페이지 291 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
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TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  291/546
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
CRGH2010F24R3
TE Connectivity Passive Product

RES SMD 24.3 OHM 1% 1W 2010

  • Resistance: 24.3 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고7,002
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F23R7
TE Connectivity Passive Product

RES SMD 23.7 OHM 1% 1W 2010

  • Resistance: 23.7 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고7,200
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F23R2
TE Connectivity Passive Product

RES SMD 23.2 OHM 1% 1W 2010

  • Resistance: 23.2 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고7,452
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F22R6
TE Connectivity Passive Product

RES SMD 22.6 OHM 1% 1W 2010

  • Resistance: 22.6 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고5,148
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F22R1
TE Connectivity Passive Product

RES SMD 22.1 OHM 1% 1W 2010

  • Resistance: 22.1 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고3,436
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F21R5
TE Connectivity Passive Product

RES SMD 21.5 OHM 1% 1W 2010

  • Resistance: 21.5 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고7,812
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F21R
TE Connectivity Passive Product

RES SMD 21 OHM 1% 1W 2010

  • Resistance: 21 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고3,420
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F20R5
TE Connectivity Passive Product

RES SMD 20.5 OHM 1% 1W 2010

  • Resistance: 20.5 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고5,274
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F20R
TE Connectivity Passive Product

RES SMD 20 OHM 1% 1W 2010

  • Resistance: 20 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고6,426
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F19R6
TE Connectivity Passive Product

RES SMD 19.6 OHM 1% 1W 2010

  • Resistance: 19.6 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고8,244
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F19R1
TE Connectivity Passive Product

RES SMD 19.1 OHM 1% 1W 2010

  • Resistance: 19.1 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고4,068
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F18R7
TE Connectivity Passive Product

RES SMD 18.7 OHM 1% 1W 2010

  • Resistance: 18.7 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고2,376
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F18R2
TE Connectivity Passive Product

RES SMD 18.2 OHM 1% 1W 2010

  • Resistance: 18.2 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고3,996
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F17R8
TE Connectivity Passive Product

RES SMD 17.8 OHM 1% 1W 2010

  • Resistance: 17.8 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고3,600
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F17R4
TE Connectivity Passive Product

RES SMD 17.4 OHM 1% 1W 2010

  • Resistance: 17.4 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고6,768
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F16R9
TE Connectivity Passive Product

RES SMD 16.9 OHM 1% 1W 2010

  • Resistance: 16.9 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고2,376
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F16R5
TE Connectivity Passive Product

RES SMD 16.5 OHM 1% 1W 2010

  • Resistance: 16.5 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고7,020
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F16R2
TE Connectivity Passive Product

RES SMD 16.2 OHM 1% 1W 2010

  • Resistance: 16.2 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고4,932
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F15R8
TE Connectivity Passive Product

RES SMD 15.8 OHM 1% 1W 2010

  • Resistance: 15.8 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고5,220
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F15R4
TE Connectivity Passive Product

RES SMD 15.4 OHM 1% 1W 2010

  • Resistance: 15.4 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고6,498
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F15R
TE Connectivity Passive Product

RES SMD 15 OHM 1% 1W 2010

  • Resistance: 15 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고6,138
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F14R7
TE Connectivity Passive Product

RES SMD 14.7 OHM 1% 1W 2010

  • Resistance: 14.7 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고3,384
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F14R3
TE Connectivity Passive Product

RES SMD 14.3 OHM 1% 1W 2010

  • Resistance: 14.3 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고6,084
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F14R
TE Connectivity Passive Product

RES SMD 14 OHM 1% 1W 2010

  • Resistance: 14 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고3,960
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F13R7
TE Connectivity Passive Product

RES SMD 13.7 OHM 1% 1W 2010

  • Resistance: 13.7 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고7,722
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F13R3
TE Connectivity Passive Product

RES SMD 13.3 OHM 1% 1W 2010

  • Resistance: 13.3 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고2,520
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F13R
TE Connectivity Passive Product

RES SMD 13 OHM 1% 1W 2010

  • Resistance: 13 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고3,096
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F12R7
TE Connectivity Passive Product

RES SMD 12.7 OHM 1% 1W 2010

  • Resistance: 12.7 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2010 (5025 Metric)
재고4,212
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-