페이지 674 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
MRF9030LR5	NXP	FET RF 68V 945MHZ NI-360 Transistor Type: LDMOS Frequency: 945MHz Gain: 19dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 250mA Power - Output: 30W Voltage - Rated: 68V Package / Case: NI-360 Supplier Device Package: NI-360	패키지: NI-360	재고2,160
PMEM4030NS,115	NXP	TRANS NPN 50V 2A SOT96-1 Transistor Type: NPN + Diode (Isolated) Current - Collector (Ic) (Max): 2A Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 370mV @ 300mA, 3A Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1A, 2V Power - Max: 1W Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	패키지: 8-SOIC (0.154", 3.90mm Width)	재고4,080
PDTD123TS,126	NXP	TRANS PREBIAS NPN 500MW TO92-3 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 2.2k Resistor - Emitter Base (R2) (Ohms): - DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA Frequency - Transition: - Power - Max: 500mW Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	재고4,640
MMPF0100F4AEPR2	NXP	IC PWR MGMT I.MX6 56QFN Applications: Converter, i.MX6 Voltage - Input: 2.8 V ~ 4.5 V Number of Outputs: 12 Voltage - Output: Multiple Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN (8x8)	패키지: 56-VFQFN Exposed Pad	재고3,440
74LVCH32374AEC/G,5	NXP	IC D-TYPE POS TRG QUAD 96LFBGA Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 4 Number of Bits per Element: 8 Clock Frequency: 300MHz Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.65 V ~ 3.6 V Current - Quiescent (Iq): 40µA Input Capacitance: 5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 96-LFBGA	패키지: 96-LFBGA	재고4,960
74ABT374APW,118	NXP	IC D-TYPE POS TRG SNGL 20TSSOP Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 300MHz Max Propagation Delay @ V, Max CL: 4.9ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 250µA Input Capacitance: 4pF Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width)	패키지: 20-TSSOP (0.173", 4.40mm Width)	재고2,752
74AVC16835ADGV,112	NXP	IC RGSTRD DVR 3-ST 18BIT 56TVSOP Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 18 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.173", 4.40mm Width) Supplier Device Package: 56-TSSOP	패키지: 56-TFSOP (0.173", 4.40mm Width)	재고7,888
74ALVT16245DL,118	NXP	IC 16BIT TXRX 3-ST 48SSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 2 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 48-SSOP	패키지: 48-BSSOP (0.295", 7.50mm Width)	재고3,824
MCZ33904B3EKR2	NXP	IC SBC CAN HS 3.3V 32SOIC Applications: System Basis Chip Interface: CAN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	패키지: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	재고59,700
MPC8535AVTANGA	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고6,368
MPC860DEZQ66D4	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고4,400
MPC8265ACVVMIBC	NXP	IC MPU MPC82XX 266MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	패키지: 480-LBGA	재고6,336
MPC8545EVJANGD	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BFBGA, FCBGA	재고2,560
MCF5216CVM66J	NXP	IC MCU 32BIT 512KB FLASH 256BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 142 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	패키지: 256-LBGA	재고7,376
LPC3180FEL320	NXP	IC MCU 32BIT ROMLESS 320LFBGA Core Processor: ARM9? Core Size: 16/32-Bit Speed: 208MHz Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG Peripherals: DMA, PWM, WDT Number of I/O: 55 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.1 V ~ 3.3 V Data Converters: A/D 3x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 320-LFBGA Supplier Device Package: 320-LFBGA (13x13)	패키지: 320-LFBGA	재고13,428
MCF51JF32VHS	NXP	IC MCU 32BIT 32KB FLASH 44MAPLGA Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 9x12b, D/A 1x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-VFLGA Supplier Device Package: 44-MAPLGA (5x5)	패키지: 44-VFLGA	재고4,320
S9S12G128F0MLFR	NXP	IC MCU 16BIT 128KB FLASH 48LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고72,000
JN5139-001-M/01R1V	NXP	RF TXRX MODULE 802.15.4 SMA ANT RF Family/Standard: 802.15.4 Protocol: Zigbee? Modulation: - Frequency: 2.4GHz Data Rate: - Power - Output: 2.5dBm Sensitivity: -96dBm Serial Interfaces: I2C, SPI, UART Antenna Type: Not Included, SMA Memory Size: 192kB ROM, 96kB RAM Voltage - Supply: 2.2 V ~ 3.6 V Current - Receiving: 37mA Current - Transmitting: 37mA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Package / Case: Module	패키지: Module	재고3,060
TEF6902AH/V5S,557	NXP	IC CAR RADIO SGL CHIP CIRC 64QFP Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM, WB Applications: AM/FM Radio Receiver Current - Receiving: 102mA Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 8 V ~ 9 V Operating Temperature: -40°C ~ 85°C Package / Case: 64-BQFP Supplier Device Package: 64-QFP (14x14)	패키지: 64-BQFP	재고8,010
MC33CD1030AER2	NXP	SWITCH DETECT INTERFACE 33 CHAN Applications: Switch Monitoring Interface: SPI Voltage - Supply: 4.5 V ~ 36 V Package / Case: - Supplier Device Package: - Mounting Type: -	패키지: -	재고2,688
SPC5644BAMLU1R	NXP	NXP 32-BIT MCU POWER ARCH 1.5M Core Processor: e200z4d Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 27x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	패키지: 176-LQFP	재고7,792
SPC5743PK1AMLQ5R	NXP	2MB NVM 2 X E200Z4 CORES 150MH Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고4,480
MPC8313EVRAGDC	NXP	IC MPU POWERQUICC II PRO 516PBGA Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	패키지: 516-BBGA Exposed Pad	재고2,100
MFS2302BMMA0EPR2	NXP	IC Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
FX32K146HAT0MLHT	NXP	S32K146 ARM CORTEX-M4F, 80 MHZ, Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
MC33FS6528NAE	NXP	SYSTEM BASIS CHIP, DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	패키지: -	Request a Quote
MFS8600BMDA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	패키지: -	Request a Quote
MIMXRT1062CVJ5B	NXP	IC MCU 32BIT EXT MEM 196LFBGA Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Speed: 528MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Number of I/O: 127 Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 20x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-LFBGA (12x12)	패키지: -	재고7,371

MRF9030LR5

NXP

FET RF 68V 945MHZ NI-360

Transistor Type: LDMOS
Frequency: 945MHz
Gain: 19dB
Voltage - Test: 26V
Current Rating: -
Noise Figure: -
Current - Test: 250mA
Power - Output: 30W
Voltage - Rated: 68V
Package / Case: NI-360
Supplier Device Package: NI-360

패키지: NI-360

재고2,160

PMEM4030NS,115

NXP

TRANS NPN 50V 2A SOT96-1

Transistor Type: NPN + Diode (Isolated)
Current - Collector (Ic) (Max): 2A
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 370mV @ 300mA, 3A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1A, 2V
Power - Max: 1W
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

패키지: 8-SOIC (0.154", 3.90mm Width)

재고4,080

PDTD123TS,126

NXP

TRANS PREBIAS NPN 500MW TO92-3

Transistor Type: NPN - Pre-Biased
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 2.2k
Resistor - Emitter Base (R2) (Ohms): -
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
Frequency - Transition: -
Power - Max: 500mW
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

재고4,640

MMPF0100F4AEPR2

NXP

IC PWR MGMT I.MX6 56QFN

Applications: Converter, i.MX6
Voltage - Input: 2.8 V ~ 4.5 V
Number of Outputs: 12
Voltage - Output: Multiple
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN (8x8)

패키지: 56-VFQFN Exposed Pad

재고3,440

74LVCH32374AEC/G,5

NXP

IC D-TYPE POS TRG QUAD 96LFBGA

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 4
Number of Bits per Element: 8
Clock Frequency: 300MHz
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.65 V ~ 3.6 V
Current - Quiescent (Iq): 40µA
Input Capacitance: 5pF
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 96-LFBGA

패키지: 96-LFBGA

재고4,960

74ABT374APW,118

NXP

IC D-TYPE POS TRG SNGL 20TSSOP

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 1
Number of Bits per Element: 8
Clock Frequency: 300MHz
Max Propagation Delay @ V, Max CL: 4.9ns @ 5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Iq): 250µA
Input Capacitance: 4pF
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)

패키지: 20-TSSOP (0.173", 4.40mm Width)

재고2,752

74AVC16835ADGV,112

NXP

IC RGSTRD DVR 3-ST 18BIT 56TVSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 18
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Supplier Device Package: 56-TSSOP

패키지: 56-TFSOP (0.173", 4.40mm Width)

재고7,888

74ALVT16245DL,118

NXP

IC 16BIT TXRX 3-ST 48SSOP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 48-SSOP

패키지: 48-BSSOP (0.295", 7.50mm Width)

재고3,824

MCZ33904B3EKR2

NXP

IC SBC CAN HS 3.3V 32SOIC

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

패키지: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

재고59,700

MPC8535AVTANGA

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 90°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고6,368

MPC860DEZQ66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고4,400

MPC8265ACVVMIBC

NXP

IC MPU MPC82XX 266MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

패키지: 480-LBGA

재고6,336

MPC8545EVJANGD

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BFBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BFBGA, FCBGA

재고2,560

MCF5216CVM66J

NXP

IC MCU 32BIT 512KB FLASH 256BGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 142
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

패키지: 256-LBGA

재고7,376

LPC3180FEL320

NXP

IC MCU 32BIT ROMLESS 320LFBGA

Core Processor: ARM9?
Core Size: 16/32-Bit
Speed: 208MHz
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, PWM, WDT
Number of I/O: 55
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.1 V ~ 3.3 V
Data Converters: A/D 3x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 320-LFBGA
Supplier Device Package: 320-LFBGA (13x13)

패키지: 320-LFBGA

재고13,428

MCF51JF32VHS

NXP

IC MCU 32BIT 32KB FLASH 44MAPLGA

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 9x12b, D/A 1x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 44-VFLGA
Supplier Device Package: 44-MAPLGA (5x5)

패키지: 44-VFLGA

재고4,320

S9S12G128F0MLFR

NXP

IC MCU 16BIT 128KB FLASH 48LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고72,000

JN5139-001-M/01R1V

NXP

RF TXRX MODULE 802.15.4 SMA ANT

RF Family/Standard: 802.15.4
Protocol: Zigbee?
Modulation: -
Frequency: 2.4GHz
Data Rate: -
Power - Output: 2.5dBm
Sensitivity: -96dBm
Serial Interfaces: I2C, SPI, UART
Antenna Type: Not Included, SMA
Memory Size: 192kB ROM, 96kB RAM
Voltage - Supply: 2.2 V ~ 3.6 V
Current - Receiving: 37mA
Current - Transmitting: 37mA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Package / Case: Module

패키지: Module

재고3,060

TEF6902AH/V5S,557

NXP

IC CAR RADIO SGL CHIP CIRC 64QFP

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM, WB
Applications: AM/FM Radio Receiver
Current - Receiving: 102mA
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 8 V ~ 9 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 64-BQFP
Supplier Device Package: 64-QFP (14x14)

패키지: 64-BQFP

재고8,010

MC33CD1030AER2

NXP

SWITCH DETECT INTERFACE 33 CHAN

Applications: Switch Monitoring
Interface: SPI
Voltage - Supply: 4.5 V ~ 36 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

패키지: -

재고2,688

SPC5644BAMLU1R

NXP

NXP 32-BIT MCU POWER ARCH 1.5M

Core Processor: e200z4d
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 147
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 27x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

패키지: 176-LQFP

재고7,792

SPC5743PK1AMLQ5R

NXP

2MB NVM 2 X E200Z4 CORES 150MH

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 150MHz
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고4,480

MPC8313EVRAGDC

NXP

IC MPU POWERQUICC II PRO 516PBGA

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

패키지: 516-BBGA Exposed Pad

재고2,100

MFS2302BMMA0EPR2

NXP

IC

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

FX32K146HAT0MLHT

NXP

S32K146 ARM CORTEX-M4F, 80 MHZ,

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

MC33FS6528NAE

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

패키지: -

Request a Quote

MFS8600BMDA0ES

NXP

IC FS86 SYSTEM BASIS CHIP ASIL

Applications: Camera
Current - Supply: -
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

패키지: -

Request a Quote

MIMXRT1062CVJ5B

NXP

IC MCU 32BIT EXT MEM 196LFBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 528MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O: 127
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 20x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Supplier Device Package: 196-LFBGA (12x12)

패키지: -

재고7,371