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제조업체 |
설명 |
패키지 |
재고 |
수량 |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16QFN
|
패키지: 16-WFQFN Exposed Pad |
재고3,872 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 32LQFP
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고7,632 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 2:10 700MHZ 32LQFP
|
패키지: 32-LQFP Exposed Pad |
재고4,896 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 700MHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-LQFP Exposed Pad | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:1 1GHz
|
패키지: 16-WFQFN Exposed Pad |
재고5,824 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, Sine Wave, TTL | PECL | 1GHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:3 40MHZ
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고5,184 |
|
1 | 1:3 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 1GHZ
|
패키지: 16-WFQFN Exposed Pad |
재고2,224 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, Sine Wave, TTL | PECL | 1GHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 235MHZ 20TSSOP
|
패키지: 20-TSSOP (0.173", 4.40mm Width) |
재고2,496 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 235MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고2,304 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 3:4 266MHZ 16QFN
|
패키지: 16-VFQFN Exposed Pad |
재고2,032 |
|
1 | 3:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3.5x3) |
||
Microchip Technology |
IC CLK BUFFER 3:4 266MHZ 20TSSOP
|
패키지: 20-TSSOP (0.173", 4.40mm Width) |
재고10,764 |
|
1 | 3:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고41,520 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 8TSSOP
|
패키지: 8-TSSOP (0.173", 4.40mm Width) |
재고2,864 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 8TSSOP
|
패키지: 8-TSSOP (0.173", 4.40mm Width) |
재고6,528 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:6 40MHZ 16TSSOP
|
패키지: 16-TSSOP (0.173", 4.40mm Width) |
재고5,424 |
|
1 | 1:6 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 40MHZ 16QFN
|
패키지: 16-WFQFN Exposed Pad |
재고6,576 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 40MHZ 16QFN
|
패키지: 16-WFQFN Exposed Pad |
재고6,848 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 40MHZ 16TSSOP
|
패키지: 16-TSSOP (0.173", 4.40mm Width) |
재고5,040 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 40MHZ 6DFN
|
패키지: 6-UFDFN Exposed Pad |
재고4,448 |
|
1 | 1:2 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고5,664 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16QFN
|
패키지: - |
재고5,088 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16QFN
|
패키지: - |
재고2,032 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16TSSOP
|
패키지: - |
재고5,760 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16TSSOP
|
패키지: - |
재고4,400 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:1 266MHZ 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고5,456 |
|
1 | 1:1 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER LVCMOS 33QFN
|
패키지: - |
재고7,264 |
|
1 | 1:1 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 8TSSOP
|
패키지: 8-TSSOP (0.173", 4.40mm Width) |
재고5,584 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:9 700MHZ 32LQFP
|
패키지: 32-LQFP Exposed Pad |
재고7,728 |
|
1 | 2:9 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 700MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 32-LQFP Exposed Pad | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:10 700MHZ 32LQFP
|
패키지: 32-LQFP Exposed Pad |
재고5,376 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 700MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 32-LQFP Exposed Pad | 32-LQFP (7x7) |