페이지 670 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
PDTA115EE,115	NXP	TRANS PREBIAS PNP 150MW SC75 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 20mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 100k Resistor - Emitter Base (R2) (Ohms): 100k DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 150mW Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	패키지: SC-75, SOT-416	재고4,592
PZM8.2NB2,115	NXP	DIODE ZENER 8.2V 300MW SMT3 Voltage - Zener (Nom) (Vz): 8.2V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 10 Ohms Current - Reverse Leakage @ Vr: 700nA @ 5V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	패키지: TO-236-3, SC-59, SOT-23-3	재고5,520
MC44BS374T1AEFR2	NXP	IC AUDIO/VIDEO MODULATOR 16-SOIC Type: NTSC/PAL Modulator Applications: Audio/Video, VCR's, Set-Top Boxes Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.154", 3.90mm Width)	재고3,056
MC33883DW	NXP	IC H-BRIDGE PRE-DRIVER 20-SOIC Driven Configuration: Half-Bridge Channel Type: Independent Number of Drivers: 4 Gate Type: N-Channel MOSFET Voltage - Supply: 5.5 V ~ 28 V Logic Voltage - VIL, VIH: 0.8V, 2V Current - Peak Output (Source, Sink): 1A, 1A Input Type: Non-Inverting High Side Voltage - Max (Bootstrap): 55V Rise / Fall Time (Typ): 80ns, 80ns Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	패키지: 20-SOIC (0.295", 7.50mm Width)	재고24,360
74LV153D,112	NXP	IC DUAL 4-IN MUX 16-SOIC Type: Multiplexer Circuit: 2 x 4:1 Independent Circuits: 1 Current - Output High, Low: 6mA, 6mA Voltage Supply Source: Single Supply Voltage - Supply: 1 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고4,000
TDA8541T/N1,112	NXP	IC AMP AUDIO PWR 1.2W MONO 8SOIC Type: Class AB Output Type: 1-Channel (Mono) Max Output Power x Channels @ Load: 1.2W x 1 @ 8 Ohm Voltage - Supply: 2.2 V ~ 18 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 8-SO Package / Case: 8-SOIC (0.154", 3.90mm Width)	패키지: 8-SOIC (0.154", 3.90mm Width)	재고5,392
PCA9541D/02,112	NXP	IC I2C 2:1 SELECTOR 16SOIC Applications: 2-Channel I2C Multiplexer Interface: I2C, SMBus Voltage - Supply: 2.3 V ~ 5.5 V Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO Mounting Type: Surface Mount	패키지: 16-SOIC (0.154", 3.90mm Width)	재고4,944
PTN3332D,118	NXP	IC DIFF LINE RCVR 16SOIC Type: Driver Protocol: LVDS Number of Drivers/Receivers: 4/0 Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고7,504
LS101MAXE7DFA	NXP	IC PROCESSOR DUAL CORE Core Processor: ARM1136JF-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 650MHz Co-Processors/DSP: - RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 448-FBGA Exposed Pad Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)	패키지: 448-FBGA Exposed Pad	재고4,384
MPC8379VRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (4) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고3,936
XPC850DEZT50BU	NXP	IC MPU MPC8XX 50MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23)	패키지: 256-BGA	재고43,344
KM68LC302AF20VCT	NXP	IC MPU M683XX 20MHZ 100LQFP Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 20MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고7,168
P2041NSN7MMC	NXP	IC MPU Q OR IQ 1.2GHZ 780FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FCPBGA (23x23)	패키지: 780-BBGA, FCBGA	재고6,480
SPC5606SF2VLU6	NXP	IC MCU 32BIT 1MB FLASH 176LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Number of I/O: 136 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	패키지: 176-LQFP	재고5,040
MC9S12XDG128MAA	NXP	IC MCU 16BIT 128KB FLASH 80QFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	패키지: 80-QFP	재고12,552
MK20DX32VMP5	NXP	IC MCU 32BIT 32KB FLASH 64MAPBGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 13x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LFBGA Supplier Device Package: 64-MAPBGA (5x5)	패키지: 64-LFBGA	재고3,680
LPC1114FBD48/301,1	NXP	IC MCU 32BIT 32KB FLASH 48LQFP Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 42 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고14,688
MPX4400A	NXP	SENSOR ABS PRESS 56.6 PSI MAX Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 58.02 PSI (20 kPa ~ 400 kPa) Output Type: Analog Voltage Output: - Accuracy: ±1.5% Voltage - Supply: 4.85 V ~ 5.35 V Port Size: - Port Style: - Features: - Termination Style: - Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: - Supplier Device Package: -	패키지: -	재고5,994
TDA1575T/V2,118	NXP	IC FM FRONT END CIRC 16SOIC Frequency: 76MHz ~ 90MHz, 87.5MHz ~ 108MHz Sensitivity: - Data Rate (Max): - Modulation or Protocol: FM Applications: FM Radio Receiver Current - Receiving: 23mA Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 7 V ~ 10 V Operating Temperature: -40°C ~ 85°C Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고6,048
MW4IC2230MBR1	NXP	IC PWR AMP RF 28V 30W TO-272-16 Frequency: 1.6GHz ~ 2.4GHz P1dB: - Gain: 31dB Noise Figure: - RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Current - Supply: 60mA Test Frequency: - Package / Case: TO-272-16 Variant, Flat Leads Supplier Device Package: TO-272 WB-16	패키지: TO-272-16 Variant, Flat Leads	재고4,950
FS32R274KBK2VMM	NXP	2M FLASH 1.5MB SRAM 2X Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Speed: 180MHz, 240MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 1.5M x 8 Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	패키지: 257-LFBGA	재고7,088
SPC5604SF2CLQ6	NXP	32BIT 512K FLASH 48K RAM Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Number of I/O: 105 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고4,384
S9S08RNA32W1VLC	NXP	8-BIT MCU S08 CORE 32KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고45,000
S32K310NHT0MLFST	NXP	IC Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Number of I/O: 42 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 112K x 8 Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: -	Request a Quote
FG32K118LFT0MLHR	NXP	IC Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
S32G399ASCK1VUCR	NXP	8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 2.5Gbps (3) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	패키지: -	Request a Quote
SE050E2HQ1-Z01Z3Z	NXP	IC PLUG/TRUST SEC ELEM 20HX2QFN Type: Plug and Trust Secure Element Applications: - Mounting Type: Surface Mount Package / Case: 20-XFQFN Exposed Pad Supplier Device Package: 20-HX2QFN (3x3)	패키지: -	재고2,070
MC33FS4507NAER2	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	패키지: -	Request a Quote

PDTA115EE,115

NXP

TRANS PREBIAS PNP 150MW SC75

Transistor Type: PNP - Pre-Biased
Current - Collector (Ic) (Max): 20mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 100k
Resistor - Emitter Base (R2) (Ohms): 100k
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 150mW
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

패키지: SC-75, SOT-416

재고4,592

PZM8.2NB2,115

NXP

DIODE ZENER 8.2V 300MW SMT3

Voltage - Zener (Nom) (Vz): 8.2V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 10 Ohms
Current - Reverse Leakage @ Vr: 700nA @ 5V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

패키지: TO-236-3, SC-59, SOT-23-3

재고5,520

MC44BS374T1AEFR2

NXP

IC AUDIO/VIDEO MODULATOR 16-SOIC

Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.154", 3.90mm Width)

재고3,056

MC33883DW

NXP

IC H-BRIDGE PRE-DRIVER 20-SOIC

Driven Configuration: Half-Bridge
Channel Type: Independent
Number of Drivers: 4
Gate Type: N-Channel MOSFET
Voltage - Supply: 5.5 V ~ 28 V
Logic Voltage - VIL, VIH: 0.8V, 2V
Current - Peak Output (Source, Sink): 1A, 1A
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 55V
Rise / Fall Time (Typ): 80ns, 80ns
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

패키지: 20-SOIC (0.295", 7.50mm Width)

재고24,360

74LV153D,112

NXP

IC DUAL 4-IN MUX 16-SOIC

Type: Multiplexer
Circuit: 2 x 4:1
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Voltage Supply Source: Single Supply
Voltage - Supply: 1 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고4,000

TDA8541T/N1,112

NXP

IC AMP AUDIO PWR 1.2W MONO 8SOIC

Type: Class AB
Output Type: 1-Channel (Mono)
Max Output Power x Channels @ Load: 1.2W x 1 @ 8 Ohm
Voltage - Supply: 2.2 V ~ 18 V
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-SO
Package / Case: 8-SOIC (0.154", 3.90mm Width)

패키지: 8-SOIC (0.154", 3.90mm Width)

재고5,392

PCA9541D/02,112

NXP

IC I2C 2:1 SELECTOR 16SOIC

Applications: 2-Channel I2C Multiplexer
Interface: I2C, SMBus
Voltage - Supply: 2.3 V ~ 5.5 V
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO
Mounting Type: Surface Mount

패키지: 16-SOIC (0.154", 3.90mm Width)

재고4,944

PTN3332D,118

NXP

IC DIFF LINE RCVR 16SOIC

Type: Driver
Protocol: LVDS
Number of Drivers/Receivers: 4/0
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고7,504

LS101MAXE7DFA

NXP

IC PROCESSOR DUAL CORE

Core Processor: ARM1136JF-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 650MHz
Co-Processors/DSP: -
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 448-FBGA Exposed Pad
Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)

패키지: 448-FBGA Exposed Pad

재고4,384

MPC8379VRALG

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (4)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고3,936

XPC850DEZT50BU

NXP

IC MPU MPC8XX 50MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BGA
Supplier Device Package: 256-PBGA (23x23)

패키지: 256-BGA

재고43,344

KM68LC302AF20VCT

NXP

IC MPU M683XX 20MHZ 100LQFP

Core Processor: M68000
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Speed: 20MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고7,168

P2041NSN7MMC

NXP

IC MPU Q OR IQ 1.2GHZ 780FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FCPBGA (23x23)

패키지: 780-BBGA, FCBGA

재고6,480

SPC5606SF2VLU6

NXP

IC MCU 32BIT 1MB FLASH 176LQFP

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Number of I/O: 136
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

패키지: 176-LQFP

재고5,040

MC9S12XDG128MAA

NXP

IC MCU 16BIT 128KB FLASH 80QFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

패키지: 80-QFP

재고12,552

MK20DX32VMP5

NXP

IC MCU 32BIT 32KB FLASH 64MAPBGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 13x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LFBGA
Supplier Device Package: 64-MAPBGA (5x5)

패키지: 64-LFBGA

재고3,680

LPC1114FBD48/301,1

NXP

IC MCU 32BIT 32KB FLASH 48LQFP

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 42
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고14,688

MPX4400A

NXP

SENSOR ABS PRESS 56.6 PSI MAX

Pressure Type: Absolute
Operating Pressure: 2.9 PSI ~ 58.02 PSI (20 kPa ~ 400 kPa)
Output Type: Analog Voltage
Output: -
Accuracy: ±1.5%
Voltage - Supply: 4.85 V ~ 5.35 V
Port Size: -
Port Style: -
Features: -
Termination Style: -
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: -
Supplier Device Package: -

패키지: -

재고5,994

TDA1575T/V2,118

NXP

IC FM FRONT END CIRC 16SOIC

Frequency: 76MHz ~ 90MHz, 87.5MHz ~ 108MHz
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: FM
Applications: FM Radio Receiver
Current - Receiving: 23mA
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 7 V ~ 10 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고6,048

MW4IC2230MBR1

NXP

IC PWR AMP RF 28V 30W TO-272-16

Frequency: 1.6GHz ~ 2.4GHz
P1dB: -
Gain: 31dB
Noise Figure: -
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Current - Supply: 60mA
Test Frequency: -
Package / Case: TO-272-16 Variant, Flat Leads
Supplier Device Package: TO-272 WB-16

패키지: TO-272-16 Variant, Flat Leads

재고4,950

FS32R274KBK2VMM

NXP

2M FLASH 1.5MB SRAM 2X

Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit Tri-Core
Speed: 180MHz, 240MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 1.5M x 8
Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V
Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

패키지: 257-LFBGA

재고7,088

SPC5604SF2CLQ6

NXP

32BIT 512K FLASH 48K RAM

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Number of I/O: 105
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고4,384

S9S08RNA32W1VLC

NXP

8-BIT MCU S08 CORE 32KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고45,000

S32K310NHT0MLFST

NXP

IC

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Number of I/O: 42
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 112K x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: A/D 24x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: -

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FG32K118LFT0MLHR

NXP

IC

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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S32G399ASCK1VUCR

NXP

8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Speed: 400MHz, 1.3GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 2.5Gbps (3)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

패키지: -

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SE050E2HQ1-Z01Z3Z

NXP

IC PLUG/TRUST SEC ELEM 20HX2QFN

Type: Plug and Trust Secure Element
Applications: -
Mounting Type: Surface Mount
Package / Case: 20-XFQFN Exposed Pad
Supplier Device Package: 20-HX2QFN (3x3)

패키지: -

재고2,070

MC33FS4507NAER2

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

패키지: -

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