페이지 54 - Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array) | Heisener Electronics
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Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array)

기록 5,652
페이지  54/202
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
hot XC3S4000-5FG676C
Xilinx Inc.

IC FPGA 489 I/O 676FBGA

  • Number of LABs/CLBs: 6912
  • Number of Logic Elements/Cells: 62208
  • Total RAM Bits: 1769472
  • Number of I/O: 489
  • Number of Gates: 4000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고11,112
62208
1769472
489
4000000
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
hot XC3S4000-4FG676I
Xilinx Inc.

IC FPGA 489 I/O 676FBGA

  • Number of LABs/CLBs: 6912
  • Number of Logic Elements/Cells: 62208
  • Total RAM Bits: 1769472
  • Number of I/O: 489
  • Number of Gates: 4000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고5,712
62208
1769472
489
4000000
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
hot XC3S4000-4FGG676I
Xilinx Inc.

IC FPGA 489 I/O 676FBGA

  • Number of LABs/CLBs: 6912
  • Number of Logic Elements/Cells: 62208
  • Total RAM Bits: 1769472
  • Number of I/O: 489
  • Number of Gates: 4000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
패키지: 676-BGA
재고15,132
62208
1769472
489
4000000
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BGA
676-FBGA (27x27)
hot XC3S4000-5FGG676C
Xilinx Inc.

IC FPGA 489 I/O 676FBGA

  • Number of LABs/CLBs: 6912
  • Number of Logic Elements/Cells: 62208
  • Total RAM Bits: 1769472
  • Number of I/O: 489
  • Number of Gates: 4000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
패키지: 676-BGA
재고6,416
62208
1769472
489
4000000
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
676-BGA
676-FBGA (27x27)
XA6SLX75-2FGG484I
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고6,288
74637
3170304
280
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
484-BBGA
484-FBGA (23x23)
XA6SLX45T-3FGG484Q
Xilinx Inc.

IC FPGA 296 I/O 484FBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고6,064
43661
2138112
296
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 125°C (TJ)
484-BBGA
484-FBGA (23x23)
XC7A75T-1CS324I
Xilinx Inc.

IC FPGA 210 I/O 324BGA

  • Number of LABs/CLBs: 5900
  • Number of Logic Elements/Cells: 75520
  • Total RAM Bits: 3870720
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
패키지: 324-LFBGA, CSPBGA
재고4,400
75520
3870720
210
-
0.95 V ~ 1.05 V
Surface Mount
-40°C ~ 100°C (TJ)
324-LFBGA, CSPBGA
324-CSPBGA (15x15)
XC7A75T-2CSG324C
Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

  • Number of LABs/CLBs: 5900
  • Number of Logic Elements/Cells: 75520
  • Total RAM Bits: 3870720
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
패키지: 324-LFBGA, CSPBGA
재고6,960
75520
3870720
210
-
0.95 V ~ 1.05 V
Surface Mount
0°C ~ 85°C (TJ)
324-LFBGA, CSPBGA
324-CSPBGA (15x15)
XC7A75T-1CSG324I
Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

  • Number of LABs/CLBs: 5900
  • Number of Logic Elements/Cells: 75520
  • Total RAM Bits: 3870720
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
패키지: 324-LFBGA, CSPBGA
재고2,944
75520
3870720
210
-
0.95 V ~ 1.05 V
Surface Mount
-40°C ~ 100°C (TJ)
324-LFBGA, CSPBGA
324-CSPBGA (15x15)
XC6SLX75-L1FG484C
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고6,720
74637
3170304
280
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX75-2FG676C
Xilinx Inc.

IC FPGA 408 I/O 676FCBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 408
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고2,720
74637
3170304
408
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XC6SLX75-N3FGG676C
Xilinx Inc.

IC FPGA 408 I/O 676FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 408
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
패키지: 676-BGA
재고3,840
74637
3170304
408
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
676-BGA
676-FBGA (27x27)
XC6SLX75-N3FGG484I
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고4,432
74637
3170304
280
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX75-2FG484I
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고3,344
74637
3170304
280
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX75-L1FGG484C
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고2,272
74637
3170304
280
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX75-L1CSG484C
Xilinx Inc.

IC FPGA 328 I/O 484CSBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 328
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-FBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
패키지: 484-FBGA, CSPBGA
재고5,648
74637
3170304
328
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-FBGA, CSPBGA
484-CSPBGA (19x19)
hot XC6SLX75-2FGG484I
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고4,192
74637
3170304
280
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
484-BBGA
484-FBGA (23x23)
hot XC6SLX75-2CSG484I
Xilinx Inc.

IC FPGA 328 I/O 484CSBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 328
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-FBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
패키지: 484-FBGA, CSPBGA
재고6,924
74637
3170304
328
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
484-FBGA, CSPBGA
484-CSPBGA (19x19)
XC3SD3400A-4FG676C
Xilinx Inc.

IC FPGA 469 I/O 676FBGA

  • Number of LABs/CLBs: 5968
  • Number of Logic Elements/Cells: 53712
  • Total RAM Bits: 2322432
  • Number of I/O: 469
  • Number of Gates: 3400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고7,936
53712
2322432
469
3400000
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XC3SD3400A-4CS484I
Xilinx Inc.

IC FPGA 309 I/O 484CSBGA

  • Number of LABs/CLBs: 5968
  • Number of Logic Elements/Cells: 53712
  • Total RAM Bits: 2322432
  • Number of I/O: 309
  • Number of Gates: 3400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-FBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
패키지: 484-FBGA, CSPBGA
재고4,848
53712
2322432
309
3400000
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
484-FBGA, CSPBGA
484-CSPBGA (19x19)
hot XC3SD3400A-4CSG484I
Xilinx Inc.

IC FPGA 309 I/O 484CSBGA

  • Number of LABs/CLBs: 5968
  • Number of Logic Elements/Cells: 53712
  • Total RAM Bits: 2322432
  • Number of I/O: 309
  • Number of Gates: 3400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-FBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
패키지: 484-FBGA, CSPBGA
재고6,384
53712
2322432
309
3400000
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
484-FBGA, CSPBGA
484-CSPBGA (19x19)
XC6SLX75-3FG484C
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고4,352
74637
3170304
280
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FBGA (23x23)
hot XC6SLX75-3FGG484C
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고6,768
74637
3170304
280
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FBGA (23x23)
hot XC6SLX75-3CSG484C
Xilinx Inc.

IC FPGA 328 I/O 484CSBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 328
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-FBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
패키지: 484-FBGA, CSPBGA
재고5,936
74637
3170304
328
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-FBGA, CSPBGA
484-CSPBGA (19x19)
hot XC3S1400AN-4FGG676I
Xilinx Inc.

IC FPGA 502 I/O 676FBGA

  • Number of LABs/CLBs: 2816
  • Number of Logic Elements/Cells: 25344
  • Total RAM Bits: 589824
  • Number of I/O: 502
  • Number of Gates: 1400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
패키지: 676-BGA
재고4,000
25344
589824
502
1400000
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BGA
676-FBGA (27x27)
hot XC2VP2-6FG456C
Xilinx Inc.

IC FPGA 156 I/O 456FBGA

  • Number of LABs/CLBs: 352
  • Number of Logic Elements/Cells: 3168
  • Total RAM Bits: 221184
  • Number of I/O: 156
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고6,432
3168
221184
156
-
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XC2VP2-5FG456I
Xilinx Inc.

IC FPGA 156 I/O 456FGBGA

  • Number of LABs/CLBs: 352
  • Number of Logic Elements/Cells: 3168
  • Total RAM Bits: 221184
  • Number of I/O: 156
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고3,616
3168
221184
156
-
1.425 V ~ 1.575 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
XC2VP2-6FGG456C
Xilinx Inc.

IC FPGA 156 I/O 456FGBGA

  • Number of LABs/CLBs: 352
  • Number of Logic Elements/Cells: 3168
  • Total RAM Bits: 221184
  • Number of I/O: 156
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고4,512
3168
221184
156
-
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)