페이지 40 - Intel 제품 | Heisener Electronics
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Intel 제품

기록 9,824
페이지  40/351
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EPF10K50EQC208-2N
Intel

IC FPGA 147 I/O 208QFP

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 40960
  • Number of I/O: 147
  • Number of Gates: 199000
  • Voltage - Supply: 2.3 V ~ 2.7 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
패키지: 208-BFQFP
재고6,576
EPF10K50EFC484-2
Intel

IC FPGA 220 I/O 484FBGA

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 40960
  • Number of I/O: 220
  • Number of Gates: 199000
  • Voltage - Supply: 2.3 V ~ 2.7 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고3,872
EP20K200CF484I8
Intel

IC FPGA 376 I/O 484FBGA

  • Number of LABs/CLBs: 832
  • Number of Logic Elements/Cells: 8320
  • Total RAM Bits: 106496
  • Number of I/O: 376
  • Number of Gates: 526000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고2,976
EPF10K10ATC144-2N
Intel

IC FPGA 102 I/O 144TQFP

  • Number of LABs/CLBs: 72
  • Number of Logic Elements/Cells: 576
  • Total RAM Bits: 6144
  • Number of I/O: 102
  • Number of Gates: 31000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고7,872
EP4CGX110DF27C8N
Intel

IC FPGA 393 I/O 672FBGA

  • Number of LABs/CLBs: 6839
  • Number of Logic Elements/Cells: 109424
  • Total RAM Bits: 5621760
  • Number of I/O: 393
  • Number of Gates: -
  • Voltage - Supply: 1.16 V ~ 1.24 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BGA
  • Supplier Device Package: 672-FBGA (27x27)
패키지: 672-BGA
재고7,168
5SGXEB5R2F43C3N
Intel

IC FPGA 600 I/O 1760FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 48927744
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
패키지: 1760-BBGA, FCBGA
재고7,696
10AX057N2F40E1HG
Intel

IC FPGA 588 I/O 1517FCBGA

  • Number of LABs/CLBs: 217080
  • Number of Logic Elements/Cells: 570000
  • Total RAM Bits: 42082304
  • Number of I/O: 588
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: 1517-BBGA, FCBGA
재고2,272
5AGXFB3H4F40I5
Intel

IC FPGA 704 I/O 1517FBGA

  • Number of LABs/CLBs: 17110
  • Number of Logic Elements/Cells: 362000
  • Total RAM Bits: 19822592
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: 1517-BBGA
재고3,152
5AGXFB1H4F40C4N
Intel

IC FPGA 704 I/O 1517FBGA

  • Number of LABs/CLBs: 14151
  • Number of Logic Elements/Cells: 300000
  • Total RAM Bits: 17358848
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: 1517-BBGA
재고4,976
EP2AGX65DF29C5G
Intel

IC FPGA 364 I/O 780FBGA

  • Number of LABs/CLBs: 2530
  • Number of Logic Elements/Cells: 60214
  • Total RAM Bits: 5371904
  • Number of I/O: 364
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
패키지: 780-BBGA, FCBGA
재고5,376
EP2S15F484C3N
Intel

IC FPGA 342 I/O 484FBGA

  • Number of LABs/CLBs: 780
  • Number of Logic Elements/Cells: 15600
  • Total RAM Bits: 419328
  • Number of I/O: 342
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고4,800
hot EP1AGX20CF484C6
Intel

IC FPGA 230 I/O 484FBGA

  • Number of LABs/CLBs: 1079
  • Number of Logic Elements/Cells: 21580
  • Total RAM Bits: 1229184
  • Number of I/O: 230
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고6,204
EP2C35U484C6
Intel

IC FPGA 322 I/O 484UBGA

  • Number of LABs/CLBs: 2076
  • Number of Logic Elements/Cells: 33216
  • Total RAM Bits: 483840
  • Number of I/O: 322
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-FBGA
  • Supplier Device Package: 484-UBGA (19x19)
패키지: 484-FBGA
재고7,664
hot EP1C12F256C7N
Intel

IC FPGA 185 I/O 256FBGA

  • Number of LABs/CLBs: 1206
  • Number of Logic Elements/Cells: 12060
  • Total RAM Bits: 239616
  • Number of I/O: 185
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고6,640
10M25SCE144A7G
Intel

IC FPGA 101 I/O 144EQFP

  • Number of LABs/CLBs: 1563
  • Number of Logic Elements/Cells: 25000
  • Total RAM Bits: 691200
  • Number of I/O: 101
  • Number of Gates: -
  • Voltage - Supply: 2.85 V ~ 3.465 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-EQFP (20x20)
패키지: 144-LQFP Exposed Pad
재고4,336
EP4CE22E22C7N
Intel

IC FPGA 79 I/O 144EQFP

  • Number of LABs/CLBs: 1395
  • Number of Logic Elements/Cells: 22320
  • Total RAM Bits: 608256
  • Number of I/O: 79
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-EQFP (20x20)
패키지: 144-LQFP Exposed Pad
재고7,716
hot EPM7256AEFI256-7
Intel

IC CPLD 256MC 7.5NS 256FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 5000
  • Number of I/O: 164
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고5,040
5SGXEABN1F45C2G
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
패키지: -
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1SG110HN2F43I2LG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 137500
  • Number of Logic Elements/Cells: 1100000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
패키지: -
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AGIB027R31B3E3E
Intel

IC FPGA AGILEX-I 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
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5SGXAF40NAB
Intel

IC FPGA 1517FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 38797312
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: Surface Mount
  • Operating Temperature: -
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: -
Request a Quote
RK80546KG1122MM
Intel

IC MPU INTEL XEON 3.8GHZ 604PPGA

  • Core Processor: Intel® Xeon® Processor
  • Number of Cores/Bus Width: 1 Core, 64-Bit
  • Speed: 3.8GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.2875V, 1.3875V
  • Operating Temperature: 73°C (TC)
  • Security Features: -
  • Package / Case: 604-PGA
  • Supplier Device Package: 604-PPGA (42.5x42.5)
패키지: -
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1SG280HU2F50I2LG
Intel

IC FPGA 704 I/O 2397BGA

  • Number of LABs/CLBs: 350000
  • Number of Logic Elements/Cells: 2800000
  • Total RAM Bits: -
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
패키지: -
Request a Quote
5SGXEA5N3F40C2LG
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
패키지: -
Request a Quote
5SGXEA5H2F35C3G
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
패키지: -
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5SGXMA7N2F45I3G
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
패키지: -
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AGIA040R39A1I2V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 4.047M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3948-BFBGA Exposed Pad
  • Supplier Device Package: 3948-BGA (56x56)
패키지: -
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AGFA023R24C3E4X
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
패키지: -
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