페이지 186 - Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array) | Heisener Electronics
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Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array)

기록 5,652
페이지  186/202
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제조업체
설명
패키지
재고
수량
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
XC3195A-09PQ160C
Xilinx Inc.

IC FPGA 138 I/O 160QFP

  • Number of LABs/CLBs: 484
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 94984
  • Number of I/O: 138
  • Number of Gates: 7500
  • Voltage - Supply: 4.25 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
패키지: 160-BQFP
재고7,216
-
94984
138
7500
4.25 V ~ 5.25 V
Surface Mount
0°C ~ 85°C (TJ)
160-BQFP
160-PQFP (28x28)
hot XC2S150E-6FT256I
Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 182
  • Number of Gates: 150000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고4,496
3888
49152
182
150000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
256-LBGA
256-FTBGA (17x17)
hot XC2S300E-6PQ208C
Xilinx Inc.

IC FPGA 146 I/O 208QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 146
  • Number of Gates: 300000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
패키지: 208-BFQFP
재고12,132
6912
65536
146
300000
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
208-BFQFP
208-PQFP (28x28)
hot XC2S200E-6FG456C
Xilinx Inc.

IC FPGA 289 I/O 456FPGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 289
  • Number of Gates: 200000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고97,104
5292
57344
289
200000
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XC2S200E-6PQ208C
Xilinx Inc.

IC FPGA 146 I/O 208QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 146
  • Number of Gates: 200000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
패키지: 208-BFQFP
재고7,332
5292
57344
146
200000
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
208-BFQFP
208-PQFP (28x28)
hot XC2S100E-6FT256C
Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 182
  • Number of Gates: 100000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고11,268
2700
40960
182
100000
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
256-LBGA
256-FTBGA (17x17)
hot XC2S100E-6PQ208C
Xilinx Inc.

IC FPGA 146 I/O 208QFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 146
  • Number of Gates: 100000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
패키지: 208-BFQFP
재고34,992
2700
40960
146
100000
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
208-BFQFP
208-PQFP (28x28)
hot XC2S100E-6TQ144C
Xilinx Inc.

IC FPGA 102 I/O 144TQFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 102
  • Number of Gates: 100000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고7,680
2700
40960
102
100000
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
144-LQFP
144-TQFP (20x20)
hot XC2S50E-6PQ208C
Xilinx Inc.

IC FPGA 146 I/O 208QFP

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 32768
  • Number of I/O: 146
  • Number of Gates: 50000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
패키지: 208-BFQFP
재고5,552
1728
32768
146
50000
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
208-BFQFP
208-PQFP (28x28)
hot XC2S50E-6TQ144C
Xilinx Inc.

IC FPGA 102 I/O 144TQFP

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 32768
  • Number of I/O: 102
  • Number of Gates: 50000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고24,120
1728
32768
102
50000
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
144-LQFP
144-TQFP (20x20)
hot XC2V1000-5FG256C
Xilinx Inc.

IC FPGA 172 I/O 256FBGA

  • Number of LABs/CLBs: 1280
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 737280
  • Number of I/O: 172
  • Number of Gates: 1000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고17,352
-
737280
172
1000000
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
hot XC2V6000-4BF957C
Xilinx Inc.

IC FPGA 684 I/O 957FCBGA

  • Number of LABs/CLBs: 8448
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 2654208
  • Number of I/O: 684
  • Number of Gates: 6000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 957-BBGA, FCBGA
  • Supplier Device Package: 957-FCBGA (40x40)
패키지: 957-BBGA, FCBGA
재고4,672
-
2654208
684
6000000
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 85°C (TJ)
957-BBGA, FCBGA
957-FCBGA (40x40)
hot XC2V6000-5BF957C
Xilinx Inc.

IC FPGA 684 I/O 957FCBGA

  • Number of LABs/CLBs: 8448
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 2654208
  • Number of I/O: 684
  • Number of Gates: 6000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 957-BBGA, FCBGA
  • Supplier Device Package: 957-FCBGA (40x40)
패키지: 957-BBGA, FCBGA
재고9,192
-
2654208
684
6000000
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 85°C (TJ)
957-BBGA, FCBGA
957-FCBGA (40x40)
hot XC2V3000-4BF957C
Xilinx Inc.

IC FPGA 684 I/O 957FCBGA

  • Number of LABs/CLBs: 3584
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 1769472
  • Number of I/O: 684
  • Number of Gates: 3000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 957-BBGA, FCBGA
  • Supplier Device Package: 957-FCBGA (40x40)
패키지: 957-BBGA, FCBGA
재고19,176
-
1769472
684
3000000
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 85°C (TJ)
957-BBGA, FCBGA
957-FCBGA (40x40)
hot XC2V3000-5BF957C
Xilinx Inc.

IC FPGA 684 I/O 957FCBGA

  • Number of LABs/CLBs: 3584
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 1769472
  • Number of I/O: 684
  • Number of Gates: 3000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 957-BBGA, FCBGA
  • Supplier Device Package: 957-FCBGA (40x40)
패키지: 957-BBGA, FCBGA
재고7,024
-
1769472
684
3000000
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 85°C (TJ)
957-BBGA, FCBGA
957-FCBGA (40x40)
hot XC2V4000-5BF957C
Xilinx Inc.

IC FPGA 684 I/O 957FCBGA

  • Number of LABs/CLBs: 5760
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 2211840
  • Number of I/O: 684
  • Number of Gates: 4000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 957-BBGA, FCBGA
  • Supplier Device Package: 957-FCBGA (40x40)
패키지: 957-BBGA, FCBGA
재고7,168
-
2211840
684
4000000
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 85°C (TJ)
957-BBGA, FCBGA
957-FCBGA (40x40)
XC4085XLA-08HQ304I
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 256
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 304-BFQFP Exposed Pad
  • Supplier Device Package: 304-PQFP (40x40)
패키지: 304-BFQFP Exposed Pad
재고7,456
7448
100352
256
85000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
304-BFQFP Exposed Pad
304-PQFP (40x40)
XC4044XLA-08HQ240I
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 1600
  • Number of Logic Elements/Cells: 3800
  • Total RAM Bits: 51200
  • Number of I/O: 193
  • Number of Gates: 44000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP Exposed Pad
재고7,808
3800
51200
193
44000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XC4044XLA-08HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 1600
  • Number of Logic Elements/Cells: 3800
  • Total RAM Bits: 51200
  • Number of I/O: 193
  • Number of Gates: 44000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP Exposed Pad
재고6,192
3800
51200
193
44000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XC4028EX-4HQ208C
Xilinx Inc.

IC FPGA 160 I/O 208HQFP

  • Number of LABs/CLBs: 1024
  • Number of Logic Elements/Cells: 2432
  • Total RAM Bits: 32768
  • Number of I/O: 160
  • Number of Gates: 28000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP Exposed Pad
  • Supplier Device Package: 208-PQFP (28x28)
패키지: 208-BFQFP Exposed Pad
재고6,192
2432
32768
160
28000
4.75 V ~ 5.25 V
Surface Mount
0°C ~ 85°C (TJ)
208-BFQFP Exposed Pad
208-PQFP (28x28)
XC4036XLA-09HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 193
  • Number of Gates: 36000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP Exposed Pad
재고5,952
3078
41472
193
36000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XC3090A-7TQ176C
Xilinx Inc.

IC FPGA 144 I/O 176TQFP

  • Number of LABs/CLBs: 320
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 64160
  • Number of I/O: 144
  • Number of Gates: 6000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-TQFP (24x24)
패키지: 176-LQFP
재고9,528
-
64160
144
6000
4.75 V ~ 5.25 V
Surface Mount
0°C ~ 85°C (TJ)
176-LQFP
176-TQFP (24x24)
XC4028XLA-09HQ240I
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 1024
  • Number of Logic Elements/Cells: 2432
  • Total RAM Bits: 32768
  • Number of I/O: 193
  • Number of Gates: 28000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP Exposed Pad
재고6,480
2432
32768
193
28000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
XCV812E-8FG900C
Xilinx Inc.

IC FPGA 556 I/O 900FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 1146880
  • Number of I/O: 556
  • Number of Gates: 254016
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
패키지: 900-BBGA
재고4,640
21168
1146880
556
254016
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)
XCV812E-8BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 1146880
  • Number of I/O: 404
  • Number of Gates: 254016
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고2,720
21168
1146880
404
254016
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV812E-7FG900C
Xilinx Inc.

IC FPGA 556 I/O 900FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 1146880
  • Number of I/O: 556
  • Number of Gates: 254016
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
패키지: 900-BBGA
재고5,408
21168
1146880
556
254016
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)
XCV812E-7BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 1146880
  • Number of I/O: 404
  • Number of Gates: 254016
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고6,992
21168
1146880
404
254016
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV812E-6FG900C
Xilinx Inc.

IC FPGA 556 I/O 900FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 1146880
  • Number of I/O: 556
  • Number of Gates: 254016
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
패키지: 900-BBGA
재고17,424
21168
1146880
556
254016
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)