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Xilinx Inc. 제품

기록 7,167
페이지  129/256
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XC1765ELSOG8C
Xilinx Inc.

IC PROM SERIAL 65K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 65kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
패키지: 8-SOIC (0.154", 3.90mm Width)
재고3,552
XC1736ESO8I
Xilinx Inc.

IC PROM SER I-TEMP 36K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 36kb
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
패키지: 8-SOIC (0.154", 3.90mm Width)
재고6,096
XC7K410T-1FF676C
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 31775
  • Number of Logic Elements/Cells: 406720
  • Total RAM Bits: 29306880
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고7,776
XC5VSX35T-1FFG665CES
Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

  • Number of LABs/CLBs: 2720
  • Number of Logic Elements/Cells: 34816
  • Total RAM Bits: 3096576
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 665-BBGA, FCBGA
  • Supplier Device Package: 665-FCBGA (27x27)
패키지: 665-BBGA, FCBGA
재고2,240
hot XCV1600E-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 404
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고8,676
XC4036XL-3HQ160I
Xilinx Inc.

IC FPGA 129 I/O 160HQFP

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 129
  • Number of Gates: 36000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 160-BQFP Exposed Pad
  • Supplier Device Package: 160-PQFP (28x28)
패키지: 160-BQFP Exposed Pad
재고3,120
XC4036XL-3BG432I
Xilinx Inc.

IC FPGA 288 I/O 432MBGA

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 288
  • Number of Gates: 36000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고4,240
XC4028XL-3HQ304I
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

  • Number of LABs/CLBs: 1024
  • Number of Logic Elements/Cells: 2432
  • Total RAM Bits: 32768
  • Number of I/O: 256
  • Number of Gates: 28000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 304-BFQFP Exposed Pad
  • Supplier Device Package: 304-PQFP (40x40)
패키지: 304-BFQFP Exposed Pad
재고7,856
XC4025E-4PG299C
Xilinx Inc.

IC FPGA 256 I/O 299CPGA

  • Number of LABs/CLBs: 1024
  • Number of Logic Elements/Cells: 2432
  • Total RAM Bits: 32768
  • Number of I/O: 256
  • Number of Gates: 25000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Through Hole
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 299-BCPGA
  • Supplier Device Package: 299-CPGA (52.3x52.3)
패키지: 299-BCPGA
재고3,568
hot XC4020XL-1HT144I
Xilinx Inc.

IC FPGA 113 I/O 144HQFP

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 113
  • Number of Gates: 20000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP Exposed Pad
재고8,496
hot XC4013XL-3PQ240C
Xilinx Inc.

IC FPGA 192 I/O 240QFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 192
  • Number of Gates: 13000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP
재고5,152
XC7V2000T-1FHG1761C
Xilinx Inc.

IC FPGA 850 I/O 1761FCBGA

  • Number of LABs/CLBs: 152700
  • Number of Logic Elements/Cells: 1954560
  • Total RAM Bits: 47628288
  • Number of I/O: 850
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1761-FCBGA (45x45)
패키지: 1760-BBGA, FCBGA
재고2,848
hot XC5VFX130T-1FFG1738C
Xilinx Inc.

IC FPGA 840 I/O 1738FCBGA

  • Number of LABs/CLBs: 10240
  • Number of Logic Elements/Cells: 131072
  • Total RAM Bits: 10985472
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1738-BBGA, FCBGA
  • Supplier Device Package: 1738-FCBGA (42.5x42.5)
패키지: 1738-BBGA, FCBGA
재고4,192
XC2VP50-6FF1148I
Xilinx Inc.

IC FPGA 812 I/O 1148FBGA

  • Number of LABs/CLBs: 5904
  • Number of Logic Elements/Cells: 53136
  • Total RAM Bits: 4276224
  • Number of I/O: 812
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1148-BBGA, FCBGA
  • Supplier Device Package: 1148-FCPBGA (35x35)
패키지: 1148-BBGA, FCBGA
재고6,016
hot XC4VLX60-10FF1148I
Xilinx Inc.

IC FPGA 640 I/O 1148FCBGA

  • Number of LABs/CLBs: 6656
  • Number of Logic Elements/Cells: 59904
  • Total RAM Bits: 2949120
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1148-BBGA, FCBGA
  • Supplier Device Package: 1148-FCPBGA (35x35)
패키지: 1148-BBGA, FCBGA
재고4,096
hot XC6VLX130T-1FFG784C
Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

  • Number of LABs/CLBs: 10000
  • Number of Logic Elements/Cells: 128000
  • Total RAM Bits: 9732096
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (29x29)
패키지: 784-BBGA, FCBGA
재고10,896
hot XC6SLX100T-2FGG900I
Xilinx Inc.

IC FPGA 498 I/O 900FBGA

  • Number of LABs/CLBs: 7911
  • Number of Logic Elements/Cells: 101261
  • Total RAM Bits: 4939776
  • Number of I/O: 498
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
패키지: 900-BBGA
재고14,400
XC6SLX75-N3FGG676C
Xilinx Inc.

IC FPGA 408 I/O 676FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 408
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
패키지: 676-BGA
재고3,840
XC7A35T-L2CPG236E
Xilinx Inc.

IC FPGA ARTIX7 106 I/O 236BGA

  • Number of LABs/CLBs: 2600
  • Number of Logic Elements/Cells: 33208
  • Total RAM Bits: 1843200
  • Number of I/O: 106
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 238-LFBGA, CSPBGA
  • Supplier Device Package: 236-CSBGA (10x10)
패키지: 238-LFBGA, CSPBGA
재고6,368
XC7A15T-1CSG324I
Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

  • Number of LABs/CLBs: 1300
  • Number of Logic Elements/Cells: 16640
  • Total RAM Bits: 921600
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
패키지: 324-LFBGA, CSPBGA
재고2,256
hot XC9536XL-10PCG44I
Xilinx Inc.

IC CPLD 36MC 10NS 44PLCC

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 36
  • Number of Gates: 800
  • Number of I/O: 34
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
패키지: 44-LCC (J-Lead)
재고5,376
XC95288-20BG352C
Xilinx Inc.

IC CPLD 288MC 20NS 352BGA

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 20.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 288
  • Number of Gates: 6400
  • Number of I/O: 192
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
패키지: 352-LBGA, Metal
재고2,016
hot XCR3256XL-10CS280C
Xilinx Inc.

IC CPLD 256MC 9NS 280CSP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.1ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 164
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 280-TFBGA, CSPBGA
  • Supplier Device Package: 280-CSBGA (16x16)
패키지: 280-TFBGA, CSPBGA
재고38,568
hot XCR3256XL-12FT256I
Xilinx Inc.

IC CPLD 256MC 10.8NS 256BGA

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 10.8ns
  • Voltage Supply - Internal: 2.7 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 164
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고19,320
XC7S50-L1CSGA324I
Xilinx Inc.

XC7S50-L1CSGA324I

  • Number of LABs/CLBs: 4075
  • Number of Logic Elements/Cells: 52160
  • Total RAM Bits: 2764800
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 0.92 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA
  • Supplier Device Package: 324-FPGA (15x15)
패키지: 324-LFBGA
재고6,228
XCVU13P-3FHGC2104E
Xilinx Inc.

XCVU13P-3FHGC2104E

  • Number of LABs/CLBs: 216000
  • Number of Logic Elements/Cells: 3780000
  • Total RAM Bits: 514867200
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 0.873 V ~ 0.927 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (52.5x52.5)
패키지: 2104-BBGA, FCBGA
재고2,880
XCVU125-H1FLVB2104E
Xilinx Inc.

IC FPGA VIRTEX-U 2104FCBGA

  • Number of LABs/CLBs: 89520
  • Number of Logic Elements/Cells: 1566600
  • Total RAM Bits: 90726400
  • Number of I/O: 702
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 1.030 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
패키지: 2104-BBGA, FCBGA
재고7,840
XCKU13P-L1FFVE900I
Xilinx Inc.

XCKU13P-L1FFVE900I

  • Number of LABs/CLBs: 42660
  • Number of Logic Elements/Cells: 746550
  • Total RAM Bits: 70656000
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
패키지: 900-BBGA, FCBGA
재고6,848