA

NXP

IC MPU MPC83XX 266MHZ 516BGA

Core Processor: PowerPC e300c2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

패키지: 516-BBGA

재고2,112

PK60N512VLL100

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 66
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 19x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고7,936

MCF5282CVM80J

NXP

IC MCU 32BIT 512KB FLASH 256BGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 150
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

패키지: 256-LBGA

재고4,800

MC56F8247MLH

NXP

IC MCU 16BIT 48KB FLASH 64LQFP

Core Processor: 56800E
Core Size: 16-Bit
Speed: 60MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 48KB (24K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 16
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 16x12b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고7,824

MC9S08SL8CTL

NXP

IC MCU 8BIT 8KB FLASH 28TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 22
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

패키지: 28-TSSOP (0.173", 4.40mm Width)

재고5,616

MKL13Z64VLH4

NXP

IC MCU 32BIT 64KB FLASH 64LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Number of I/O: 54
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 20x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고7,392

MC9RS08KA8CPG

NXP

IC MCU 8BIT 8KB FLASH 16DIP

Core Processor: RS08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 254 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

패키지: 16-DIP (0.300", 7.62mm)

재고4,608

PCT2075TP,147

NXP

SENSOR TEMP I2C/SMBUS 8HWSON

Sensor Type: Digital, Local
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -
Output Type: I2C/SMBus
Voltage - Supply: 2.7 V ~ 5.5 V
Resolution: 10 b
Features: Output Switch, Programmable Limit
Accuracy - Highest (Lowest): ±1°C (±2°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-WFDFN Exposed Pad
Supplier Device Package: 8-HWSON (2x3)

패키지: 8-WFDFN Exposed Pad

재고91,482

NCF2971ETT/T0E080J

NXP

IC REMOTE KEYLESS ENTRY 38TSSOP

Type: -
Frequency: -
Standards: -
Interface: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고4,122

SPC5603BK0CLL4

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 28K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고7,344

S9S12GA128AMLF

NXP

12-BIT ADC SPE TST SCREE

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고5,760

S9S12ZVL8F0CLF

NXP

MAGNIV 16-BIT MCU S12Z CORE 8K

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고5,040

SAF7755HV/N205K

NXP

DSP AUDIO MULTI-TUNER

Type: Audio, Car Signal Processor
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-HLQFP (24x24)

패키지: 176-LQFP Exposed Pad

재고7,968

TJR1462BTK-0Z

NXP

IC 8HVSON

Type: -
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Supplier Device Package: 8-HVSON (3x3)

패키지: -

Request a Quote

SAF4000EL-101Z43AK

NXP

SAF4000EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

FS32V234CON2VUBR

NXP

IC MPU FS32V23 1GHZ 621FCPBGA

Core Processor: ARM® Cortex®-A53
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Speed: 1GHz
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet: GbE
SATA: -
USB: -
Voltage - I/O: 1V, 1.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Package / Case: 621-FBGA, FCBGA
Supplier Device Package: 621-FCPBGA (17x17)

패키지: -

Request a Quote

MC33GD3100B3EK

NXP

GATE DRIVERS HV ISOLATED GATE DR

Driven Configuration: Half-Bridge
Channel Type: Single
Number of Drivers: 1
Gate Type: IGBT, N-Channel MOSFET
Voltage - Supply: 3.3V
Logic Voltage - VIL, VIH: -
Current - Peak Output (Source, Sink): 15A, 15A
Input Type: -
High Side Voltage - Max (Bootstrap): -
Rise / Fall Time (Typ): -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC

패키지: -

재고126