페이지 316 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

부품 번호	제조업체	설명	패키지	재고	Tolerance	Power (Watts)	Composition	Features	Temperature Coefficient	Operating Temperature	Package / Case	Supplier Device Package	Size / Dimension	Height - Seated (Max)	Number of Terminations	Failure Rate
RL73H2BR11FTDF	TE Connectivity Passive Product	RES SMD 0.11 OHM 1% 1/4W 1206 Resistance: 110 mOhms Tolerance: ±1% Power (Watts): 0.25W, 1/4W Composition: Thick Film Features: Current Sense Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 1206 (3216 Metric) Supplier Device Package: 1206 Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm) Height - Seated (Max): 0.026" (0.65mm) Number of Terminations: 2 Failure Rate: -	패키지: 1206 (3216 Metric)	재고8,424	±1%	0.25W, 1/4W	Thick Film	Current Sense	±100ppm/°C	-55°C ~ 155°C	1206 (3216 Metric)	1206	0.122" L x 0.061" W (3.10mm x 1.55mm)	0.026" (0.65mm)	2	-
RL73H2BR10FTDF	TE Connectivity Passive Product	RES SMD 0.1 OHM 1% 1/4W 1206 Resistance: 100 mOhms Tolerance: ±1% Power (Watts): 0.25W, 1/4W Composition: Thick Film Features: Current Sense Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 1206 (3216 Metric) Supplier Device Package: 1206 Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm) Height - Seated (Max): 0.026" (0.65mm) Number of Terminations: 2 Failure Rate: -	패키지: 1206 (3216 Metric)	재고3,384	±1%	0.25W, 1/4W	Thick Film	Current Sense	±100ppm/°C	-55°C ~ 155°C	1206 (3216 Metric)	1206	0.122" L x 0.061" W (3.10mm x 1.55mm)	0.026" (0.65mm)	2	-
RL73H2BR27FTDF	TE Connectivity Passive Product	RES SMD 0.27 OHM 1% 1/4W 1206 Resistance: 270 mOhms Tolerance: ±1% Power (Watts): 0.25W, 1/4W Composition: Thick Film Features: Current Sense Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 1206 (3216 Metric) Supplier Device Package: 1206 Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm) Height - Seated (Max): 0.026" (0.65mm) Number of Terminations: 2 Failure Rate: -	패키지: 1206 (3216 Metric)	재고5,688	±1%	0.25W, 1/4W	Thick Film	Current Sense	±100ppm/°C	-55°C ~ 155°C	1206 (3216 Metric)	1206	0.122" L x 0.061" W (3.10mm x 1.55mm)	0.026" (0.65mm)	2	-
RL73K2ER47JTD	TE Connectivity Passive Product	RES SMD 0.47 OHM 5% 1/2W 1210 Resistance: 470 mOhms Tolerance: ±5% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: Current Sense Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 1210 (3225 Metric) Supplier Device Package: 1210 Size / Dimension: 0.122" L x 0.098" W (3.10mm x 2.50mm) Height - Seated (Max): 0.026" (0.65mm) Number of Terminations: 2 Failure Rate: -	패키지: 1210 (3225 Metric)	재고6,408	±5%	0.5W, 1/2W	Thick Film	Current Sense	±200ppm/°C	-55°C ~ 155°C	1210 (3225 Metric)	1210	0.122" L x 0.098" W (3.10mm x 2.50mm)	0.026" (0.65mm)	2	-
RLP73N1JR39FTDF	TE Connectivity Passive Product	RES SMD 0.39 OHM 1% 1/8W 0603 Resistance: 390 mOhms Tolerance: ±1% Power (Watts): 0.125W, 1/8W Composition: Thick Film Features: Current Sense Temperature Coefficient: ±300ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 0603 (1608 Metric) Supplier Device Package: 0603 Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm) Height - Seated (Max): 0.022" (0.55mm) Number of Terminations: 2 Failure Rate: -	패키지: 0603 (1608 Metric)	재고6,228	±1%	0.125W, 1/8W	Thick Film	Current Sense	±300ppm/°C	-55°C ~ 155°C	0603 (1608 Metric)	0603	0.063" L x 0.031" W (1.60mm x 0.80mm)	0.022" (0.55mm)	2	-
RL73H3AR56FTE	TE Connectivity Passive Product	RES SMD 0.56 OHM 1% 1W 2512 Resistance: 560 mOhms Tolerance: ±1% Power (Watts): 1W Composition: Thick Film Features: Current Sense Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2512 (6432 Metric) Supplier Device Package: 2512 Size / Dimension: 0.250" L x 0.122" W (6.35mm x 3.10mm) Height - Seated (Max): 0.028" (0.70mm) Number of Terminations: 2 Failure Rate: -	패키지: 2512 (6432 Metric)	재고4,356	±1%	1W	Thick Film	Current Sense	±100ppm/°C	-55°C ~ 155°C	2512 (6432 Metric)	2512	0.250" L x 0.122" W (6.35mm x 3.10mm)	0.028" (0.70mm)	2	-
RL73H3AR91FTE	TE Connectivity Passive Product	RES SMD 0.91 OHM 1% 1W 2512 Resistance: 910 mOhms Tolerance: ±1% Power (Watts): 1W Composition: Thick Film Features: Current Sense Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2512 (6432 Metric) Supplier Device Package: 2512 Size / Dimension: 0.250" L x 0.122" W (6.35mm x 3.10mm) Height - Seated (Max): 0.028" (0.70mm) Number of Terminations: 2 Failure Rate: -	패키지: 2512 (6432 Metric)	재고8,658	±1%	1W	Thick Film	Current Sense	±100ppm/°C	-55°C ~ 155°C	2512 (6432 Metric)	2512	0.250" L x 0.122" W (6.35mm x 3.10mm)	0.028" (0.70mm)	2	-
RL73H3AR82FTE	TE Connectivity Passive Product	RES SMD 0.82 OHM 1% 1W 2512 Resistance: 820 mOhms Tolerance: ±1% Power (Watts): 1W Composition: Thick Film Features: Current Sense Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2512 (6432 Metric) Supplier Device Package: 2512 Size / Dimension: 0.250" L x 0.122" W (6.35mm x 3.10mm) Height - Seated (Max): 0.028" (0.70mm) Number of Terminations: 2 Failure Rate: -	패키지: 2512 (6432 Metric)	재고2,100	±1%	1W	Thick Film	Current Sense	±100ppm/°C	-55°C ~ 155°C	2512 (6432 Metric)	2512	0.250" L x 0.122" W (6.35mm x 3.10mm)	0.028" (0.70mm)	2	-
RL73H3AR75FTE	TE Connectivity Passive Product	RES SMD 0.75 OHM 1% 1W 2512 Resistance: 750 mOhms Tolerance: ±1% Power (Watts): 1W Composition: Thick Film Features: Current Sense Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2512 (6432 Metric) Supplier Device Package: 2512 Size / Dimension: 0.250" L x 0.122" W (6.35mm x 3.10mm) Height - Seated (Max): 0.028" (0.70mm) Number of Terminations: 2 Failure Rate: -	패키지: 2512 (6432 Metric)	재고6,642	±1%	1W	Thick Film	Current Sense	±100ppm/°C	-55°C ~ 155°C	2512 (6432 Metric)	2512	0.250" L x 0.122" W (6.35mm x 3.10mm)	0.028" (0.70mm)	2	-
RL73H3AR51FTE	TE Connectivity Passive Product	RES SMD 0.51 OHM 1% 1W 2512 Resistance: 510 mOhms Tolerance: ±1% Power (Watts): 1W Composition: Thick Film Features: Current Sense Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2512 (6432 Metric) Supplier Device Package: 2512 Size / Dimension: 0.250" L x 0.122" W (6.35mm x 3.10mm) Height - Seated (Max): 0.028" (0.70mm) Number of Terminations: 2 Failure Rate: -	패키지: 2512 (6432 Metric)	재고6,300	±1%	1W	Thick Film	Current Sense	±100ppm/°C	-55°C ~ 155°C	2512 (6432 Metric)	2512	0.250" L x 0.122" W (6.35mm x 3.10mm)	0.028" (0.70mm)	2	-
CRGV2010F10M	TE Connectivity Passive Product	RES SMD 10M OHM 1% 1/2W 2010 Resistance: 10 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고8,838	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F9M76	TE Connectivity Passive Product	RES SMD 9.76M OHM 1% 1/2W 2010 Resistance: 9.76 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고8,784	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F9M53	TE Connectivity Passive Product	RES SMD 9.53M OHM 1% 1/2W 2010 Resistance: 9.53 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고4,302	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F9M31	TE Connectivity Passive Product	RES SMD 9.31M OHM 1% 1/2W 2010 Resistance: 9.31 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고5,364	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F9M09	TE Connectivity Passive Product	RES SMD 9.09M OHM 1% 1/2W 2010 Resistance: 9.09 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고8,856	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F8M87	TE Connectivity Passive Product	RES SMD 8.87M OHM 1% 1/2W 2010 Resistance: 8.87 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고5,130	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F8M66	TE Connectivity Passive Product	RES SMD 8.66M OHM 1% 1/2W 2010 Resistance: 8.66 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고8,370	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F8M45	TE Connectivity Passive Product	RES SMD 8.45M OHM 1% 1/2W 2010 Resistance: 8.45 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고8,712	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F8M25	TE Connectivity Passive Product	RES SMD 8.25M OHM 1% 1/2W 2010 Resistance: 8.25 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고3,906	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F8M06	TE Connectivity Passive Product	RES SMD 8.06M OHM 1% 1/2W 2010 Resistance: 8.06 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고2,034	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F7M87	TE Connectivity Passive Product	RES SMD 7.87M OHM 1% 1/2W 2010 Resistance: 7.87 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고5,004	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F7M68	TE Connectivity Passive Product	RES SMD 7.68M OHM 1% 1/2W 2010 Resistance: 7.68 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고3,114	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F7M5	TE Connectivity Passive Product	RES SMD 7.5M OHM 1% 1/2W 2010 Resistance: 7.5 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고8,316	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F7M32	TE Connectivity Passive Product	RES SMD 7.32M OHM 1% 1/2W 2010 Resistance: 7.32 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고3,816	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F7M15	TE Connectivity Passive Product	RES SMD 7.15M OHM 1% 1/2W 2010 Resistance: 7.15 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고3,510	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F6M98	TE Connectivity Passive Product	RES SMD 6.98M OHM 1% 1/2W 2010 Resistance: 6.98 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고8,586	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F6M81	TE Connectivity Passive Product	RES SMD 6.81M OHM 1% 1/2W 2010 Resistance: 6.81 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고5,364	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F6M65	TE Connectivity Passive Product	RES SMD 6.65M OHM 1% 1/2W 2010 Resistance: 6.65 MOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	패키지: 2010 (5025 Metric)	재고5,274	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-

RL73H2BR11FTDF

TE Connectivity Passive Product

RES SMD 0.11 OHM 1% 1/4W 1206

Resistance: 110 mOhms
Tolerance: ±1%
Power (Watts): 0.25W, 1/4W
Composition: Thick Film
Features: Current Sense
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 1206 (3216 Metric)
Supplier Device Package: 1206
Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
Height - Seated (Max): 0.026" (0.65mm)
Number of Terminations: 2
Failure Rate: -

패키지: 1206 (3216 Metric)

재고8,424

±1%

0.25W, 1/4W

Thick Film

Current Sense

±100ppm/°C

-55°C ~ 155°C

1206 (3216 Metric)

1206

0.122" L x 0.061" W (3.10mm x 1.55mm)

0.026" (0.65mm)

2

-

RL73H2BR10FTDF

TE Connectivity Passive Product

RES SMD 0.1 OHM 1% 1/4W 1206

Resistance: 100 mOhms
Tolerance: ±1%
Power (Watts): 0.25W, 1/4W
Composition: Thick Film
Features: Current Sense
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 1206 (3216 Metric)
Supplier Device Package: 1206
Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
Height - Seated (Max): 0.026" (0.65mm)
Number of Terminations: 2
Failure Rate: -

패키지: 1206 (3216 Metric)

재고3,384

±1%

0.25W, 1/4W

Thick Film

Current Sense

±100ppm/°C

-55°C ~ 155°C

1206 (3216 Metric)

1206

0.122" L x 0.061" W (3.10mm x 1.55mm)

0.026" (0.65mm)

2

-

RL73H2BR27FTDF

TE Connectivity Passive Product

RES SMD 0.27 OHM 1% 1/4W 1206

Resistance: 270 mOhms
Tolerance: ±1%
Power (Watts): 0.25W, 1/4W
Composition: Thick Film
Features: Current Sense
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 1206 (3216 Metric)
Supplier Device Package: 1206
Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
Height - Seated (Max): 0.026" (0.65mm)
Number of Terminations: 2
Failure Rate: -

패키지: 1206 (3216 Metric)

재고5,688

±1%

0.25W, 1/4W

Thick Film

Current Sense

±100ppm/°C

-55°C ~ 155°C

1206 (3216 Metric)

1206

0.122" L x 0.061" W (3.10mm x 1.55mm)

0.026" (0.65mm)

2

-

RL73K2ER47JTD

TE Connectivity Passive Product

RES SMD 0.47 OHM 5% 1/2W 1210

Resistance: 470 mOhms
Tolerance: ±5%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: Current Sense
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 1210 (3225 Metric)
Supplier Device Package: 1210
Size / Dimension: 0.122" L x 0.098" W (3.10mm x 2.50mm)
Height - Seated (Max): 0.026" (0.65mm)
Number of Terminations: 2
Failure Rate: -

패키지: 1210 (3225 Metric)

재고6,408

±5%

0.5W, 1/2W

Thick Film

Current Sense

±200ppm/°C

-55°C ~ 155°C

1210 (3225 Metric)

1210

0.122" L x 0.098" W (3.10mm x 2.50mm)

0.026" (0.65mm)

2

-

RLP73N1JR39FTDF

TE Connectivity Passive Product

RES SMD 0.39 OHM 1% 1/8W 0603

Resistance: 390 mOhms
Tolerance: ±1%
Power (Watts): 0.125W, 1/8W
Composition: Thick Film
Features: Current Sense
Temperature Coefficient: ±300ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 0603 (1608 Metric)
Supplier Device Package: 0603
Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
Height - Seated (Max): 0.022" (0.55mm)
Number of Terminations: 2
Failure Rate: -

패키지: 0603 (1608 Metric)

재고6,228

±1%

0.125W, 1/8W

Thick Film

Current Sense

±300ppm/°C

-55°C ~ 155°C

0603 (1608 Metric)

0603

0.063" L x 0.031" W (1.60mm x 0.80mm)

0.022" (0.55mm)

2

-

RL73H3AR56FTE

TE Connectivity Passive Product

RES SMD 0.56 OHM 1% 1W 2512

Resistance: 560 mOhms
Tolerance: ±1%
Power (Watts): 1W
Composition: Thick Film
Features: Current Sense
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2512 (6432 Metric)
Supplier Device Package: 2512
Size / Dimension: 0.250" L x 0.122" W (6.35mm x 3.10mm)
Height - Seated (Max): 0.028" (0.70mm)
Number of Terminations: 2
Failure Rate: -

패키지: 2512 (6432 Metric)

재고4,356

±1%

1W

Thick Film

Current Sense

±100ppm/°C

-55°C ~ 155°C

2512 (6432 Metric)

2512

0.250" L x 0.122" W (6.35mm x 3.10mm)

0.028" (0.70mm)

2

-

RL73H3AR91FTE

TE Connectivity Passive Product

RES SMD 0.91 OHM 1% 1W 2512

Resistance: 910 mOhms
Tolerance: ±1%
Power (Watts): 1W
Composition: Thick Film
Features: Current Sense
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2512 (6432 Metric)
Supplier Device Package: 2512
Size / Dimension: 0.250" L x 0.122" W (6.35mm x 3.10mm)
Height - Seated (Max): 0.028" (0.70mm)
Number of Terminations: 2
Failure Rate: -

패키지: 2512 (6432 Metric)

재고8,658

±1%

1W

Thick Film

Current Sense

±100ppm/°C

-55°C ~ 155°C

2512 (6432 Metric)

2512

0.250" L x 0.122" W (6.35mm x 3.10mm)

0.028" (0.70mm)

2

-

RL73H3AR82FTE

TE Connectivity Passive Product

RES SMD 0.82 OHM 1% 1W 2512

Resistance: 820 mOhms
Tolerance: ±1%
Power (Watts): 1W
Composition: Thick Film
Features: Current Sense
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2512 (6432 Metric)
Supplier Device Package: 2512
Size / Dimension: 0.250" L x 0.122" W (6.35mm x 3.10mm)
Height - Seated (Max): 0.028" (0.70mm)
Number of Terminations: 2
Failure Rate: -

패키지: 2512 (6432 Metric)

재고2,100

±1%

1W

Thick Film

Current Sense

±100ppm/°C

-55°C ~ 155°C

2512 (6432 Metric)

2512

0.250" L x 0.122" W (6.35mm x 3.10mm)

0.028" (0.70mm)

2

-

RL73H3AR75FTE

TE Connectivity Passive Product

RES SMD 0.75 OHM 1% 1W 2512

Resistance: 750 mOhms
Tolerance: ±1%
Power (Watts): 1W
Composition: Thick Film
Features: Current Sense
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2512 (6432 Metric)
Supplier Device Package: 2512
Size / Dimension: 0.250" L x 0.122" W (6.35mm x 3.10mm)
Height - Seated (Max): 0.028" (0.70mm)
Number of Terminations: 2
Failure Rate: -

패키지: 2512 (6432 Metric)

재고6,642

±1%

1W

Thick Film

Current Sense

±100ppm/°C

-55°C ~ 155°C

2512 (6432 Metric)

2512

0.250" L x 0.122" W (6.35mm x 3.10mm)

0.028" (0.70mm)

2

-

RL73H3AR51FTE

TE Connectivity Passive Product

RES SMD 0.51 OHM 1% 1W 2512

Resistance: 510 mOhms
Tolerance: ±1%
Power (Watts): 1W
Composition: Thick Film
Features: Current Sense
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2512 (6432 Metric)
Supplier Device Package: 2512
Size / Dimension: 0.250" L x 0.122" W (6.35mm x 3.10mm)
Height - Seated (Max): 0.028" (0.70mm)
Number of Terminations: 2
Failure Rate: -

패키지: 2512 (6432 Metric)

재고6,300

±1%

1W

Thick Film

Current Sense

±100ppm/°C

-55°C ~ 155°C

2512 (6432 Metric)

2512

0.250" L x 0.122" W (6.35mm x 3.10mm)

0.028" (0.70mm)

2

-

CRGV2010F10M

TE Connectivity Passive Product

RES SMD 10M OHM 1% 1/2W 2010

Resistance: 10 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고8,838

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F9M76

TE Connectivity Passive Product

RES SMD 9.76M OHM 1% 1/2W 2010

Resistance: 9.76 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고8,784

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F9M53

TE Connectivity Passive Product

RES SMD 9.53M OHM 1% 1/2W 2010

Resistance: 9.53 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고4,302

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F9M31

TE Connectivity Passive Product

RES SMD 9.31M OHM 1% 1/2W 2010

Resistance: 9.31 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고5,364

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F9M09

TE Connectivity Passive Product

RES SMD 9.09M OHM 1% 1/2W 2010

Resistance: 9.09 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고8,856

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F8M87

TE Connectivity Passive Product

RES SMD 8.87M OHM 1% 1/2W 2010

Resistance: 8.87 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고5,130

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F8M66

TE Connectivity Passive Product

RES SMD 8.66M OHM 1% 1/2W 2010

Resistance: 8.66 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고8,370

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F8M45

TE Connectivity Passive Product

RES SMD 8.45M OHM 1% 1/2W 2010

Resistance: 8.45 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고8,712

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F8M25

TE Connectivity Passive Product

RES SMD 8.25M OHM 1% 1/2W 2010

Resistance: 8.25 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고3,906

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F8M06

TE Connectivity Passive Product

RES SMD 8.06M OHM 1% 1/2W 2010

Resistance: 8.06 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고2,034

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F7M87

TE Connectivity Passive Product

RES SMD 7.87M OHM 1% 1/2W 2010

Resistance: 7.87 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고5,004

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F7M68

TE Connectivity Passive Product

RES SMD 7.68M OHM 1% 1/2W 2010

Resistance: 7.68 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고3,114

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F7M5

TE Connectivity Passive Product

RES SMD 7.5M OHM 1% 1/2W 2010

Resistance: 7.5 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고8,316

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F7M32

TE Connectivity Passive Product

RES SMD 7.32M OHM 1% 1/2W 2010

Resistance: 7.32 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고3,816

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F7M15

TE Connectivity Passive Product

RES SMD 7.15M OHM 1% 1/2W 2010

Resistance: 7.15 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고3,510

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F6M98

TE Connectivity Passive Product

RES SMD 6.98M OHM 1% 1/2W 2010

Resistance: 6.98 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고8,586

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F6M81

TE Connectivity Passive Product

RES SMD 6.81M OHM 1% 1/2W 2010

Resistance: 6.81 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고5,364

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F6M65

TE Connectivity Passive Product

RES SMD 6.65M OHM 1% 1/2W 2010

Resistance: 6.65 MOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

패키지: 2010 (5025 Metric)

재고5,274

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-