페이지 640 - NXP 제품 | Heisener Electronics
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NXP 제품

기록 26,590
페이지  640/950
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BSP254A,126
NXP

MOSFET P-CH 250V 0.2A SOT54

  • FET Type: P-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 250V
  • Current - Continuous Drain (Id) @ 25°C: 200mA (Ta)
  • Drive Voltage (Max Rds On, Min Rds On): 10V
  • Vgs(th) (Max) @ Id: 2.8V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: -
  • Input Capacitance (Ciss) (Max) @ Vds: 90pF @ 25V
  • Vgs (Max): 20V
  • FET Feature: -
  • Power Dissipation (Max): 1W (Ta)
  • Rds On (Max) @ Id, Vgs: 15 Ohm @ 200mA, 10V
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Through Hole
  • Supplier Device Package: TO-92-3
  • Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
재고2,064
AFT23H200-4S2LR6
NXP

FET RF 2CH 65V 2.3GHZ NI1230-4

  • Transistor Type: LDMOS (Dual)
  • Frequency: 2.3GHz
  • Gain: 15.3dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 500mA
  • Power - Output: 45W
  • Voltage - Rated: 65V
  • Package / Case: NI-1230-4LS2L
  • Supplier Device Package: NI-1230-4LS2L
패키지: NI-1230-4LS2L
재고3,872
2PB709AQ,115
NXP

TRANS PNP 45V 0.1A SC59

  • Transistor Type: PNP
  • Current - Collector (Ic) (Max): 100mA
  • Voltage - Collector Emitter Breakdown (Max): 45V
  • Vce Saturation (Max) @ Ib, Ic: 500mV @ 10mA, 100mA
  • Current - Collector Cutoff (Max): 10nA (ICBO)
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 2mA, 10V
  • Power - Max: 250mW
  • Frequency - Transition: 60MHz
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
패키지: TO-236-3, SC-59, SOT-23-3
재고7,504
SSTU32864EC/G,557
NXP

IC 25BIT CONFIG REG BUFF 96LFBGA

  • Logic Type: 1:1, 1:2 Configurable Registered Buffer
  • Supply Voltage: 1.7 V ~ 1.9 V
  • Number of Bits: 25, 14
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 96-LFBGA
  • Supplier Device Package: 96-LFBGA (13.5x5.5)
패키지: 96-LFBGA
재고6,000
TDF8546TH/N2,118
NXP

IC AMP AUDIO BTL 36HSOP

  • Type: Class AB
  • Output Type: 4-Channel (Quad)
  • Max Output Power x Channels @ Load: 64W x 4 @ 2 Ohm
  • Voltage - Supply: 6 V ~ 18 V
  • Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type: Surface Mount
  • Operating Temperature: -
  • Supplier Device Package: 36-HSOP
  • Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
패키지: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
재고5,232
UJA1061TW/3V3/C/T/
NXP

IC CAN/LIN FAIL-SAFE HS 32HTSSOP

  • Applications: Automotive Networking
  • Interface: CAN, LIN
  • Voltage - Supply: 5.5 V ~ 27 V
  • Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
  • Supplier Device Package: 32-HTSSOP
  • Mounting Type: Surface Mount
패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
재고7,648
PCF8575CTS/1,112
NXP

IC I/O EXPANDER I2C 16B 24SSOP

  • Number of I/O: 16
  • Interface: I2C
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 10mA, 25mA
  • Clock Frequency: 400kHz
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 24-SSOP
패키지: 24-SSOP (0.209", 5.30mm Width)
재고19,428
TJA1055T/CM,118
NXP

IC TXRX CAN ENH FAULT-TOL 14SOIC

  • Type: Transceiver
  • Protocol: CAN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: -
  • Data Rate: -
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 14-SO
패키지: 14-SOIC (0.154", 3.90mm Width)
재고7,488
MPC8378ECVRANG
NXP

IC MPU MPC83XX 800MHZ 689TEBGA

  • Core Processor: PowerPC e300c4s
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Security; SEC 3.0
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
패키지: 689-BBGA Exposed Pad
재고4,096
KMC8360CVVAJDGA
NXP

IC MPU MPC83XX 533MHZ 740TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 740-LBGA
  • Supplier Device Package: 740-TBGA (37.5x37.5)
패키지: 740-LBGA
재고2,224
KMPC8543EVUAQG
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Signal Processing; SPE, Security; SEC
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
패키지: 783-BBGA, FCBGA
재고5,328
KMPC8547VUAUJ
NXP

IC MPU MPC85XX 1.333GHZ 783BGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.333GHz
  • Co-Processors/DSP: Signal Processing; SPE
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
패키지: 783-BBGA, FCBGA
재고5,200
MPC8308CZQAFDA
NXP

IC MPU MPC83XX 333MHZ 473MAPBGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 333MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
패키지: 473-LFBGA
재고3,552
hot MCF52258CVN66
NXP

IC MCU 32BIT 512KB FLASH 144BGA

  • Core Processor: Coldfire V2
  • Core Size: 32-Bit
  • Speed: 66MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 96
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LBGA
  • Supplier Device Package: 144-MAPBGA (13x13)
패키지: 144-LBGA
재고12,012
SPC5604CF2MLL6
NXP

IC MCU 32BIT 512KB FLASH 100LQFP

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 79
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 16
  • RAM Size: 48K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 28x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
패키지: 100-LQFP
재고5,344
S9S08SG4E2CTJR
NXP

IC MCU 8BIT 4KB FLASH 20TSSOP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 16
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
패키지: 20-TSSOP (0.173", 4.40mm Width)
재고3,088
hot MCF5232CVM100
NXP

IC MCU 32BIT ROMLESS 196MAPBGA

  • Core Processor: Coldfire V2
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART
  • Peripherals: DMA, WDT
  • Number of I/O: 97
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 196-LBGA
  • Supplier Device Package: 196-MAPBGA (15x15)
패키지: 196-LBGA
재고14,724
LPC11E12FBD48/201,
NXP

IC MCU 32BIT 16KB FLASH 48LQFP

  • Core Processor: ARM? Cortex?-M0
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 40
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1K x 8
  • RAM Size: 6K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP
재고7,992
MKE04Z8VFK4
NXP

IC MCU 32BIT 8KB FLASH 24QFN

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: LVD, PWM, WDT
  • Number of I/O: 22
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 12x12b, D/A 2x6b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-QFN (4x4)
패키지: 24-VFQFN Exposed Pad
재고9,636
MKV46F256VLL16
NXP

IC MCU 32BIT 256KB FLASH 100LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 168MHz
  • Connectivity: CAN, I2C, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 74
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 38x12b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
패키지: 100-LQFP
재고7,792
MK22DN512VLH5
NXP

IC MCU 32BIT 512KB FLASH 64LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 18x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
패키지: 64-LQFP
재고6,012
MK10DX32VFM5
NXP

IC MCU 32BIT 32KB FLASH 32QFN

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 24
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 10x16b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-QFN Exposed Pad (5x5)
패키지: 32-VFQFN Exposed Pad
재고8,268
MSC8157TAG1000A
NXP

IC DSP 6X 1GHZ SC3850 783FCBGA

  • Type: SC3850 Six Core
  • Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
  • Clock Rate: 1GHz
  • Non-Volatile Memory: ROM (96 kB)
  • On-Chip RAM: 6.375MB
  • Voltage - I/O: 1.0V, 1.5V, 2.5V
  • Voltage - Core: 1.00V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
패키지: 783-BBGA, FCBGA
재고5,280
PCK940LBD,151
NXP

IC CLK BUFFER 1:18 250MHZ 32LQFP

  • Type: Fanout Buffer (Distribution), Multiplexer
  • Number of Circuits: 1
  • Ratio - Input:Output: 1:18
  • Differential - Input:Output: Yes/Yes
  • Input: LVCMOS, LVPECL
  • Output: LVCMOS
  • Frequency - Max: 250MHz
  • Voltage - Supply: 2.375 V ~ 3.465 V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
패키지: 32-LQFP
재고5,168
MC34932SEKR2
NXP

H-BRIDGE DUAL BRUSHED DC & STE

  • Motor Type - Stepper: -
  • Motor Type - AC, DC: -
  • Function: -
  • Output Configuration: -
  • Interface: -
  • Technology: -
  • Step Resolution: -
  • Applications: -
  • Current - Output: -
  • Voltage - Supply: -
  • Voltage - Load: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고7,680
MIMXRT117TCVM8A
NXP

IC MCU 32BIT EXT MEM 289LFBGA

  • Core Processor: ARM® Cortex®-M4, Cortex®-M7
  • Core Size: 32-Bit Dual-Core
  • Speed: 400MHz, 800MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
  • Number of I/O: 13
  • Program Memory Size: -
  • Program Memory Type: External Program Memory
  • EEPROM Size: -
  • RAM Size: 2M x 8
  • Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
  • Data Converters: A/D 20x12b SAR; D/A 1x12b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 289-LFBGA
  • Supplier Device Package: 289-LFBGA (14x14)
패키지: -
Request a Quote
S912ZVLA96ACLC
NXP

S12Z CPU, 96K FLASH

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 19
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
  • Data Converters: A/D 6x10b, 6x12b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
패키지: -
Request a Quote
MVR5510AMBANES
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
패키지: -
Request a Quote